Page 104 - Sockets for ICs, Transistors | Connectors, Interconnects

9-1437504-6
TE Connectivity AMP Connectors

TRANSISTOR SOCKET

Package: -

Stock3,402
2-210735-5
TE Connectivity AMP Connectors

CONN SOCKET SIP 25POS TIN-LEAD

Package: -

Stock4,590
145-PLS15024-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

Package: -

Stock7,542
40-3573-11
Aries Electronics

CONN IC DIP SOCKET ZIF 40POS GLD

Package: -

Stock8,532
32-C300-31
Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

Package: -

Stock3,400
48-6823-90C
Aries Electronics

CONN IC DIP SOCKET 48POS GOLD

Package: -

Stock7,650
34-6501-31
Aries Electronics

CONN IC DIP SOCKET 34POS GOLD

Package: -

Stock5,040
346-43-160-41-013000
Mill-Max Manufacturing Corp.

CONN SOCKET SIP 60POS GOLD

Package: -

Stock5,598
28-0508-30
Aries Electronics

CONN SOCKET SIP 28POS GOLD

Package: -

Stock2,448
16-81100-310C
Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock3,418
10-0501-31
Aries Electronics

CONN SOCKET SIP 10POS GOLD

Package: -

Stock7,074
104-13-304-41-780000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 4POS GOLD

Package: -

Stock4,464
02-7400-11
Aries Electronics

CONN SOCKET SIP 2POS GOLD

Package: -

Stock5,040
612-83-952-41-001101
Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

Package: -

Stock7,668
APA-318-T-C
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock2,934
110-83-640-41-005101
Preci-Dip

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock2,520
114-87-624-41-134161
Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock3,906
231-52
CNC Tech

CONN SOCKET PLCC 52POS GOLD

Package: -

Stock3,150
115-83-314-41-001101
Preci-Dip

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock2,790
AW 127-11/Z-T
Assmann WSW Components

SOCKET 11 CONTACTS SINGLE ROW

Package: -

Stock2,088

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
9-1437504-6	TE Connectivity AMP Connectors	TRANSISTOR SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock3,402	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-210735-5	TE Connectivity AMP Connectors	CONN SOCKET SIP 25POS TIN-LEAD Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock4,590	25 (1 x 25)	0.100" (2.54mm)	Tin-Lead	-	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin-Lead	-	-	Thermoplastic	-
145-PLS15024-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	Package: -	Stock7,542	-	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
40-3573-11	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock8,532	40 (2 x 20)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
32-C300-31	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,400	32 (2 x 16)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
48-6823-90C	Aries Electronics	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock7,650	48 (2 x 24)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
34-6501-31	Aries Electronics	CONN IC DIP SOCKET 34POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 34 (2 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,040	34 (2 x 17)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
346-43-160-41-013000	Mill-Max Manufacturing Corp.	CONN SOCKET SIP 60POS GOLD Type: SIP Number of Positions or Pins (Grid): 60 (1 x 60) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,598	60 (1 x 60)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
28-0508-30	Aries Electronics	CONN SOCKET SIP 28POS GOLD Type: SIP Number of Positions or Pins (Grid): 28 (1 x 28) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 105°C	Package: -	Stock2,448	28 (1 x 28)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
16-81100-310C	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock3,418	16 (2 x 8)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
10-0501-31	Aries Electronics	CONN SOCKET SIP 10POS GOLD Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,074	10 (1 x 10)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
104-13-304-41-780000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 4POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 4 (2 x 2) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Alloy Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock4,464	4 (2 x 2)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass Alloy	Thermoplastic	-
02-7400-11	Aries Electronics	CONN SOCKET SIP 2POS GOLD Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,040	2 (1 x 2)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
612-83-952-41-001101	Preci-Dip	CONN IC DIP SOCKET 52POS GOLD Type: DIP, 0.9" (22.86mm) Row Spacing Number of Positions or Pins (Grid): 52 (2 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,668	52 (2 x 26)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
APA-318-T-C	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,934	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-83-640-41-005101	Preci-Dip	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,520	40 (2 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-87-624-41-134161	Preci-Dip	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,906	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
231-52	CNC Tech	CONN SOCKET PLCC 52POS GOLD Type: PLCC Number of Positions or Pins (Grid): 52 (4 x 13) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock3,150	52 (4 x 13)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
115-83-314-41-001101	Preci-Dip	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,790	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AW 127-11/Z-T	Assmann WSW Components	SOCKET 11 CONTACTS SINGLE ROW Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,088	-	-	-	-	-	-	-	-	-	-	-	-	-	-
917-87-104-41-005101	Preci-Dip	CONN TRANSIST TO-5 4POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,614	4 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
115-87-306-41-003101	Preci-Dip	CONN IC DIP SOCKET 6POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,938	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
01-0518-10	Aries Electronics	CONN SOCKET SIP 1POS GOLD Type: SIP Number of Positions or Pins (Grid): 1 (1 x 1) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock7,128	1 (1 x 1)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
614-43-308-31-012000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock15,678	8 (2 x 4)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
224-1286-00-0602J	3M	CONN IC DIP SOCKET ZIF 24POS GLD Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Connector Features: Closed Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polysulfone (PSU), Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,072	24 (2 x 12)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
816-AG11D-ESL-LF	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock32,988	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
8428-21B1-RK-TP	3M	CONN SOCKET PLCC 28POS TIN Type: PLCC Number of Positions or Pins (Grid): 28 (4 x 7) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160µin (4.06µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160µin (4.06µm) Contact Material - Post: Copper Alloy Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Operating Temperature: -40°C ~ 105°C	Package: -	Stock15,294	28 (4 x 7)	0.050" (1.27mm)	Tin	160µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
A-CCS 044-Z-SM	Assmann WSW Components	IC SOCKET PLCC 44POS TIN SMD Type: PLCC Number of Positions or Pins (Grid): 44 (4 x 11) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160µin (4.06µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160µin (4.06µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA9T), Nylon 9T, Glass Filled Operating Temperature: -40°C ~ 105°C	Package: -	Stock253,764	44 (4 x 11)	0.050" (1.27mm)	Tin	160µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C