Page 16 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

SOMMCF5485-INV01-0703R-A
Logic

MODULE FIRE ENGINE

Package: -

Stock2,304
TE0600-02BM
Trenz Electronic GmbH

SOM GIGABEE XC6SLX100 2X512MB 2I

Package: -

Stock7,504
SOMDM3730-32-1780AKIR
Logic

SOM TORPEDO WIRELESS 800MHZ IND

Package: -

Stock5,792
CC-9P-V527UJ-S
Digi International

MOD 9P 32MB SDRAM 8MB FLASH

Package: -

Stock2,496
SOMXOMAPL138-10-1602AHCR
Logic

SYSTEM ON MODULE LV OMAPL138

Package: -

Stock5,776
101-1051
Digi International

MODULE MEMORY CORE RCM3365

Package: -

Stock5,536
101-0691
Digi International

MODULE RABBITCORE RCM3300

Package: -

Stock6,944
CC-MX-LB58-ZM
Digi International

MODULE I.MX51 800MHZ 256MB FLASH

Package: -

Stock7,248
DC-ME-Y402-JT
Digi International

MOD ME 9210 8MB SDRAM 4MB FLASH

Package: -

Stock4,480
TE0715-04-12S-1C
Trenz Electronic GmbH

SOM ZYNQ Z-7012S 1GB DDR3L SDRAM

Package: -

Stock4,976
TE0725-03-35-2C
Trenz Electronic GmbH

SOM FPGA ARTIX-7 35T FLASH 2C

Package: -

Stock6,544
DC-ME-01T-C
Digi International

ME 8MB SDRAM 2MB FLASH SINGLE

Package: -

Stock8,256
L138-DG-225-RI
Critical Link LLC

MITYDSP-L138F SOM OMAP-L138

Package: -

Stock6,744
20-101-0673
Digi International

MODULE RABBITCORE RCM3610

Package: -

Stock8,628
TE0722-02I
Trenz Electronic GmbH

SOM ZYNQ SOFT PROPELLER 40DIP

Package: -

Stock6,096
20-101-1051
Digi International

MODULE RABBITCORE RCM3365

Package: -

Stock6,016
DC-ME-01T-STL
Digi International

MODULE DIGI CONNECT ME

Package: -

Stock3,216
TE0820-05-3AE21MA
Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Package: -

Request a Quote
FORLINX-FET1028A-C-152GOE16M8GIA12
Forlinx Embedded

NXP LS1028ASOM,2GB DDR4,8GB eMMC

Package: -

Request a Quote
TE0745-02-92I11-AK
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMMCF5485-INV01-0703R-A	Logic	MODULE FIRE ENGINE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock2,304	-	-	-	-	-	-	-	-
TE0600-02BM	Trenz Electronic GmbH	SOM GIGABEE XC6SLX100 2X512MB 2I Module/Board Type: FPGA Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock7,504	Spartan-6 LX-100	-	125MHz	16MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
SOMDM3730-32-1780AKIR	Logic	SOM TORPEDO WIRELESS 800MHZ IND Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock5,792	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	-40°C ~ 85°C
CC-9P-V527UJ-S	Digi International	MOD 9P 32MB SDRAM 8MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock2,496	-	-	-	-	-	-	-	-
SOMXOMAPL138-10-1602AHCR	Logic	SYSTEM ON MODULE LV OMAPL138 Module/Board Type: MPU, DSP Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C6748 Speed: 375MHz Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock5,776	ARM926EJ-S, OMAP-L138	TMS320C6748	375MHz	8MB	128MB	Board-to-Board (BTB) Socket - 300	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
101-1051	Digi International	MODULE MEMORY CORE RCM3365 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 32MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock5,536	Rabbit 3000	-	44.2MHz	512KB (Internal), 32MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
101-0691	Digi International	MODULE RABBITCORE RCM3300 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 8MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock6,944	Rabbit 3000	-	44.2MHz	512KB (Internal), 8MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CC-MX-LB58-ZM	Digi International	MODULE I.MX51 800MHZ 256MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock7,248	-	-	-	-	-	-	-	-
DC-ME-Y402-JT	Digi International	MOD ME 9210 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	Package: -	Stock4,480	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
TE0715-04-12S-1C	Trenz Electronic GmbH	SOM ZYNQ Z-7012S 1GB DDR3L SDRAM Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7012S) Speed: 766MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock4,976	ARM Cortex-A9	Zynq-7000 (Z-7012S)	766MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0725-03-35-2C	Trenz Electronic GmbH	SOM FPGA ARTIX-7 35T FLASH 2C Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: 50 Pin Size / Dimension: 2.87" x 1.38" (73mm x 35mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,544	Artix-7 A35T	-	100MHz	32MB	-	50 Pin	2.87" x 1.38" (73mm x 35mm)	0°C ~ 70°C
DC-ME-01T-C	Digi International	ME 8MB SDRAM 2MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock8,256	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
L138-DG-225-RI	Critical Link LLC	MITYDSP-L138F SOM OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA) Speed: 375MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 128MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,744	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX16 (FPGA)	375MHz	256MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 128MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	-40°C ~ 85°C
20-101-0673	Digi International	MODULE RABBITCORE RCM3610 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: IDC Header 2x20 Size / Dimension: 1.23" x 2.11" (31mm x 54mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock8,628	Rabbit 3000	-	22.1MHz	256KB	128KB	IDC Header 2x20	1.23" x 2.11" (31mm x 54mm)	-40°C ~ 85°C
TE0722-02I	Trenz Electronic GmbH	SOM ZYNQ SOFT PROPELLER 40DIP Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 33MHz Flash Size: 16MB RAM Size: - Connector Type: 40 Pin Size / Dimension: 0.71" x 2.01" (18mm x 51mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,096	ARM Cortex-A9	Zynq-7000 (Z-7010)	33MHz	16MB	-	40 Pin	0.71" x 2.01" (18mm x 51mm)	-40°C ~ 85°C
20-101-1051	Digi International	MODULE RABBITCORE RCM3365 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 32MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,016	Rabbit 3000	-	44.2MHz	512KB (Internal), 32MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
DC-ME-01T-STL	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock3,216	-	-	-	-	-	-	-	-
TE0820-05-3AE21MA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
FORLINX-FET1028A-C-152GOE16M8GIA12	Forlinx Embedded	NXP LS1028ASOM,2GB DDR4,8GB eMMC Module/Board Type: MPU Core Processor: ARM® Cortex®-A72 Co-Processor: - Speed: 1.5GHz Flash Size: 8GB eMMC, 16Mb QSPI RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.653" L x 2.559" W (42.00mm x 65.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A72	-	1.5GHz	8GB eMMC, 16Mb QSPI	2GB	Board-to-Board (BTB) Socket - 160	1.653" L x 2.559" W (42.00mm x 65.00mm)	-40°C ~ 85°C
TE0745-02-92I11-AK	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0741-04-D2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K325T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0722-04-11C-4-A	Trenz Electronic GmbH	DIPFORTY1 "SOFT PROPELLER" MIT A Module/Board Type: FPGA Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7: XC7Z007S-1CLG225C Speed: - Flash Size: 16MB RAM Size: - Connector Type: 2 x 20 Pin Size / Dimension: 2.008" L x 0.709" W (51.00mm x 18.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7: XC7Z007S-1CLG225C	-	16MB	-	2 x 20 Pin	2.008" L x 0.709" W (51.00mm x 18.00mm)	0°C ~ 70°C
SOMDM3730-11-2782IFCR	Beacon EmbeddedWorks	SYSTEM ON MODULE DM3730 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
TE0600-03IC2	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
IW-G30M-C4CG-4E002G-E008G-BIA	iWave Systems	ZU4CG (-1 Speed) MPSoC SOM Module/Board Type: MPU, FPG Core Processor: ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) Co-Processor: ARM® Mali 400 MP2 Speed: 1.5GHz, 600MHz Flash Size: 8GB eMMC RAM Size: 4GB, 1GB Connector Type: 2 x 240 Pin Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2)	ARM® Mali 400 MP2	1.5GHz, 600MHz	8GB eMMC	4GB, 1GB	2 x 240 Pin	4.330" L x 2.950" W (110.00mm x 75.00mm)	-40°C ~ 85°C
TE0712-02-81I36-AC	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-81C31-AK	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0865-02-ABI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH ZYNQ ULTRASCAL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I Co-Processor: - Speed: - Flash Size: 256MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I	-	-	256MB	4GB	Board-to-Board (BTB) Socket	3.937" L x 2.953" W (100.00mm x 75.00mm)	0°C ~ 85°C