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Altera |
IC SOC FPGA 384 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 270K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,344 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 270K Logic Elements | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
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Altera |
IC SOC FPGA 696 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock4,848 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
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Altera |
IC FPGA 66 I/O 484UBGA
- Architecture: MCU, FPGA
- Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 85K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock4,608 |
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Single ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
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Xilinx Inc. |
IC FPGA 644 I/O 1517FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock7,296 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 926K+ Logic Cells | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock2,624 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 504K+ Logic Cells | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock3,520 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
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Microsemi Corporation |
IC FPGA SOC 90K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock2,976 |
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ARM? Cortex?-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC 10K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 10K Logic Modules
- Operating Temperature: -55°C ~ 125°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock7,440 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | -55°C ~ 125°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Intel |
IC SOC FPGA 240 I/O 672FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 270K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock7,008 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 270K Logic Elements | 0°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA (27x27) |
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Broadcom Limited |
CABLE MODEM
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,656 |
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- | - | - | - | - | - | - | - | - | - |
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Intel |
IC SOC FPGA 396 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 570K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,008 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 570K Logic Elements | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
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Intel |
IC SOC FPGA 396 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,480 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
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Intel |
1152-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,856 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC SOC FPGA 492 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock6,024 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
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Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2957-BFBGA Exposed Pad
- Supplier Device Package: 2957-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
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AMD |
IC VERSAL AICORE FPGA 2197BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 400MHz, 1GHz
- Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1.9M Logic Cells | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
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AMD |
IC VERSAL AICORE FPGA 1596BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.3GHz
- Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1596-BFBGA, FCBGA
- Supplier Device Package: 1596-FCBGA (40x40)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | 0°C ~ 100°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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AMD |
IC ZUP RFSOC A53 FPGA LP 1156BGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
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Microchip Technology |
IC SOC RISC-V 536BGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128KB
- RAM Size: 857.6KB
- Peripherals: DMA, PCI, PWM
- Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 93K Logic Modules
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 536-LFBGA
- Supplier Device Package: 536-BGA (16x16)
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Package: - |
Request a Quote |
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RISC-V | 128KB | 857.6KB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) |
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Intel |
IC FPGA AGILEX-F 2486FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA AGILEX-F 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4M Logic Elements | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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AMD |
IC VERSAL AI-EDGE FPGA 2197BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 400MHz, 1GHz
- Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
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Package: - |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) |