Page 361 - Sockets for ICs, Transistors | Connectors, Interconnects

D83084B-46
Harwin Inc.

CONN SOCKET PLCC 84POS TIN

Package: -

Stock4,878
7-1437539-7
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock4,500
2-641610-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock4,626
100-PRS15031-16
Aries Electronics

CONN SOCKET PGA ZIF GOLD

Package: -

Stock8,100
517-83-428-19-101111
Preci-Dip

CONN SOCKET PGA 428POS GOLD

Package: -

Stock4,302
28-3552-16
Aries Electronics

CONN IC DIP SOCKET ZIF 28POS

Package: -

Stock3,580
48-6518-10E
Aries Electronics

CONN IC DIP SOCKET 48POS GOLD

Package: -

Stock6,984
5-6437504-0
TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS SILVER

Package: -

Stock3,708
146-93-628-41-013000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock8,100
19-0508-31
Aries Electronics

CONN SOCKET SIP 19POS GOLD

Package: -

Stock7,920
22-4518-10E
Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

Package: -

Stock6,480
20-7850-10
Aries Electronics

CONN SOCKET SIP 20POS TIN

Package: -

Stock6,714
27-0508-20
Aries Electronics

CONN SOCKET SIP 27POS GOLD

Package: -

Stock8,154
APA-632-G-A1
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock3,582
510-87-176-16-001101
Preci-Dip

CONN SOCKET PGA 176POS GOLD

Package: -

Stock3,474
40-6511-10
Aries Electronics

CONN IC DIP SOCKET 40POS TIN

Package: -

Stock3,312
ICO-628-MGT
Samtec Inc.

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock6,264
14-6513-10H
Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock8,604
110-83-642-41-105161
Preci-Dip

CONN IC DIP SOCKET 42POS GOLD

Package: -

Stock3,798
05-0508-31
Aries Electronics

CONN SOCKET SIP 5POS GOLD

Package: -

Stock2,538

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
D83084B-46	Harwin Inc.	CONN SOCKET PLCC 84POS TIN Type: PLCC Number of Positions or Pins (Grid): 84 (4 x 21) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Board Guide, Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -50°C ~ 105°C	Package: -	Stock4,878	84 (4 x 21)	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Surface Mount	Board Guide, Closed Frame	Solder	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-50°C ~ 105°C
7-1437539-7	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 5µin (0.127µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock4,500	24 (2 x 12)	0.100" (2.54mm)	Gold	5µin (0.127µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
2-641610-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: - Operating Temperature: -	Package: -	Stock4,626	16 (2 x 8)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	-	-
100-PRS15031-16	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Bronze Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 200°C	Package: -	Stock8,100	-	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Bronze	50µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 200°C
517-83-428-19-101111	Preci-Dip	CONN SOCKET PGA 428POS GOLD Type: PGA Number of Positions or Pins (Grid): 428 (19 x 19) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,302	428 (19 x 19)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
28-3552-16	Aries Electronics	CONN IC DIP SOCKET ZIF 28POS Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50µin (1.27µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock3,580	28 (2 x 14)	0.100" (2.54mm)	Nickel Boron	50µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
48-6518-10E	Aries Electronics	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock6,984	48 (2 x 24)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
5-6437504-0	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS SILVER Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Silver Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Silver Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Diallyl Phthalate (DAP) Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,708	3 (Oval)	-	Silver	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Silver	-	Beryllium Copper	Diallyl Phthalate (DAP)	-55°C ~ 125°C
146-93-628-41-013000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,100	28 (2 x 14)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
19-0508-31	Aries Electronics	CONN SOCKET SIP 19POS GOLD Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,920	19 (1 x 19)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
22-4518-10E	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock6,480	22 (2 x 11)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-7850-10	Aries Electronics	CONN SOCKET SIP 20POS TIN Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock6,714	20 (1 x 20)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
27-0508-20	Aries Electronics	CONN SOCKET SIP 27POS GOLD Type: SIP Number of Positions or Pins (Grid): 27 (1 x 27) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 105°C	Package: -	Stock8,154	27 (1 x 27)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 105°C
APA-632-G-A1	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock3,582	-	-	-	-	-	-	-	-	-	-	-	-	-	-
510-87-176-16-001101	Preci-Dip	CONN SOCKET PGA 176POS GOLD Type: PGA Number of Positions or Pins (Grid): 176 (16 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,474	176 (16 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
40-6511-10	Aries Electronics	CONN IC DIP SOCKET 40POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock3,312	40 (2 x 20)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
ICO-628-MGT	Samtec Inc.	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,264	28 (2 x 14)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
14-6513-10H	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock8,604	14 (2 x 7)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-83-642-41-105161	Preci-Dip	CONN IC DIP SOCKET 42POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,798	42 (2 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
05-0508-31	Aries Electronics	CONN SOCKET SIP 5POS GOLD Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,538	5 (1 x 5)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
110-83-322-41-001101	Preci-Dip	CONN IC DIP SOCKET 22POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,226	22 (2 x 11)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
410-87-228-10-001101	Preci-Dip	CONN ZIG-ZAG 28POS GOLD Type: Zig-Zag, Left Stackable Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,048	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-610-41-001101	Preci-Dip	CONN IC DIP SOCKET 10POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Elevated, Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,358	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-87-318-41-001101	Preci-Dip	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,310	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
1051900001	Molex, LLC	TOP-MOUNT CAMERA SOCKET FOR SMIA Type: Camera Socket Number of Positions or Pins (Grid): 12 (2 x 6) Pitch - Mating: 0.033" (0.85mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 12µin (0.30µm) Contact Material - Mating: Phosphor Bronze Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.033" (0.85mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Phosphor Bronze Alloy Housing Material: Thermoplastic Operating Temperature: -55°C ~ 85°C	Package: -	Stock8,154	12 (2 x 6)	0.033" (0.85mm)	Gold	12µin (0.30µm)	Phosphor Bronze Alloy	Surface Mount	Open Frame	Solder	0.033" (0.85mm)	Gold	Flash	Phosphor Bronze Alloy	Thermoplastic	-55°C ~ 85°C
D01-9950542	Harwin Inc.	CONN SOCKET SIP 5POS GOLD Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.8µin (5.00µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,178	5 (1 x 5)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin	196.8µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled	-55°C ~ 125°C
AR 14 HZL/01-TT	Assmann WSW Components	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Polyester Operating Temperature: -40°C ~ 105°C	Package: -	Stock19,212	14 (2 x 7)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
SA163000	On Shore Technology Inc.	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester, Glass Filled Operating Temperature: -40°C ~ 105°C	Package: -	Stock51,570	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C