Page 252 - Sockets for ICs, Transistors | Connectors, Interconnects

4-1437532-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS

Package: -

Stock6,750
1-1437535-9
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS TIN

Package: -

Stock2,178
20-3540-10
Aries Electronics

COLLET PIN CARRIER 20-PIN .300

Package: -

Stock3,472
42-3574-16
Aries Electronics

CONN IC DIP SOCKET ZIF 42POS TIN

Package: -

Stock6,876
44-6552-11
Aries Electronics

CONN IC DIP SOCKET ZIF 44POS GLD

Package: -

Stock6,660
30-3503-21
Aries Electronics

CONN IC DIP SOCKET 30POS GOLD

Package: -

Stock8,802
48-3575-10
Aries Electronics

CONN IC DIP SOCKET ZIF 48POS TIN

Package: -

Stock5,040
175-PGM16010-10
Aries Electronics

CONN SOCKET PGA GOLD

Package: -

Stock3,582
18-823-90T
Aries Electronics

CONN IC DIP SOCKET 18POS TIN

Package: -

Stock2,466
25-0503-31
Aries Electronics

CONN SOCKET SIP 25POS GOLD

Package: -

Stock4,554
24-6573-10
Aries Electronics

CONN IC DIP SOCKET ZIF 24POS TIN

Package: -

Stock2,268
44-PGM08003-10
Aries Electronics

CONN SOCKET PGA GOLD

Package: -

Stock7,326
D95040-42
Harwin Inc.

CONN IC DIP SOCKET 42POS GOLD

Package: -

Stock8,028
110-83-628-41-801101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock3,852
510-87-085-11-044101
Preci-Dip

CONN SOCKET PGA 85POS GOLD

Package: -

Stock5,040
299-87-318-11-001101
Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

Package: -

Stock2,034
524-AG11D-ESL
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock5,634
04-0511-10
Aries Electronics

CONN SOCKET SIP 4POS TIN

Package: -

Stock4,842
614-83-428-41-001101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock5,184
116-87-322-41-012101
Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

Package: -

Stock8,892

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
4-1437532-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,750	28 (2 x 14)	0.100" (2.54mm)	-	-	-	Through Hole	Closed Frame	-	0.100" (2.54mm)	-	-	-	-	-
1-1437535-9	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 105°C	Package: -	Stock2,178	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	-	-55°C ~ 105°C
20-3540-10	Aries Electronics	COLLET PIN CARRIER 20-PIN .300 Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock3,472	-	-	-	-	-	-	-	-	-	-	-	-	-	-
42-3574-16	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS TIN Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock6,876	42 (2 x 21)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-6552-11	Aries Electronics	CONN IC DIP SOCKET ZIF 44POS GLD Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 44 (2 x 22) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock6,660	44 (2 x 22)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
30-3503-21	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 30 (2 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,802	30 (2 x 15)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
48-3575-10	Aries Electronics	CONN IC DIP SOCKET ZIF 48POS TIN Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock5,040	48 (2 x 24)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
175-PGM16010-10	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock3,582	-	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
18-823-90T	Aries Electronics	CONN IC DIP SOCKET 18POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -	Package: -	Stock2,466	18 (2 x 9)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
25-0503-31	Aries Electronics	CONN SOCKET SIP 25POS GOLD Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA), Nylon, Glass Filled Operating Temperature: -	Package: -	Stock4,554	25 (1 x 25)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
24-6573-10	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS TIN Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock2,268	24 (2 x 12)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
44-PGM08003-10	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock7,326	-	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
D95040-42	Harwin Inc.	CONN IC DIP SOCKET 42POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Elevated, Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.8µin (5.00µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,028	42 (2 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	196.8µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled	-55°C ~ 125°C
110-83-628-41-801101	Preci-Dip	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,852	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
510-87-085-11-044101	Preci-Dip	CONN SOCKET PGA 85POS GOLD Type: PGA Number of Positions or Pins (Grid): 85 (11 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,040	85 (11 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
299-87-318-11-001101	Preci-Dip	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,034	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
524-AG11D-ESL	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 5µin (0.127µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,634	24 (2 x 12)	0.100" (2.54mm)	Gold	5µin (0.127µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
04-0511-10	Aries Electronics	CONN SOCKET SIP 4POS TIN Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50µin (1.27µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock4,842	4 (1 x 4)	0.100" (2.54mm)	Tin	50µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Tin	50µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
614-83-428-41-001101	Preci-Dip	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,184	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-322-41-012101	Preci-Dip	CONN IC DIP SOCKET 22POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Elevated, Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,892	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AW 127-35/Z-T	Assmann WSW Components	SOCKET 35 CONTACTS SINGLE ROW Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,106	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-87-318-41-105101	Preci-Dip	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,482	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
07-0518-11	Aries Electronics	CONN SOCKET SIP 7POS GOLD Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock7,470	7 (1 x 7)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
AW 127-04/Z-T	Assmann WSW Components	SOCKET 4 CONTACTS SINGLE ROW Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,286	-	-	-	-	-	-	-	-	-	-	-	-	-	-
117-43-764-41-005000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 64POS GOLD Type: DIP, 0.75" (19.05mm) Row Spacing Number of Positions or Pins (Grid): 64 (2 x 32) Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,498	64 (2 x 32)	0.070" (1.78mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
111-43-624-41-001000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock9,012	24 (2 x 12)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
540-44-020-17-400000	Mill-Max Manufacturing Corp.	CONN SOCKET PLCC 20POS TIN Type: PLCC Number of Positions or Pins (Grid): 20 (4 x 5) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: - Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: - Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -	Package: -	Stock8,688	20 (4 x 5)	0.050" (1.27mm)	Tin	150µin (3.81µm)	-	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150µin (3.81µm)	-	Polyphenylene Sulfide (PPS)	-
40-0518-10	Aries Electronics	CONN SOCKET SIP 40POS GOLD Type: SIP Number of Positions or Pins (Grid): 40 (1 x 40) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock53,592	40 (1 x 40)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-