Bourns Inc. Products - Chip Resistor - Surface Mount

RES SMD 24.9 OHM 1% 2W 2512

• Resistance: 24.9 Ohms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 24 OHM 1% 2W 2512

• Resistance: 24 Ohms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 2.2K OHM 1% 2W 2512

• Resistance: 2.2 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 200K OHM 1% 2W 2512

• Resistance: 200 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 20K OHM 1% 2W 2512

• Resistance: 20 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1.91K OHM 1% 2W 2512

• Resistance: 1.91 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1.5K OHM 1% 2W 2512

• Resistance: 1.5 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 150 OHM 1% 2W 2512

• Resistance: 150 Ohms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 130 OHM 1% 2W 2512

• Resistance: 130 Ohms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 1.13K OHM 1% 2W 2512

• Resistance: 1.13 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 10K OHM 1% 2W 2512

• Resistance: 10 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.248" L x 0.122" W (6.30mm x 3.10mm)
• Height - Seated (Max): 0.031" (0.80mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 0.91 OHM 5% 1/2W 2010

• Resistance: 910 mOhms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 0.82 OHM 5% 1/2W 2010

• Resistance: 820 mOhms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 0.75 OHM 5% 1/2W 2010

• Resistance: 750 mOhms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 0.68 OHM 5% 1/2W 2010

• Resistance: 680 mOhms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 0.62 OHM 5% 1/2W 2010

• Resistance: 620 mOhms
• Tolerance: ±5%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 9.1 OHM 1% 1/2W 2010

• Resistance: 9.1 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 8.2 OHM 1% 1/2W 2010

• Resistance: 8.2 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 7.5 OHM 1% 1/2W 2010

• Resistance: 7.5 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 6.8 OHM 1% 1/2W 2010

• Resistance: 6.8 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 6.2 OHM 1% 1/2W 2010

• Resistance: 6.2 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 5.6 OHM 1% 1/2W 2010

• Resistance: 5.6 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 5.1 OHM 1% 1/2W 2010

• Resistance: 5.1 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 4.7 OHM 1% 1/2W 2010

• Resistance: 4.7 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 4.3 OHM 1% 1/2W 2010

• Resistance: 4.3 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.9 OHM 1% 1/2W 2010

• Resistance: 3.9 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.6 OHM 1% 1/2W 2010

• Resistance: 3.6 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

RES SMD 3.3 OHM 1% 1/2W 2010

• Resistance: 3.3 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -