Page 124 - Embedded - System On Chip (SoC) | Integrated Circuits (ICs)

M2S100-1FCG1152
Microsemi Corporation

IC FPGA SOC 100K LUTS 1152FCBGA

Package: 1152-BBGA, FCBGA

Stock6,512
10AS066N2F40E2LG
Altera

IC SOC FPGA 588 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock7,600
5ASXMB5E4F31C4N
Altera

IC FPGA 170 I/O 896FBGA

Package: 896-BBGA, FCBGA

Stock7,712
5CSEBA5U19I7SN
Altera

IC FPGA 66 I/O 484UBGA

Package: 484-FBGA

Stock7,312
XCZU19EG-1FFVD1760E
Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

Package: 1760-BBGA, FCBGA

Stock5,184
XCZU7EV-L2FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock2,000
M2S060-1FG676I
Microsemi Corporation

IC FPGA SOC 60K LUTS

Package: 676-BGA

Stock5,808
M2S025T-FG484
Microsemi Corporation

IC FPGA SOC 25K LUTS 484FBGA

Package: 484-BGA

Stock3,200
10AS048K1F35I1SG
Intel

IC SOC FPGA 396 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock6,768
10AS066H2F34I2LG
Intel

IC SOC FPGA 492 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock5,504
10AS048H4F34I3SG
Intel

1152-PIN FBGA

Package: -

Stock2,016
AGIB022R31A3I3V
Intel

IC FPGA AGILEX-I 3184BGA

Package: -

Request a Quote
AGIC040R39A2E2V
Intel

IC

Package: -

Request a Quote
TDA3MVRB2ABFRQ1
Texas Instruments

PROTOTYPE

Package: -

Request a Quote
XCVM1802-2MSIVFVC1760
AMD

IC VERSAL AICORE FPGA 1760BGA

Package: -

Request a Quote
1SX250HN1F43I2LG
Intel

IC FPGA STRATIX 10 1760FBGA

Package: -

Request a Quote
AGFB014R24C2E1V
Intel

IC FPGA AGILEX-F 2340FBGA

Package: -

Request a Quote
AGFD023R25A2E4X
Intel

IC FPGA AGILEX-F 2581FBGA

Package: -

Request a Quote
XCZU1EG-2UBVA494I
AMD

IC ZUP MPSOC EG A53 FPGA 494BGA

Package: -

Stock378
BCM3218SF02
Broadcom Limited

DOCSIS EOC WITH ONE A/D SCDMA

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
M2S100-1FCG1152	Microsemi Corporation	IC FPGA SOC 100K LUTS 1152FCBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock6,512	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 100K Logic Modules	0°C ~ 85°C (TJ)	1152-BBGA, FCBGA	1152-FCBGA (35x35)
10AS066N2F40E2LG	Altera	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock7,600	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
5ASXMB5E4F31C4N	Altera	IC FPGA 170 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	Package: 896-BBGA, FCBGA	Stock7,712	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	925MHz	FPGA - 462K Logic Elements	0°C ~ 85°C (TJ)	896-BBGA, FCBGA	896-FBGA (31x31)
5CSEBA5U19I7SN	Altera	IC FPGA 66 I/O 484UBGA Architecture: MCU, FPGA Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	Package: 484-FBGA	Stock7,312	Single ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 85K Logic Elements	-40°C ~ 100°C (TJ)	484-FBGA	484-UBGA (19x19)
XCZU19EG-1FFVD1760E	Xilinx Inc.	IC FPGA 308 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	Package: 1760-BBGA, FCBGA	Stock5,184	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 1143K+ Logic Cells	0°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)
XCZU7EV-L2FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock2,000	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 504K+ Logic Cells	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
M2S060-1FG676I	Microsemi Corporation	IC FPGA SOC 60K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	Package: 676-BGA	Stock5,808	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 100°C (TJ)	676-BGA	676-FBGA (27x27)
M2S025T-FG484	Microsemi Corporation	IC FPGA SOC 25K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	Package: 484-BGA	Stock3,200	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	484-BGA	484-FPBGA (23x23)
10AS048K1F35I1SG	Intel	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock6,768	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 480K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
10AS066H2F34I2LG	Intel	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock5,504	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FCBGA (35x35)
10AS048H4F34I3SG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock2,016	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 480K Logic Elements	-40°C ~ 100°C (TJ)	-	-
AGIB022R31A3I3V	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.2M Logic Elements	-40°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
AGIC040R39A2E2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4.047M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4.047M Logic Elements	0°C ~ 100°C (TJ)	3948-BFBGA Exposed Pad	3948-BGA (56x56)
TDA3MVRB2ABFRQ1	Texas Instruments	PROTOTYPE Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
XCVM1802-2MSIVFVC1760	AMD	IC VERSAL AICORE FPGA 1760BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.4GHz Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BFBGA, FCBGA Supplier Device Package: 1760-FCBGA (40x40)	Package: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 1.9M Logic Cells	-40°C ~ 100°C (TJ)	1760-BFBGA, FCBGA	1760-FCBGA (40x40)
1SX250HN1F43I2LG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2500K Logic Elements	-40°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FBGA (42.5x42.5)
AGFB014R24C2E1V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.4M Logic Elements	0°C ~ 100°C (TJ)	-	-
AGFD023R25A2E4X	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.3M Logic Elements	0°C ~ 100°C (TJ)	-	-
XCZU1EG-2UBVA494I	AMD	IC ZUP MPSOC EG A53 FPGA 494BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: - Speed: 533MHz, 600MHz, 1.333GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 494-WFBGA, FCBGA Supplier Device Package: 494-FCBGA (14x14)	Package: -	Stock378	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	-	533MHz, 600MHz, 1.333GHz	Zynq®UltraScale+™ FPGA, 81K+ Logic Cells	-40°C ~ 100°C (TJ)	494-WFBGA, FCBGA	494-FCBGA (14x14)
BCM3218SF02	Broadcom Limited	DOCSIS EOC WITH ONE A/D SCDMA Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
AGFA027R24C2I1VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.7M Logic Elements	-40°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)
AGID023R31B1I2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.3M Logic Elements	-40°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
XCVC1802-1MSIVSVA2197	AMD	IC VERSAL AICORE FPGA 2197BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.3GHz Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2197-BFBGA, FCBGA Supplier Device Package: 2197-FCBGA (45x45)	Package: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.3GHz	Versal™ AI Core FPGA, 1.5M Logic Cells	-40°C ~ 100°C (TJ)	2197-BFBGA, FCBGA	2197-FCBGA (45x45)
AGFA006R24C2I3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 573K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 573K Logic Elements	-40°C ~ 100°C (TJ)	-	-
XCVC1802-2MSEVIVA1596	AMD	IC VERSAL AICORE FPGA 1596BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.4GHz Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1596-BFBGA, FCBGA Supplier Device Package: 1596-FCBGA (40x40)	Package: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ AI Core FPGA, 1.5M Logic Cells	0°C ~ 100°C (TJ)	1596-BFBGA, FCBGA	1596-FCBGA (40x40)
5ASXBB3D4F31I5G	Intel	IC SOC CORTEX-A9 800MHZ 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	Package: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 350K Logic Elements	-40°C ~ 100°C (TJ)	896-BBGA, FCBGA	896-FBGA (31x31)
1SX040HH3F35E2LG	Intel	IC FPGA STRATIX10SX 1152FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 400K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 400K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
AGFA022R24C2E2VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.2M Logic Elements	0°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)