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Microsemi Corporation |
IC FPGA 60K GATES 128KB 288-CSP
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 128KB
- RAM Size: 16KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, I2C, SPI, UART/USART
- Speed: 100MHz
- Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 288-TFBGA, CSPBGA
- Supplier Device Package: 288-CSP (11x11)
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Package: 288-TFBGA, CSPBGA |
Stock2,048 |
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ARM? Cortex?-M3 | 128KB | 16KB | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 100MHz | ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops | 0°C ~ 85°C (TJ) | 288-TFBGA, CSPBGA | 288-CSP (11x11) |
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Altera |
IC SOC FPGA 396 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,720 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) |
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Xilinx Inc. |
IC FPGA 308 I/O 1760FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock6,896 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 926K+ Logic Cells | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) |
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Xilinx Inc. |
IC FPGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock2,960 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex?-7 FPGA, 275K Logic Cells | 0°C ~ 100°C (TJ) | 676-BBGA, FCBGA | 676-FCBGA (27x27) |
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Xilinx Inc. |
IC FPGA 252 I/O 784FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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Package: 784-BBGA, FCBGA |
Stock3,872 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | 784-BBGA, FCBGA | 784-FCBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC 90K LUTS 676FBGA
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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Package: 676-BGA |
Stock4,848 |
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ARM? Cortex?-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | 676-BGA | 676-FBGA (27x27) |
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Microsemi Corporation |
IC FPGA SOC 50K LUTS 484FBGA
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 50K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock6,960 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -40°C ~ 100°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC 60K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 60K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock4,928 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC 60K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 60K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 325-TFBGA
- Supplier Device Package: 325-BGA (11x11)
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Package: 325-TFBGA |
Stock7,936 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | 325-TFBGA | 325-BGA (11x11) |
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Intel |
2397-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,824 |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC SOC FPGA 492 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,576 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
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Intel |
IC FPGA 161 I/O 484FBGA
- Architecture: MCU, FPGA
- Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 40K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock2,480 |
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Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 40K Logic Elements | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
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Intel |
IC FPGA AGILEX-F 1546FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 573K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Renesas Electronics Corporation |
SOC / MOBILE EMMA
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Texas Instruments |
SOC PROCESSOR W/ VIDEO & VISION
- Architecture: DSP, MPU
- Core Processor: ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
- Flash Size: -
- RAM Size: 2.5MB
- Peripherals: DMA, POR, PWM, WDT
- Connectivity: CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
- Speed: 750MHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 760-BFBGA, FCBGA
- Supplier Device Package: 760-FCBGA (23x23)
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Package: - |
Request a Quote |
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ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x | - | 2.5MB | DMA, POR, PWM, WDT | CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB | 750MHz | - | -40°C ~ 125°C (TJ) | 760-BFBGA, FCBGA | 760-FCBGA (23x23) |
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Intel |
IC FPGA AGILEX-I 3948FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 3.54M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3948-BFBGA Exposed Pad
- Supplier Device Package: 3948-BGA (56x56)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 3.54M Logic Elements | -40°C ~ 100°C (TJ) | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) |
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Broadcom Limited |
BCM49408 + BCM43465X2 + BCM20704
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
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AMD |
IC VERSALPRIME ACAP FPGA 1369BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.4GHz
- Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1369-BFBGA
- Supplier Device Package: 1369-BGA (35x35)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 70k Logic Cells | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) |
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Divelbiss Corporation |
P13 PLC ON A CHIP 5 PACK, LQFP-2
- Architecture: MCU
- Core Processor: PLC
- Flash Size: 256KB
- RAM Size: 32KB
- Peripherals: LCD, PWM, WDT
- Connectivity: CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART
- Speed: 12MHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 85°C (TJ)
- Package / Case: 208-LQFP
- Supplier Device Package: 208-LQFP (28x28)
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Package: - |
Request a Quote |
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PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | 208-LQFP | 208-LQFP (28x28) |
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Texas Instruments |
PROTOTYPE
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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GHI Electronics, LLC |
SITCORE SC20100S SOC
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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AMD |
IC VERSAL AICORE FPGA 2197BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 450MHz, 1.08GHz
- Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
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Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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Intel |
IC FPGA AGILEX-I 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Texas Instruments |
PROTOTYPE
- Architecture: DSP, MPU
- Core Processor: C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe, POR, WDT
- Connectivity: Ethernet, I2C, SPI, UART/USART, USB
- Speed: 1.2GHz
- Primary Attributes: -
- Operating Temperature: 0°C ~ 100°C (TC)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: - |
Request a Quote |
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C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | DDR, DMA, PCIe, POR, WDT | Ethernet, I2C, SPI, UART/USART, USB | 1.2GHz | - | 0°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |