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Altera |
IC FPGA 170 I/O 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 700MHz
- Primary Attributes: FPGA - 462K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BBGA, FCBGA |
Stock4,096 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 462K Logic Elements | 0°C ~ 85°C (TJ) | 896-BBGA, FCBGA | 896-FBGA (31x31) |
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Xilinx Inc. |
IC FPGA 308 I/O 1760FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock6,208 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 1143K+ Logic Cells | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock4,992 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock7,072 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
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Xilinx Inc. |
IC FPGA 252 I/O 784FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 784-BBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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Package: 784-BBGA, FCBGA |
Stock5,200 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 192K+ Logic Cells | -40°C ~ 100°C (TJ) | 784-BBGA, FCBGA | 784-FCBGA (23x23) |
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Microsemi Corporation |
IC FPGA SOC 60K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 60K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-VFBGA (17x17)
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Package: 400-LFBGA |
Stock6,160 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | 400-LFBGA | 400-VFBGA (17x17) |
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Microsemi Corporation |
IC FPGA SOC 10K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 10K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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Package: 484-BGA |
Stock4,032 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | 0°C ~ 85°C (TJ) | 484-BGA | 484-FPBGA (23x23) |
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Xilinx Inc. |
IC FPGA SOC 200I/O 400BGA
- Architecture: MCU, FPGA
- Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix?-7 FPGA, 65K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
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Package: 400-LFBGA, CSPBGA |
Stock4,544 |
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Single ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix?-7 FPGA, 65K Logic Cells | 0°C ~ 85°C (TJ) | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) |
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Altera |
IC FPGA 145 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 925MHz
- Primary Attributes: FPGA - 110K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
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Package: 672-FBGA |
Stock7,376 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) |
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Intel |
2397-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,464 |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC SOC FPGA 588 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock3,952 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
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Intel |
1152-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 480K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock4,416 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 480K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
672-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,536 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA 188 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 25K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
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Package: 672-FBGA |
Stock2,100 |
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Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 25K Logic Elements | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) |
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Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4M Logic Elements | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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Broadcom Limited |
BCM55030 + BCM54640
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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AMD |
IC VERSALPRIME ACAP FPGA 2197BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.4GHz
- Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
- Operating Temperature: -40°C ~ 110°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 1M Logic Cells | -40°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
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Intel |
IC FPGA AGILEX-I 1805FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1805-BBGA Exposed Pad
- Supplier Device Package: 1805-BGA (42.5x42.5)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2100K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2100K Logic Elements | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) |
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Intel |
IC FPGA AGILEX-I 2957BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2957-BFBGA Exposed Pad
- Supplier Device Package: 2957-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 4M Logic Elements | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) |
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Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) |
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Texas Instruments |
PROTOTYPE
- Architecture: DSP, MCU, MPU
- Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
- Flash Size: -
- RAM Size: 1.5MB
- Peripherals: DMA, PWM, WDT
- Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
- Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 827-BFBGA, FCBGA
- Supplier Device Package: 827-FCBGA (24x24)
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Package: - |
Request a Quote |
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ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 125°C (TJ) | 827-BFBGA, FCBGA | 827-FCBGA (24x24) |
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Microchip Technology |
IC SOC RISC-V 484FCBGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128KB
- RAM Size: 1.4125MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 161K Logic Modules
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 484-BFBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
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Package: - |
Request a Quote |
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RISC-V | 128KB | 1.4125MB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) |
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Renesas Electronics Corporation |
SOC, USB 3.0/2.0 CONTROLLER
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Texas Instruments |
PROTOTYPE
- Architecture: DSP, MPU
- Core Processor: C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: -
- Peripherals: DDR, DMA, PCIe, POR, WDT
- Connectivity: Ethernet, I2C, SPI, UART/USART, USB
- Speed: 1.2GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 100°C (TC)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: - |
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C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | - | - | DDR, DMA, PCIe, POR, WDT | Ethernet, I2C, SPI, UART/USART, USB | 1.2GHz | - | -40°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
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Renesas Electronics Corporation |
SOC/SIP
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
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Intel |
IC FPGA STRATIX 10 2912FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) |