Page 65 - Sockets for ICs, Transistors | Connectors, Interconnects

SIP050-1X23-160BLF
Amphenol FCI

CONN SOCKET SIP 23POS GOLD

Package: -

Stock3,024
7-1437536-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 36POS GOLD

Package: -

Stock7,938
916657-2
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 321POS GOLD

Package: -

Stock7,254
24-3551-16
Aries Electronics

CONN IC DIP SOCKET ZIF 24POS

Package: -

Stock3,564
144-PGM12001-41
Aries Electronics

CONN SOCKET PGA GOLD

Package: -

Stock5,688
APA-648-G-D
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock3,060
28-6572-11
Aries Electronics

CONN IC DIP SOCKET ZIF 28POS TIN

Package: -

Stock3,708
28-C182-20
Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock6,444
27-0511-11
Aries Electronics

CONN SOCKET SIP 27POS GOLD

Package: -

Stock4,536
23-0508-21
Aries Electronics

CONN SOCKET SIP 23POS GOLD

Package: -

Stock5,508
111-93-652-41-001000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 52POS GOLD

Package: -

Stock6,804
14-3508-211
Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock5,688
126-93-210-41-002000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 10POS GOLD

Package: -

Stock2,016
12-6810-90WR
Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

Package: -

Stock8,280
14-8456-310C
Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock6,876
714-43-133-31-018000
Mill-Max Manufacturing Corp.

CONN SOCKET SIP 33POS GOLD

Package: -

Stock4,500
22-4518-11H
Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

Package: -

Stock5,346
510-87-180-15-041101
Preci-Dip

CONN SOCKET PGA 180POS GOLD

Package: -

Stock7,452
714-43-120-31-018000
Mill-Max Manufacturing Corp.

CONN SOCKET SIP 20POS GOLD

Package: -

Stock2,628
122-87-650-41-001101
Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

Package: -

Stock7,434

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
SIP050-1X23-160BLF	Amphenol FCI	CONN SOCKET SIP 23POS GOLD Type: SIP Number of Positions or Pins (Grid): 23 (1 x 23) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -	Package: -	Stock3,024	23 (1 x 23)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
7-1437536-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 36POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,938	36 (2 x 18)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
916657-2	TE Connectivity AMP Connectors	CONN SOCKET PGA ZIF 321POS GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): 321 (19 x 19) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Phosphor Bronze Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -	Package: -	Stock7,254	321 (19 x 19)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-
24-3551-16	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50µin (1.27µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock3,564	24 (2 x 12)	0.100" (2.54mm)	Nickel Boron	50µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
144-PGM12001-41	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,688	-	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
APA-648-G-D	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock3,060	-	-	-	-	-	-	-	-	-	-	-	-	-	-
28-6572-11	Aries Electronics	CONN IC DIP SOCKET ZIF 28POS TIN Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	Package: -	Stock3,708	28 (2 x 14)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
28-C182-20	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock6,444	28 (2 x 14)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
27-0511-11	Aries Electronics	CONN SOCKET SIP 27POS GOLD Type: SIP Number of Positions or Pins (Grid): 27 (1 x 27) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,536	27 (1 x 27)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Through Hole	-	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
23-0508-21	Aries Electronics	CONN SOCKET SIP 23POS GOLD Type: SIP Number of Positions or Pins (Grid): 23 (1 x 23) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,508	23 (1 x 23)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6	-55°C ~ 125°C
111-93-652-41-001000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 52POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 52 (2 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,804	52 (2 x 26)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
14-3508-211	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,688	14 (2 x 7)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
126-93-210-41-002000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 10POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,016	10 (2 x 5)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
12-6810-90WR	Aries Electronics	CONN IC DIP SOCKET 12POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 12 (2 x 6) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole, Right Angle, Vertical Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -	Package: -	Stock8,280	12 (2 x 6)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6	-
14-8456-310C	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock6,876	14 (2 x 7)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
714-43-133-31-018000	Mill-Max Manufacturing Corp.	CONN SOCKET SIP 33POS GOLD Type: SIP Number of Positions or Pins (Grid): 33 (1 x 33) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,500	33 (1 x 33)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
22-4518-11H	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock5,346	22 (2 x 11)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
510-87-180-15-041101	Preci-Dip	CONN SOCKET PGA 180POS GOLD Type: PGA Number of Positions or Pins (Grid): 180 (15 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,452	180 (15 x 15)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
714-43-120-31-018000	Mill-Max Manufacturing Corp.	CONN SOCKET SIP 20POS GOLD Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,628	20 (1 x 20)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
122-87-650-41-001101	Preci-Dip	CONN IC DIP SOCKET 50POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 50 (2 x 25) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,434	50 (2 x 25)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-432-41-001101	Preci-Dip	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Elevated, Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,740	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
08-6513-10	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	Package: -	Stock3,492	8 (2 x 4)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-33-628-41-530000	Mill-Max Manufacturing Corp.	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,364	28 (2 x 14)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
232-1285-00-0602J	3M	CONN IC DIP SOCKET ZIF 32POS GLD Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Connector Features: Closed Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polysulfone (PSU), Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,496	32 (2 x 16)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
4601	Keystone Electronics	CONN TRANSIST TO-3 3POS TIN Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Brass Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -	Package: -	Stock15,360	3 (Oval)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
940-44-068-17-400000	Mill-Max Manufacturing Corp.	CONN SOCKET PLCC 68POS TIN Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Alloy Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock19,176	68 (4 x 17)	0.050" (1.27mm)	Tin	150µin (3.81µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	200µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
D2928-42	Harwin Inc.	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.8µin (5.00µm) Contact Material - Post: Brass Housing Material: Plastic Operating Temperature: -55°C ~ 125°C	Package: -	Stock17,736	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.8µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C
203-2737-55-1102	3M	CONN TRANSIST TO-3/TO-66 3POS Type: Transistor, TO-3 and TO-66 Number of Positions or Pins (Grid): 3 (Rectangular) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.234" (5.94mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -55°C ~ 150°C	Package: -	Stock6,156	3 (Rectangular)	-	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.234" (5.94mm)	Gold	30µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 150°C