Page 3 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

CC-MX-LB6B-ZM-B
Digi International

MODULE I.MX51 2GB FLASH 25PK

Package: -

Stock5,968
CC-9C-V237-Z1
Digi International

MODULE 9C 64MB SDRAM 128MB FLASH

Package: -

Stock3,488
CC-9C-V212-NC-25
Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Package: -

Stock5,568
CENGPXA270-520-10-550HC
Logic

CARD ENGINE 64MB FLASH 64MB RAM

Package: -

Stock2,000
CENGPXA270-520-10-503EC
Logic

CARD ENGINE 16MB FLASH 64MB RAM

Package: -

Stock6,336
CENGLH7A404-11-400BC
Logic

CARD ENGINE 32MB SDRAM

Package: -

Stock3,728
DC-EM-02T-S-25
Digi International

EM 8MB SDRAM 4MB FLASH 25 PAK

Package: -

Stock3,168
DC-ME-01T-PS
Digi International

MOD ME 8MB SDRAM 2MB FLASH SGL

Package: -

Stock7,408
TE0803-01-04CG-1EA
Trenz Electronic GmbH

SOM USCALE+ XCZU4CG-1S 2GB DDR4

Package: -

Stock2,928
TE0712-02-81I36-L
Trenz Electronic GmbH

FPGA MODULE ARTIX7

Package: -

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TE0712-02-82C36-AW
Trenz Electronic GmbH

FPGA MODULE ARTIX7

Package: -

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TE0841-02-31C21-A
Trenz Electronic GmbH

IC MODULE

Package: -

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TE0741-05-D2I-1-A
Trenz Electronic GmbH

IC MOD KINTEX-7 325T 200MHZ 32MB

Package: -

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IW-G24M-CU2F-4E002G-S008G-LIK
iWave Systems

Arria 10 SX660 (-1 speed)SoC SOM

Package: -

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MCV-2DB
ARIES Embedded

SoM CycloneV SoC-FPGA

Package: -

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TE0720-03-61Q43GA
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Package: -

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TE0720-03-61Q33FL
Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Package: -

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SM-K26-XCL2GC-ED
AMD

SOM K26C VISION ZYNQ MPSOC ED

Package: -

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20-101-0073
Digi

OEM VERSION SMARTBLOCK

Package: -

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TE0715-04-51I33-AN
Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Package: -

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Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-LB6B-ZM-B	Digi International	MODULE I.MX51 2GB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock5,968	-	-	-	-	-	-	-	-
CC-9C-V237-Z1	Digi International	MODULE 9C 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 128MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock3,488	ARM926EJ-S, NS9360	-	155MHz	128MB	64MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CC-9C-V212-NC-25	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock5,568	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CENGPXA270-520-10-550HC	Logic	CARD ENGINE 64MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock2,000	PXA270	-	520MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGPXA270-520-10-503EC	Logic	CARD ENGINE 16MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,336	PXA270	-	520MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH7A404-11-400BC	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock3,728	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
DC-EM-02T-S-25	Digi International	EM 8MB SDRAM 4MB FLASH 25 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock3,168	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
DC-ME-01T-PS	Digi International	MOD ME 8MB SDRAM 2MB FLASH SGL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock7,408	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0803-01-04CG-1EA	Trenz Electronic GmbH	SOM USCALE+ XCZU4CG-1S 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock2,928	-	-	-	-	-	-	-	-
TE0712-02-81I36-L	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0712-02-82C36-AW	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0841-02-31C21-A	Trenz Electronic GmbH	IC MODULE Module/Board Type: FPGA Core Core Processor: Kintex UltraScale KU035 Co-Processor: - Speed: - Flash Size: 64MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	Kintex UltraScale KU035	-	-	64MB	2GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0741-05-D2I-1-A	Trenz Electronic GmbH	IC MOD KINTEX-7 325T 200MHZ 32MB Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676I Co-Processor: - Speed: 25MHz Flash Size: 32MB RAM Size: - Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K325T-2FBG676I	-	25MHz	32MB	-	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
IW-G24M-CU2F-4E002G-S008G-LIK	iWave Systems	Arria 10 SX660 (-1 speed)SoC SOM Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Arria 10 SX Co-Processor: - Speed: 1.5GHz Flash Size: 8GB RAM Size: 4GB Connector Type: 2 x 240 Pin Size / Dimension: 3.740" L x 2.950" W (95.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A9, Arria 10 SX	-	1.5GHz	8GB	4GB	2 x 240 Pin	3.740" L x 2.950" W (95.00mm x 75.00mm)	-40°C ~ 85°C
MCV-2DB	ARIES Embedded	SoM CycloneV SoC-FPGA Module/Board Type: FPGA Core Processor: ARM Cortex-A9 (Dual Core) Co-Processor: - Speed: 600MHz Flash Size: 4GB RAM Size: 1GB Connector Type: 360 Pin Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	ARM Cortex-A9 (Dual Core)	-	600MHz	4GB	1GB	360 Pin	2.910" L x 1.650" W (74.00mm x 42.00mm)	0°C ~ 70°C
TE0720-03-61Q43GA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0720-03-61Q33FL	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
SM-K26-XCL2GC-ED	AMD	SOM K26C VISION ZYNQ MPSOC ED Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Speed: 533MHz, 1.333GHz Flash Size: 16GB eMMC, 64MB QSPI RAM Size: 4GB Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Operating Temperature: 0°C ~ 85°C (TJ)	Package: -	Request a Quote	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	0°C ~ 85°C (TJ)
20-101-0073	Digi	OEM VERSION SMARTBLOCK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
TE0715-04-51I33-AN	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0835-02-MXE21-A	Trenz Electronic GmbH	RFSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: 1.3GHz Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E	ARM® Cortex®-A53, ARM® Cortex®-R5	1.3GHz	128MB	4GB	Board-to-Board (BTB) Socket	3.543" L x 2.559" W (90.00mm x 65.00mm)	0°C ~ 85°C
ME-XU9-5EV-1I-D12E-L11-R2	Enclustra FPGA Solutions	SOM XU9 ZYNQ 5EV REV2 Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
ARRIA-10-GX	Intel	PROTOTYPE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
S00005-02	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
TE0712-02-71I06-M	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: - Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	-	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU7-9EG-2I-D12E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU9EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I Speed: - Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I	-	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
AM3352-SOM-IND	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3352 Co-Processor: - Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 40 Pin Size / Dimension: 2.400" L x 1.500" W (61.00mm x 38.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A8, AM3352	-	1GHz	-	512MB	40 Pin	2.400" L x 1.500" W (61.00mm x 38.00mm)	-40°C ~ 85°C
FORLINX-FET-G2LD-C-122GOE16M16GIB11	Forlinx Embedded	Renesas RZ/G2L (R9A07G044Lxx)SOM Module/Board Type: MPU Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Co-Processor: - Speed: 1.2GHz Flash Size: 16GB eMMC,16MB (NOR) RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 1.496" L x 2.360" W (38.00mm x 60.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-M33	-	1.2GHz	16GB eMMC,16MB (NOR)	2GB	Board-to-Board (BTB) Socket - 240	1.496" L x 2.360" W (38.00mm x 60.00mm)	-40°C ~ 85°C