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Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50µin (1.27µm)
- Contact Material - Mating: Beryllium Nickel
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Beryllium Nickel
- Housing Material: Polyetheretherketone (PEEK), Glass Filled
- Operating Temperature: -55°C ~ 250°C
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Package: - |
Stock6,192 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,874 |
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Aries Electronics |
CONN SOCKET PGA ZIF GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): -
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Bronze
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -65°C ~ 200°C
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Package: - |
Stock3,834 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50µin (1.27µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock5,112 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 44 (2 x 22)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50µin (1.27µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,006 |
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Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 44 (2 x 22)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock5,346 |
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Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,554 |
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Aries Electronics |
CONN SOCKET SIP 32POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 32 (1 x 32)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock4,554 |
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Aries Electronics |
CONN SOCKET SIP 35POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 35 (1 x 35)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Elevated
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock8,208 |
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Aries Electronics |
CONN IC DIP SOCKET 30POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 30 (2 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock5,238 |
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Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock7,920 |
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Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,816 |
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Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole, Right Angle, Vertical
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -
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Package: - |
Stock4,230 |
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Aries Electronics |
CONN SOCKET SIP 36POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 36 (1 x 36)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,820 |
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Aries Electronics |
CONN SOCKET SIP 40POS TIN
- Type: SIP
- Number of Positions or Pins (Grid): 40 (1 x 40)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 50µin (1.27µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 50µin (1.27µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 105°C
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Package: - |
Stock3,204 |
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Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Package: - |
Stock7,668 |
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Aries Electronics |
CONN SOCKET SIP 29POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 29 (1 x 29)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,622 |
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Aries Electronics |
CONN SOCKET SIP 24POS GOLD
- Type: SIP
- Number of Positions or Pins (Grid): 24 (1 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock3,580 |
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Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid): 6 (2 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock7,362 |
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Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature: -
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Package: - |
Stock8,352 |
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Aries Electronics |
SOCKET ADAPTER DIP TO 28SOIC
- Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Convert To (Adapter End): SOIC
- Number of Pins: 28
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Mounting Type: Surface Mount
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Board Material: -
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Package: - |
Stock2,556 |
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Aries Electronics |
SOCKET ADAPTER PLCC TO 32DIP 0.6
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 32
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock7,200 |
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Aries Electronics |
SOCKET ADAPTER SOIC TO 32DIP 0.6
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 32
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock4,914 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Forked
- Number of Positions: 30
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.600" (15.24mm)
- Mounting Type: Through Hole
- Termination: Wire Wrap
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock2,970 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Forked
- Number of Positions: 48
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.600" (15.24mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock8,802 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Post
- Number of Positions: 64
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.900" (22.86mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Tin
- Contact Finish Thickness: 200µin (5.08µm)
- Color: Black
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Package: - |
Stock4,446 |
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Aries Electronics |
625 DIP HDR SCRW MACH CONTACT
- Connector Type: DIP, DIL - Header
- Contact Type: Solder Cup
- Number of Positions: 30
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.300" (7.62mm)
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 10µin (0.25µm)
- Color: Black
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Package: - |
Stock4,230 |
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Aries Electronics |
.65" COVER 16 PIN
- Accessory Type: Cap (Cover)
- Number of Positions: 16
- For Use With/Related Products: 0600 Series Header
- Features: -
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Package: - |
Stock25,182 |
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