Page 118 - Embedded - Microprocessors | Integrated Circuits (ICs)

MPC8377CVRALG
NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock6,208
KMPC8379ECVRALG
NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Package: 689-BBGA Exposed Pad

Stock3,296
IDT79R4650-133DP
IDT, Integrated Device Technology Inc

IC MPU MIPS-I 133MHZ 208QFP

Package: 208-BFQFP Exposed Pad

Stock7,456
KMPC8360EVVAJDGA
NXP

IC MPU MPC83XX 533MHZ 740TBGA

Package: 740-LBGA

Stock2,816
KMPC8358VRAGDDA
NXP

IC MPU MPC83XX 400MHZ 668BGA

Package: 668-BBGA Exposed Pad

Stock4,576
MC7448VS1267ND
NXP

IC MPU MPC74XX 1.267GHZ 360LGA

Package: 360-CLGA, FCCLGA

Stock7,600
MPC8358CVVADDE
NXP

IC MPU MPC83XX 266MHZ 740TBGA

Package: 740-LBGA

Stock4,688
MPC8540CPX667JB
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Package: 784-BBGA, FCBGA

Stock5,904
KMPC8560PX833LB
NXP

IC MPU MPC85XX 833MHZ 783FCBGA

Package: 784-BBGA, FCBGA

Stock3,760
KMPC8241LZQ200D
NXP

IC MPU MPC82XX 200MHZ 357BGA

Package: 357-BBGA

Stock7,296
KMC68MH360ZP33L
NXP

IC MPU M683XX 33MHZ 357BGA

Package: 357-BGA

Stock7,904
TS68020VR1-20
Microchip Technology

IC MPU 68000 20MHZ 114PGA

Package: 114-BCPGA

Stock6,096
PCX755BVZFU300LE
Microchip Technology

IC MPU POWERPC 300MHZ 360BGA

Package: 360-BBGA Exposed Pad

Stock3,456
MC68LC302PU20VCT
NXP

IC MPU M683XX 20MHZ 100LQFP

Package: 100-LQFP

Stock3,968
B4860NXE7QUMD
NXP

BASEBAND PROC PILOT REV 1.0

Package: 1020-BBGA, FCBGA

Stock4,848
MPC8272CVRTIEA
NXP

IC MPU MPC82XX 400MHZ 516BGA

Package: 516-BBGA

Stock6,848
MPC8271ZQMIBA
NXP

IC MPU MPC82XX 266MHZ 516BGA

Package: 516-BBGA

Stock3,568
MPC8308CZQADDA
NXP

IC MPU MPC83XX 266MHZ 473MAPBGA

Package: 473-LFBGA

Stock5,104
OMAPL138EZCE4
Texas Instruments

IC MPU OMAP-L1X 456MHZ 361NFBGA

Package: 361-LFBGA

Stock6,336
AM4379BZDNA80
Texas Instruments

MOD ARM CORTEX-A9 491NFBGA

Package: 491-LFBGA

Stock7,504

Part Number	Manufacturer	Description	Package	Stock	Number of Cores/Bus Width	Speed	Co-Processors/DSP	RAM Controllers	Graphics Acceleration	Display & Interface Controllers	Ethernet	SATA	USB	Voltage - I/O	Operating Temperature	Security Features	Package / Case	Supplier Device Package
MPC8377CVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock6,208	1 Core, 32-Bit	667MHz	-	DDR, DDR2	No	-	10/100/1000 Mbps (2)	SATA 3Gbps (2)	USB 2.0 + PHY (1)	1.8V, 2.5V, 3.3V	-40°C ~ 125°C (TA)	-	689-BBGA Exposed Pad	689-TEPBGA II (31x31)
KMPC8379ECVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock3,296	1 Core, 32-Bit	667MHz	Security; SEC 3.0	DDR, DDR2	No	-	10/100/1000 Mbps (2)	SATA 3Gbps (4)	USB 2.0 + PHY (1)	1.8V, 2.5V, 3.3V	-40°C ~ 125°C (TA)	Cryptography, Random Number Generator	689-BBGA Exposed Pad	689-TEPBGA II (31x31)
IDT79R4650-133DP	IDT, Integrated Device Technology Inc	IC MPU MIPS-I 133MHZ 208QFP Core Processor: MIPS-I Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 133MHz Co-Processors/DSP: System Control; CP0 RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 85°C (TC) Security Features: - Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP Exposed Pad	Stock7,456	1 Core, 64-Bit	133MHz	System Control; CP0	DRAM	No	-	-	-	-	5.0V	0°C ~ 85°C (TC)	-	208-BFQFP Exposed Pad	208-PQFP (28x28)
KMPC8360EVVAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock2,816	1 Core, 32-Bit	533MHz	Communications; QUICC Engine, Security; SEC	DDR, DDR2	No	-	10/100/1000 Mbps (1)	-	USB 1.x (1)	1.8V, 2.5V, 3.3V	0°C ~ 105°C (TA)	Cryptography, Random Number Generator	740-LBGA	740-TBGA (37.5x37.5)
KMPC8358VRAGDDA	NXP	IC MPU MPC83XX 400MHZ 668BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29x29)	Package: 668-BBGA Exposed Pad	Stock4,576	1 Core, 32-Bit	400MHz	Communications; QUICC Engine	DDR, DDR2	No	-	10/100/1000 Mbps (1)	-	USB 1.x (1)	1.8V, 2.5V, 3.3V	0°C ~ 105°C (TA)	-	668-BBGA Exposed Pad	668-PBGA-PGE (29x29)
MC7448VS1267ND	NXP	IC MPU MPC74XX 1.267GHZ 360LGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	Package: 360-CLGA, FCCLGA	Stock7,600	1 Core, 32-Bit	1.267GHz	Multimedia; SIMD	-	No	-	-	-	-	1.5V, 1.8V, 2.5V	0°C ~ 105°C (TA)	-	360-CLGA, FCCLGA	360-FCCLGA (25x25)
MPC8358CVVADDE	NXP	IC MPU MPC83XX 266MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	Package: 740-LBGA	Stock4,688	1 Core, 32-Bit	266MHz	Communications; QUICC Engine	DDR, DDR2	No	-	10/100/1000 Mbps (1)	-	USB 1.x (1)	1.8V, 2.5V, 3.3V	-40°C ~ 105°C (TA)	-	740-LBGA	740-TBGA (37.5x37.5)
MPC8540CPX667JB	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 784-BBGA, FCBGA	Stock5,904	1 Core, 32-Bit	667MHz	-	DDR, SDRAM	No	-	10/100 Mbps (1), 10/100/1000 Mbps (2)	-	-	2.5V, 3.3V	-40°C ~ 105°C (TA)	-	784-BBGA, FCBGA	783-FCPBGA (29x29)
KMPC8560PX833LB	NXP	IC MPU MPC85XX 833MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 784-BBGA, FCBGA	Stock3,760	1 Core, 32-Bit	833MHz	Communications; CPM	DDR, SDRAM	No	-	10/100/1000 Mbps (2)	-	-	2.5V, 3.3V	0°C ~ 105°C (TA)	-	784-BBGA, FCBGA	783-FCPBGA (29x29)
KMPC8241LZQ200D	NXP	IC MPU MPC82XX 200MHZ 357BGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BBGA	Stock7,296	1 Core, 32-Bit	200MHz	-	SDRAM	No	-	-	-	-	3.3V	0°C ~ 105°C (TA)	-	357-BBGA	357-PBGA (25x25)
KMC68MH360ZP33L	NXP	IC MPU M683XX 33MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25)	Package: 357-BGA	Stock7,904	1 Core, 32-Bit	33MHz	Communications; CPM	DRAM	No	-	10 Mbps (1)	-	-	5.0V	0°C ~ 70°C (TA)	-	357-BGA	357-PBGA (25x25)
TS68020VR1-20	Microchip Technology	IC MPU 68000 20MHZ 114PGA Core Processor: 68000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 20MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TC) Security Features: - Package / Case: 114-BCPGA Supplier Device Package: 114-CPGA (34.54x34.54)	Package: 114-BCPGA	Stock6,096	1 Core, 32-Bit	20MHz	-	-	No	-	-	-	-	5.0V	-40°C ~ 85°C (TC)	-	114-BCPGA	114-CPGA (34.54x34.54)
PCX755BVZFU300LE	Microchip Technology	IC MPU POWERPC 300MHZ 360BGA Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Security Features: - Package / Case: 360-BBGA Exposed Pad Supplier Device Package: 360-PBGA (25x25)	Package: 360-BBGA Exposed Pad	Stock3,456	1 Core, 32-Bit	300MHz	-	-	No	-	-	-	-	2.5V, 3.3V	-40°C ~ 110°C (TJ)	-	360-BBGA Exposed Pad	360-PBGA (25x25)
MC68LC302PU20VCT	NXP	IC MPU M683XX 20MHZ 100LQFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock3,968	1 Core, 8/16-Bit	20MHz	Communications; RISC CPM	DRAM	No	-	-	-	-	3.3V	0°C ~ 70°C (TA)	-	100-LQFP	100-LQFP (14x14)
B4860NXE7QUMD	NXP	BASEBAND PROC PILOT REV 1.0 Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5 Gbps (4), 1/2.5/10 Gbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33x33)	Package: 1020-BBGA, FCBGA	Stock4,848	4 Core, 64-Bit	1.8GHz	Signal Processing; SC3900FP FVP - 6 Core	DDR3, DDR3L	No	-	1/2.5 Gbps (4), 1/2.5/10 Gbps (2)	-	USB 2.0 (1)	1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V	-40°C ~ 105°C (TA)	AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC	1020-BBGA, FCBGA	1020-FCPBGA (33x33)
MPC8272CVRTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock6,848	1 Core, 32-Bit	400MHz	Communications; RISC CPM, Security; SEC	DRAM, SDRAM	No	-	10/100 Mbps (2)	-	USB 2.0 (1)	3.3V	-40°C ~ 105°C (TA)	Cryptography, Random Number Generator	516-BBGA	516-FPBGA (27x27)
MPC8271ZQMIBA	NXP	IC MPU MPC82XX 266MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	Package: 516-BBGA	Stock3,568	1 Core, 32-Bit	266MHz	Communications; RISC CPM	DRAM, SDRAM	No	-	10/100 Mbps (2)	-	USB 2.0 (1)	3.3V	0°C ~ 105°C (TA)	-	516-BBGA	516-FPBGA (27x27)
MPC8308CZQADDA	NXP	IC MPU MPC83XX 266MHZ 473MAPBGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock5,104	1 Core, 32-Bit	266MHz	-	DDR2	No	-	10/100/1000 Mbps (3)	-	USB 2.0 (1)	1.8V, 2.5V, 3.3V	-40°C ~ 105°C (TA)	-	473-LFBGA	473-MAPBGA (19x19)
OMAPL138EZCE4	Texas Instruments	IC MPU OMAP-L1X 456MHZ 361NFBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 456MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Package / Case: 361-LFBGA Supplier Device Package: 361-NFBGA (13x13)	Package: 361-LFBGA	Stock6,336	1 Core, 32-Bit	456MHz	Signal Processing; C674x, System Control; CP15	SDRAM	No	LCD	10/100 Mbps (1)	SATA 3Gbps (1)	USB 1.1 + PHY (1), USB 2.0 + PHY (1)	1.8V, 3.3V	0°C ~ 90°C (TJ)	Boot Security, Cryptography	361-LFBGA	361-NFBGA (13x13)
AM4379BZDNA80	Texas Instruments	MOD ARM CORTEX-A9 491NFBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: Yes Display & Interface Controllers: TSC, WXGA Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Crypto Accelerator Package / Case: 491-LFBGA Supplier Device Package: 491-NFBGA (17x17)	Package: 491-LFBGA	Stock7,504	1 Core, 32-Bit	800MHz	Multimedia; NEON? SIMD	LPDDR2, DDR3, DDR3L	Yes	TSC, WXGA	10/100/1000 Mbps (2)	-	USB 2.0 + PHY (2)	1.8V, 3.3V	-40°C ~ 105°C (TJ)	Crypto Accelerator	491-LFBGA	491-NFBGA (17x17)
SB80L186EC13	Intel	IC MPU I186 13MHZ 100SQFP Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 13MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 100-BFQFP Supplier Device Package: 100-SQFP	Package: 100-BFQFP	Stock5,040	1 Core, 16-Bit	13MHz	-	DRAM	No	-	-	-	-	3.0V	0°C ~ 70°C (TA)	-	100-BFQFP	100-SQFP
LS2048ASE7V1B	NXP	LS2048A - STD TEMP, W/ENCRYPT, 2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,800	-	-	-	-	-	-	-	-	-	-	-	-	-	-
T1024NSN7MQPA	NXP	QORIQ 2XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,736	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MCIMX6DP4AVT8AB	NXP	IC MPU I.MX6DP ENHAN 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-FBGA, FCBGA	Stock6,080	2 Core, 32-Bit	852MHZ	Multimedia; NEON™ SIMD	LPDDR2, DDR3L, DDR3	Yes	HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel	10/100/1000 Mbps (1)	SATA 3Gbps (1)	USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)	1.8V, 2.5V, 2.8V, 3.3V	-40°C ~ 125°C (TJ)	ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS	624-FBGA, FCBGA	624-FCBGA (21x21)
MCIMX6DP5EYM1AB	NXP	IC MPU I.MX6DP ENHAN 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-LFBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	Package: 624-LFBGA, FCBGA	Stock6,564	2 Core, 32-Bit	1.0GHz	Multimedia; NEON™ SIMD	LPDDR2, DDR3L, DDR3	Yes	HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel	10/100/1000 Mbps (1)	SATA 3Gbps (1)	USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)	1.8V, 2.5V, 2.8V, 3.3V	-20°C ~ 105°C (TJ)	ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS	624-LFBGA, FCBGA	624-FCBGA (21x21)
NUC978DK41Y	Nuvoton Technology Corporation	IC MPU NUC970 300MHZ 128LQFP Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: - RAM Controllers: DDR2, LVDDR, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) SATA: - USB: USB 2.0 (3) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, SHA, TRNG Package / Case: 128-LQFP Supplier Device Package: 128-LQFP (14x14)	Package: -	Request a Quote	1 Core, 32-Bit	300MHz	-	DDR2, LVDDR, SDRAM	Yes	LCD	10/100Mbps (1)	-	USB 2.0 (3)	3.3V	-40°C ~ 85°C (TA)	AES, ECC, SHA, TRNG	128-LQFP	128-LQFP (14x14)
R9A07G084M04GBA-AC0	Renesas Electronics Corporation	IC MPU RZ/N2L 300/400MHZ 121FBGA Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz, 400MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000Mbps (1) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: - Package / Case: 121-LFBGA Supplier Device Package: 121-FBGA (10x10)	Package: -	Stock720	1 Core, 32-Bit	300MHz, 400MHz	Multimedia; NEON™ SIMD	-	No	-	10/100/1000Mbps (1)	-	USB 2.0 (1)	1.8V, 3.3V	-40°C ~ 125°C (TJ)	-	121-LFBGA	121-FBGA (10x10)
R9A09G011GBG-ACC	Renesas Electronics Corporation	IC MPU RZ/V 996MHZ 841FBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 996MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DP, HDMI, LCD Ethernet: GbE (1) SATA: - USB: USB 3.1 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARC4, RSA, SHA-224, SHA-256, TRNG Package / Case: 841-FBGA Supplier Device Package: 841-FBGA (15x15)	Package: -	Stock288	2 Core, 64-Bit	996MHz	Multimedia; NEON™ SIMD	LPDDR4	No	DP, HDMI, LCD	GbE (1)	-	USB 3.1 (1)	1.8V, 3.3V	-40°C ~ 125°C (TJ)	AES, ARC4, RSA, SHA-224, SHA-256, TRNG	841-FBGA	841-FBGA (15x15)