Page 233 - Sockets for ICs, Transistors | Connectors, Interconnects

9-1437520-1
TE Connectivity AMP Connectors

STAMPED PIN

Package: -

Stock8,226
1571539-1
TE Connectivity AMP Connectors

CONN SOCKET PLCC 20POS TIN

Package: -

Stock6,390
100-040-000
3M

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock5,184
2-382568-8
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

Package: -

Stock5,274
C9116-00
Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock3,006
69-PLS13112-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

Package: -

Stock3,744
510-43-168-17-101002
Mill-Max Manufacturing Corp.

CONN SOCKET PGA 168POS GOLD

Package: -

Stock2,412
614-83-132-14-071112
Preci-Dip

CONN SOCKET PGA 132POS GOLD

Package: -

Stock6,084
614-93-652-31-018000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 52POS GOLD

Package: -

Stock5,022
26-3503-20
Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

Package: -

Stock7,650
18-8300-310C
Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

Package: -

Stock8,856
14-81250-310C
Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock3,798
510-83-100-11-001101
Preci-Dip

CONN SOCKET PGA 100POS GOLD

Package: -

Stock8,082
550-80-056-09-041101
Preci-Dip

PGA SOLDER TAIL

Package: -

Stock2,790
20-9513-11
Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock4,050
36-1518-11
Aries Electronics

CONN IC DIP SOCKET 36POS GOLD

Package: -

Stock3,294
110-93-640-41-605000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock4,536
510-83-065-10-051101
Preci-Dip

CONN SOCKET PGA 65POS GOLD

Package: -

Stock7,830
40-0518-10H
Aries Electronics

CONN SOCKET SIP 40POS GOLD

Package: -

Stock4,392
510-87-084-13-082101
Preci-Dip

CONN SOCKET PGA 84POS GOLD

Package: -

Stock3,366

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
9-1437520-1	TE Connectivity AMP Connectors	STAMPED PIN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock8,226	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1571539-1	TE Connectivity AMP Connectors	CONN SOCKET PLCC 20POS TIN Type: PLCC Number of Positions or Pins (Grid): 20 (4 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 180µin (4.57µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 180µin (4.57µm) Contact Material - Post: Copper Alloy Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,390	20 (4 x 5)	0.100" (2.54mm)	Tin	180µin (4.57µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	180µin (4.57µm)	Copper Alloy	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 125°C
100-040-000	3M	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	Package: -	Stock5,184	40 (2 x 20)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
2-382568-8	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,274	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
C9116-00	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,006	16 (2 x 8)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
69-PLS13112-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	Package: -	Stock3,744	-	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
510-43-168-17-101002	Mill-Max Manufacturing Corp.	CONN SOCKET PGA 168POS GOLD Type: PGA Number of Positions or Pins (Grid): 168 (17 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,412	168 (17 x 17)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-83-132-14-071112	Preci-Dip	CONN SOCKET PGA 132POS GOLD Type: PGA Number of Positions or Pins (Grid): 132 (14 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,084	132 (14 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-93-652-31-018000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 52POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 52 (2 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,022	52 (2 x 26)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
26-3503-20	Aries Electronics	CONN IC DIP SOCKET 26POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 26 (2 x 13) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock7,650	26 (2 x 13)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-8300-310C	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock8,856	18 (2 x 9)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
14-81250-310C	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock3,798	14 (2 x 7)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
510-83-100-11-001101	Preci-Dip	CONN SOCKET PGA 100POS GOLD Type: PGA Number of Positions or Pins (Grid): 100 (11 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,082	100 (11 x 11)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
550-80-056-09-041101	Preci-Dip	PGA SOLDER TAIL Type: PGA Number of Positions or Pins (Grid): 56 (9 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,790	56 (9 x 9)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
20-9513-11	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.9" (22.86mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock4,050	20 (2 x 10)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
36-1518-11	Aries Electronics	CONN IC DIP SOCKET 36POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock3,294	36 (2 x 18)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-93-640-41-605000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,536	40 (2 x 20)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-83-065-10-051101	Preci-Dip	CONN SOCKET PGA 65POS GOLD Type: PGA Number of Positions or Pins (Grid): 65 (10 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,830	65 (10 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
40-0518-10H	Aries Electronics	CONN SOCKET SIP 40POS GOLD Type: SIP Number of Positions or Pins (Grid): 40 (1 x 40) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock4,392	40 (1 x 40)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
510-87-084-13-082101	Preci-Dip	CONN SOCKET PGA 84POS GOLD Type: PGA Number of Positions or Pins (Grid): 84 (13 x 13) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,366	84 (13 x 13)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
16-3518-10H	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock6,948	16 (2 x 8)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
10-3513-10H	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock3,726	10 (2 x 5)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-83-628-41-105161	Preci-Dip	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,032	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
2-1571551-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,940	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Copper Alloy	Polyester	-55°C ~ 125°C
116-87-428-41-018101	Preci-Dip	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Elevated, Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,492	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
03-0503-20	Aries Electronics	CONN SOCKET SIP 3POS GOLD Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA), Nylon, Glass Filled Operating Temperature: -	Package: -	Stock2,214	3 (1 x 3)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
299-93-308-11-001000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,912	8 (2 x 4)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
1050281001	Molex, LLC	CONN CAM SOCKET 32POS GOLD Type: Camera Socket Number of Positions or Pins (Grid): 32 (4 x 8) Pitch - Mating: 0.035" (0.90mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3µin (0.08µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.035" (0.90mm) Contact Finish - Post: Nickel Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock7,020	32 (4 x 8)	0.035" (0.90mm)	Gold	3µin (0.08µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Nickel	50µin (1.27µm)	Copper Alloy	Thermoplastic	-