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Altera |
IC FPGA 528 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 462K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock6,496 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 462K Logic Elements | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
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Altera |
IC SOC FPGA 696 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 570K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock5,088 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 570K Logic Elements | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
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Altera |
IC FPGA 528 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 700MHz
- Primary Attributes: FPGA - 350K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock7,856 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 350K Logic Elements | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA (40x40) |
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Xilinx Inc. |
IC SOC CORTEX-A9 KINTEX7 676FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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Package: 676-BBGA, FCBGA |
Stock5,568 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex?-7 FPGA, 350K Logic Cells | -40°C ~ 100°C (TJ) | 676-BBGA, FCBGA | 676-FCBGA (27x27) |
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Microsemi Corporation |
IC FPGA SOC 90K LUTS 484FBGA
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock3,264 |
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ARM? Cortex?-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Xilinx Inc. |
IC SOC CORTEX A-9 ZYNQ7 400BGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
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Package: 400-LFBGA, CSPBGA |
Stock3,184 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 85K Logic Cells | -40°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
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Microsemi Corporation |
IC FPGA SOC 60K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 60K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock4,400 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 10K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,736 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | 0°C ~ 85°C (TJ) | - | - |
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Intel |
1152-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,384 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA 161 I/O 484FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 40K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock5,344 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 40K Logic Elements | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
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Intel |
IC FPGA 288 I/O 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 925MHz
- Primary Attributes: FPGA - 110K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BGA |
Stock3,936 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) |
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Texas Instruments |
SOC PROCESSOR W/ HIGHLY-FEATURED
- Architecture: DSP, MPU
- Core Processor: ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
- Flash Size: -
- RAM Size: 2.5MB
- Peripherals: DMA, POR, PWM, WDT
- Connectivity: CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
- Speed: 750MHz, 750MHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 760-BFBGA, FCBGA
- Supplier Device Package: 760-FCBGA (23x23)
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Package: - |
Request a Quote |
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ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x | - | 2.5MB | DMA, POR, PWM, WDT | CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB | 750MHz, 750MHz | - | -40°C ~ 125°C (TJ) | 760-BFBGA, FCBGA | 760-FCBGA (23x23) |
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Intel |
IC FPGA AGILEX-F 1546FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 573K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Texas Instruments |
PROTOTYPE
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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- | - | - | - | - | - | - | - | - | - |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) |
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Intel |
IC FPGA AGILEX-I 3184BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 764K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 764K Logic Elements | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
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Intel |
IC SOC CORTEX-A9 700MHZ 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 700MHz
- Primary Attributes: FPGA - 462K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 462K Logic Elements | 0°C ~ 85°C (TJ) | 896-BBGA, FCBGA | 896-FBGA (31x31) |
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Texas Instruments |
PROTOTYPE
- Architecture: DSP, MPU
- Core Processor: C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe, POR, WDT
- Connectivity: Ethernet, I2C, SPI, UART/USART, USB
- Speed: 1.2GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 100°C (TC)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: - |
Request a Quote |
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C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | DDR, DMA, PCIe, POR, WDT | Ethernet, I2C, SPI, UART/USART, USB | 1.2GHz | - | -40°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
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Intel |
IC FPGA AGILEX-F 2486FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2957-BFBGA Exposed Pad
- Supplier Device Package: 2957-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 573K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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AMD |
IC ZUP RFSOC A53 FPGA LP 1156BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq® UltraScale+™ RFSoC
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | - | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq® UltraScale+™ RFSoC | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) |
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AMD |
IC ZUP RFSOC A53 FPGA 1517BGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.333GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
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Microchip Technology |
IC SOC RISC-V 1152FCBGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128kB
- RAM Size: 3.95MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 461K Logic Modules
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: - |
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RISC-V | 128kB | 3.95MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 461K Logic Modules | -40°C ~ 100°C | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) |
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AMD |
IC VERSAL AI-CORE FPGA 1596BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 400MHz, 1GHz
- Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1596-BFBGA
- Supplier Device Package: 1596-BGA (37.5x37.5)
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Package: - |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1M Logic Cells | -40°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) |