Page 33 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

TE0741-02-160-2C1
Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

Package: -

Stock4,000
SOMDM3730-31-1880AKIR
Logic

SYSTEM ON MODULE WIRELESS TORP

Package: -

Stock5,568
SOMOMAP3503-10-1670HFCR
Logic

SYSTEM ON MODULE LV OMAP3503

Package: -

Stock6,752
101-1007
Digi International

MODULE POWERCORE FLEX 3810

Package: -

Stock4,272
FS-335
Digi International

MODULE MOD520C 2MB FLASH

Package: -

Stock7,040
CENGPXA270-416-11-505HXR
Logic

CARD ENGINE 64MB SDRAM

Package: -

Stock2,048
TE0715-04-30-1I3
Trenz Electronic GmbH

XILINX ZYNQ Z-7030 SOC MICROMODU

Package: -

Stock5,872
TMP5704457BZWTQQ1
Texas Instruments

MODULE TMP5704457

Package: -

Stock5,488
CC-9U-T724-Z1
Digi International

MODULE 9U 32MB SDRAM 16MB FLASH

Package: -

Stock3,952
DC-EM-02T-S
Digi International

EM 8MB SDRAM 4MB FLASH SINGLE

Package: -

Stock2,960
TE0715-04-30-1I
Trenz Electronic GmbH

SOM ZYNQ XC7Z030-1I 1GB DDR3

Package: -

Stock4,832
20-101-1319
Digi International

MINCORE MODULE RCM6710

Package: -

Stock17,820
XPDNC2000-01
Lantronix, Inc.

XPORT DIRECT PLUS DEVICE NETWORK

Package: -

Stock7,568
TE0820-03-03EG-1ED
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Package: -

Stock5,808
TE0803-02-04EV-1EA
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Package: -

Stock4,144
TE0803-02-04EG-1EA
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Package: -

Stock7,424
MYC-CZU4EV-V2-4E4D-1200-I
MYIR Tech Limited

MYC-CZU4EV-V2 CPU Module

Package: -

Request a Quote
TE0803-03-5DI21-A
Trenz Electronic GmbH

MODULE SOM TE0803-03

Package: -

Request a Quote
MA-MA3-C6-7I-D10-R2
Enclustra FPGA Solutions

SOM CYCLONE V 5CSXFC6 1GB

Package: -

Stock9
TE0714-04-52I-8-A
Trenz Electronic GmbH

IC MODULE ARTIX-7

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-02-160-2C1	Trenz Electronic GmbH	SOM KINTEX-7 160T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 160T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock4,000	Kintex-7 160T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
SOMDM3730-31-1880AKIR	Logic	SYSTEM ON MODULE WIRELESS TORP Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.3" (15mm x 33mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock5,568	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	512MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.3" (15mm x 33mm)	-40°C ~ 85°C
SOMOMAP3503-10-1670HFCR	Logic	SYSTEM ON MODULE LV OMAP3503 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,752	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB	128MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
101-1007	Digi International	MODULE POWERCORE FLEX 3810 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 25.8MHz Flash Size: 512KB RAM Size: 256KB Connector Type: IDC Header 2x25, 2x5, 1x3mm Size / Dimension: 2.35" x 4" (60mm x 102mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock4,272	Rabbit 3000	-	25.8MHz	512KB	256KB	IDC Header 2x25, 2x5, 1x3mm	2.35" x 4" (60mm x 102mm)	-40°C ~ 70°C
FS-335	Digi International	MODULE MOD520C 2MB FLASH Module/Board Type: MCU Core Core Processor: ElanSC520 Co-Processor: - Speed: 133MHz Flash Size: 2MB RAM Size: 16MB Connector Type: - Size / Dimension: - Operating Temperature: 0°C ~ 70°C	Package: -	Stock7,040	ElanSC520	-	133MHz	2MB	16MB	-	-	0°C ~ 70°C
CENGPXA270-416-11-505HXR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 416MHz Flash Size: 64MB RAM Size: 64MB Connector Type: Edge Connector Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -25°C ~ 85°C	Package: -	Stock2,048	PXA270	-	416MHz	64MB	64MB	Edge Connector	2.37" x 2.67" (60.2mm x 67.8mm)	-25°C ~ 85°C
TE0715-04-30-1I3	Trenz Electronic GmbH	XILINX ZYNQ Z-7030 SOC MICROMODU Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock5,872	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TMP5704457BZWTQQ1	Texas Instruments	MODULE TMP5704457 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock5,488	-	-	-	-	-	-	-	-
CC-9U-T724-Z1	Digi International	MODULE 9U 32MB SDRAM 16MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock3,952	-	-	-	-	-	-	-	-
DC-EM-02T-S	Digi International	EM 8MB SDRAM 4MB FLASH SINGLE Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock2,960	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
TE0715-04-30-1I	Trenz Electronic GmbH	SOM ZYNQ XC7Z030-1I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock4,832	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
20-101-1319	Digi International	MINCORE MODULE RCM6710 Module/Board Type: MPU Core Core Processor: Rabbit 6000 Co-Processor: - Speed: 162.5MHz Flash Size: 1MB RAM Size: 1.032MB Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock17,820	Rabbit 6000	-	162.5MHz	1MB	1.032MB	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
XPDNC2000-01	Lantronix, Inc.	XPORT DIRECT PLUS DEVICE NETWORK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock7,568	-	-	-	-	-	-	-	-
TE0820-03-03EG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 80°C	Package: -	Stock5,808	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 80°C
TE0803-02-04EV-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock4,144	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0803-02-04EG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock7,424	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
MYC-CZU4EV-V2-4E4D-1200-I	MYIR Tech Limited	MYC-CZU4EV-V2 CPU Module Module/Board Type: MCU, Ethernet Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I Speed: 2.4GHz Flash Size: 4GB eMMC, 128MB QSPI RAM Size: 4GB Connector Type: Pin(s) Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I	2.4GHz	4GB eMMC, 128MB QSPI	4GB	Pin(s)	2.362" L x 2.047" W (60.00mm x 52.00mm)	-40°C ~ 85°C
TE0803-03-5DI21-A	Trenz Electronic GmbH	MODULE SOM TE0803-03 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
MA-MA3-C6-7I-D10-R2	Enclustra FPGA Solutions	SOM CYCLONE V 5CSXFC6 1GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9, Cyclone V SX/SE Co-Processor: Cypress FX3 USB 3.0 Speed: 800MHz Flash Size: 64MB RAM Size: 1GB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock9	ARM® Cortex®-A9, Cyclone V SX/SE	Cypress FX3 USB 3.0	800MHz	64MB	1GB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
TE0714-04-52I-8-A	Trenz Electronic GmbH	IC MODULE ARTIX-7 Module/Board Type: FPGA Core Processor: Artix-7 A50T Co-Processor: Artix-7 Speed: - Flash Size: 16MB RAM Size: - Connector Type: - Size / Dimension: 1.570" L x 1.180" W (40.00mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Artix-7 A50T	Artix-7	-	16MB	-	-	1.570" L x 1.180" W (40.00mm x 30.00mm)	-40°C ~ 85°C
TE0820-04-4BI21KL	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
TE0807-03-5AI21-A	Trenz Electronic GmbH	MPSOC ZYNQ USCALE 4GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
CC-WST-DW69-NM	Digi	STM32MP157DUAL GPU 512M SLC NAND Module/Board Type: MPU Core Processor: STM32MP157C Co-Processor: Arm® Dual Cortex®-A7, ARM® Cortex®-M4 Speed: 650MHz, 209MHz Flash Size: 512MB (Boot) RAM Size: 512MB Connector Type: Pin(s) Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	STM32MP157C	Arm® Dual Cortex®-A7, ARM® Cortex®-M4	650MHz, 209MHz	512MB (Boot)	512MB	Pin(s)	1.142" L x 1.142" W (29.00mm x 29.00mm)	-40°C ~ 85°C
ME-SA2-D6-7I-D11-R1	Enclustra FPGA Solutions	SOM CYCLONE V 5CSTFD6 2GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: - Speed: 800MHz Flash Size: 64MB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock57	ARM® Dual-Core Cortex-A9	-	800MHz	64MB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0729-02-62I63MAK	Trenz Electronic GmbH	IC SOC MODULE ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	512MB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
AM0010-02-4DE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU4EV Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.220" L x 1.575" W (56.40mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	Zynq™ UltraScale+™ ZU4EV	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.220" L x 1.575" W (56.40mm x 40.00mm)	0°C ~ 85°C
ME-XU7-15EG-2I-D12E-R4-1	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
ME-XU1-15EG-1E-D12E-G1-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C