Industry Trends

Post on July 23, 2024

July 23, 2024 — On Semiconductor announced yesterday that it has been selected as a primary supplier for the main traction inverters of Volkswagen's Scalable Systems Platform (SSP). On Semiconductor will provide a comprehensive power module solution based on its advanced SiC (silicon carbide) technology for this platform. The SSP, Volkswagen's unified electric vehicle platform designed for 80% of its next-generation vehicles, is slated for release in 2026.

Post on July 19, 2024

In a bid to reduce reliance on Asia and enhance chip packaging capabilities within the Americas, the U.S. government has launched an initiative aimed at strengthening Latin American chip packaging capacities. Notably, Intel already operates an assembly, testing, and packaging plant in San Jose, Costa Rica. However, it remains unclear if Intel will benefit from the new initiative.

Post on July 18, 2024

July 17, 2024 – According to a blog post by Korean media outlet Bloter on July 15, Samsung plans to incorporate silicon capacitors in its upcoming Exynos 2500 chip. Silicon capacitors, typically constructed with a three-layer structure (Metal/Insulator/Metal, MIM), are ultra-thin and exhibit characteristics similar to semiconductors. This enables them to maintain stable voltages and better manage current fluctuations, making them highly suitable for integrated circuits.

Post on July 16, 2024

July 12, 2024 - Riverside, California - Bourns, a leading global supplier of electronic components for power, protection, and sensing solutions, proudly announces the launch of its SSD Digital Series current sensors.

Post on July 12, 2024

The rising consumer demand, increasing environmental awareness, and expanding range of available options are driving the adoption of electric vehicles (EVs). A recent study by Goldman Sachs reveals that by 2023, EV sales will account for 10% of global vehicle sales, projected to grow to 30% by 2030, and potentially reach 50% by 2035. However, "range anxiety," or the fear that an EV's battery will not last long enough on a single charge, remains a significant barrier to widespread adoption. Extending vehicle range without significantly increasing costs is crucial

Post on July 11, 2024

Rohm has unveiled a series of 16-bit microcontrollers designed for power supplies with hybrid analog-digital control loops, accompanied by evaluation boards with software. "In recent years, medium-power power supplies have been required to provide reliability and precise control that are difficult to achieve with analog configuration alone," Rohm stated. "On the other hand, fully digital controlled power supplies offer fine control and settings but are not widely adopted in the medium and small power range due to the high power consumption and cost of digital controllers."

Post on July 9, 2024

After a challenging 2023, the global semiconductor industry is finally showing signs of recovery in the first half of 2024. As market demand rebounds, major wafer fabs are ramping up capital expenditures and expanding their capacities to prepare for a new growth peak.

Post on July 6, 2024

On July 5, the source Moore's Law Is Dead revealed that AMD will release Zen 6 architecture chips in the second quarter of 2025, using TSMC's N3E process. Mass production will start before the end of 2025 at the earliest, but it is not ruled out that it may be postponed to 2026.

Post on July 4, 2024

On July 1, according to foreign media reports, the United States has previously announced that it will impose new export controls on technologies such as EDA software necessary for designing GAAFET (all-gate field effect transistor) structure integrated circuits.

Post on July 2, 2024

Cadence Electronics (USA) recently announced the expansion of its system IP portfolio with the addition of Cadence® Janus™ Network-on-Chip (NoC). As today's computing needs continue to increase, larger and more complex system-on-chips (SoCs) and disaggregated multi-chip systems are rapidly gaining popularity in the market, and data transmission within and between silicon components has become increasingly challenging, affecting power, performance and area (PPA).