NXP Products

MRF21010LSR1

NXP

FET RF 65V 2.17GHZ NI-360S

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 13.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 10W
• Voltage - Rated: 65V
• Package / Case: NI-360S
• Supplier Device Package: NI-360 Short Lead

Package: NI-360S

MRF6VP121KHR5

NXP

FET RF 2CH 110V 1.03GHZ NI1230H

• Transistor Type: LDMOS (Dual)
• Frequency: 1.03GHz
• Gain: 20dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 150mA
• Power - Output: 1000W
• Voltage - Rated: 110V
• Package / Case: NI-1230
• Supplier Device Package: NI-1230

Package: NI-1230

BC557B,112

NXP

TRANS PNP 45V 0.1A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
• Current - Collector Cutoff (Max): 15nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
• Power - Max: 500mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

Package: TO-226-3, TO-92-3 (TO-226AA)

TZA3047BVH/C1,557

NXP

IC LASER DRIVER 1.25GBPS 32-HBCC

• Type: Laser Diode Driver (Fiber Optic)
• Data Rate: 1.25Gbps
• Number of Channels: 1
• Voltage - Supply: 3.14 V ~ 3.47 V
• Current - Supply: 40mA
• Current - Modulation: 100mA
• Current - Bias: 100mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-HBCC
• Supplier Device Package: 32-HBCC (5x5)
• Mounting Type: Surface Mount

Package: 32-HBCC

MCZ33285EF

NXP

IC TMOS DRIVER DUAL HISIDE 8SOIC

• Driven Configuration: High-Side
• Channel Type: Synchronous
• Number of Drivers: 2
• Gate Type: N-Channel MOSFET
• Voltage - Supply: 7 V ~ 40 V
• Logic Voltage - VIL, VIH: 0.7V, 1.7V
• Current - Peak Output (Source, Sink): -
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

MC32BC3770CSR2

NXP

IC BATT CHARGER LI-ION 25WLCSP

• Battery Chemistry: Lithium-Ion/Polymer
• Number of Cells: 1
• Current - Charging: Constant - Programmable
• Programmable Features: Current
• Fault Protection: -
• Charge Current - Max: 2A
• Battery Pack Voltage: 4.475V (Max)
• Voltage - Supply (Max): 6.2V
• Interface: I2C
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 25-WFBGA, WLCSP
• Supplier Device Package: 25-WLCSP (2.27x2.17)

Package: 25-WFBGA, WLCSP

N74F20N,602

NXP

IC GATE NAND 2CH 4-INP 14-DIP

• Logic Type: NAND Gate
• Number of Circuits: 2
• Number of Inputs: 4
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 1mA, 20mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

Package: 14-DIP (0.300", 7.62mm)

N74F74N,602

NXP

IC D-TYPE POS TRG DUAL 14DIP

• Function: Set(Preset) and Reset
• Type: D-Type
• Output Type: Differential
• Number of Elements: 2
• Number of Bits per Element: 1
• Clock Frequency: 125MHz
• Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 1mA, 20mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 16mA
• Input Capacitance: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)

Package: 14-DIP (0.300", 7.62mm)

HEF4516BP,652

NXP

IC BINARY COUNTER UP/DOWN 16DIP

• Logic Type: Binary Counter
• Direction: Up, Down
• Number of Elements: 1
• Number of Bits per Element: 4
• Reset: Asynchronous
• Timing: Synchronous
• Count Rate: 18MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

Package: 16-DIP (0.300", 7.62mm)

74HC652N,112

NXP

IC TXRX NON-INV 3-ST 8BIT 24DIP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.600", 15.24mm)
• Supplier Device Package: 24-DIP

Package: 24-DIP (0.600", 15.24mm)

SC26C92A1N,112

NXP

IC UART 40-DIP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: 8 Byte
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Through Hole
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-DIP

Package: 40-DIP (0.600", 15.24mm)

SC16C650AIA44,529

NXP

IC UART SINGLE W/FIFO 44-PLCC

• Features: -
• Number of Channels: 1, UART
• FIFO's: 32 Byte
• Protocol: -
• Data Rate (Max): 3Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

Package: 44-LCC (J-Lead)

LS1024ASE7JLA

NXP

IC PROCESSOR DUAL CORE

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: Secure Boot, TrustZone?
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

Package: 625-BFBGA, FCBGA

MCF54450VM240J

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

• Core Processor: Coldfire V4
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: 132
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

Package: 256-LBGA

SVF532R3K1CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
• Peripherals: LCD, SAI
• Number of I/O: 136
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-MAPBGA (17x17)

Package: 364-LFBGA

MK20DN512ZAB10R

NXP

IC MCU 32BIT 512KB FLASH 120CSP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 120-UFBGA, WLCSP
• Supplier Device Package: 120-WLCSP (5.29x5.28)

Package: 120-UFBGA, WLCSP

MC9S12XHZ256VAG

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 117
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Package: 144-LQFP

MC908QT4ACDWE

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

Package: 8-SOIC (0.209", 5.30mm Width)

MCF52254AF80

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, Ethernet, I2C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

Package: 100-LQFP

SAF7730HV/N336,518

NXP

IC HD RADIO PROCESSOR 144HLQFP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-HLQFP (20x20)

Package: 144-LQFP Exposed Pad

MPXV7007GC6T1

NXP

PRESSURE SENSOR AXIAL PORT 8-SOP

• Pressure Type: Compound
• Operating Pressure: ±1.02 PSI (±7 kPa)
• Output Type: Analog Voltage
• Output: 0.5 V ~ 4.5 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: ±10.88 PSI (±75 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD, Gull Wing, Top Port
• Supplier Device Package: -

Package: 8-SMD, Gull Wing, Top Port

MC33696FJAE

NXP

IC RF TXRX ISM<1GHZ 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: General ISM < 1GHz
• Protocol: -
• Modulation: FSK, OOK
• Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
• Data Rate (Max): 22.6kbps
• Power - Output: 7.25dBm
• Sensitivity: -106.5dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: -
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 10.3mA ~ 24mA
• Current - Transmitting: 6.1mA ~ 13.5mA
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad

Package: 32-VFQFN Exposed Pad

BGA2714,115

NXP

IC MMIC WIDEBAND AMPLIFER 6TSSOP

• Frequency: 2.7GHz
• P1dB: -7.9dBm (0.2mW)
• Gain: 22dB
• Noise Figure: 2.2dB
• RF Type: -
• Voltage - Supply: 4V
• Current - Supply: 10mA
• Test Frequency: 950MHz
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

Package: 6-TSSOP, SC-88, SOT-363

MC35FS6510CAE

NXP

FS6500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

Package: 48-LQFP Exposed Pad

SPC5748CTK1VMJ6

NXP

NXP 32-BIT MCU 6MB FLASH 160MH

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

Package: 256-LBGA

S912XEQ384BMALR

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP

FS32K144MST0MLHR

NXP

S32K144 32-BIT MCU ARM CORTEX-M

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

Package: 64-LQFP

MC33FS4505CAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

Package: -

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FX32K142UAT0VLLR

NXP

S32K142 ARM CORTEX-M4F, 112 MHZ,

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

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MC33FS6518NAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

Package: -

Request a Quote