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Altera |
IC SOC FPGA 360 I/O 780FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 480K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock7,392 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 480K Logic Elements | 0°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA (29x29) |
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Altera |
IC SOC FPGA 588 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock4,912 |
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
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Altera |
IC FPGA 66 I/O 484UBGA
- Architecture: MCU, FPGA
- Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz
- Primary Attributes: FPGA - 110K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock3,136 |
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Single ARM? Cortex?-A9 MPCore? with CoreSight? | - | 64KB | DMA, POR, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
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Xilinx Inc. |
IC FPGA 204 I/O 900FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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Package: 900-BBGA, FCBGA |
Stock7,936 |
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Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 504K+ Logic Cells | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | 900-FCBGA (31x31) |
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Xilinx Inc. |
IC FPGA 82 I/O 484FCBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 1.3GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
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Package: 484-BBGA, FCBGA |
Stock6,608 |
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Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq?UltraScale+? FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | 484-BBGA, FCBGA | 484-FCBGA (19x19) |
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Xilinx Inc. |
IC FPGA 180 I/O 625FCBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.5GHz
- Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
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Package: 625-BFBGA, FCBGA |
Stock7,488 |
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Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? | - | 256KB | DMA, WDT | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.5GHz | Zynq?UltraScale+? FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) |
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Microsemi Corporation |
IC FPGA SOC 50K LUTS 400VFBGA
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 50K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-VFBGA (17x17)
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Package: 400-LFBGA |
Stock5,216 |
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ARM? Cortex?-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -40°C ~ 100°C (TJ) | 400-LFBGA | 400-VFBGA (17x17) |
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Microsemi Corporation |
IC FPGA SOC 5K LUTS
- Architecture: MCU, FPGA
- Core Processor: ARM? Cortex?-M3
- Flash Size: 128KB
- RAM Size: 64KB
- Peripherals: DDR
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 5K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock4,256 |
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ARM? Cortex?-M3 | 128KB | 64KB | DDR | CAN, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | 144-LQFP | 144-TQFP (20x20) |
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Intel |
IC SOC FPGA 240 I/O 672FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock4,176 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | 0°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA (27x27) |
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Intel |
2397-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,864 |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
1152-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,680 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
672-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,584 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 320K Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
672-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 270K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,200 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 270K Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA 66 I/O 484UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 110K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock5,200 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
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Intel |
IC FPGA 145 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 85K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
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Package: 672-FBGA |
Stock2,720 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) |
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Intel |
IC FPGA 66 I/O 484UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 110K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock5,344 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) |
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Intel |
IC FPGA 224 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz
- Primary Attributes: FPGA - 40K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
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Package: 672-FBGA |
Stock6,828 |
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 40K Logic Elements | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) |
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Ambiq Micro, Inc. |
MCU 192MHZ M4F 2MB FLSH 146BGA
- Architecture: MCU
- Core Processor: ARM® Cortex®-M4F
- Flash Size: 2MB
- RAM Size: 1.375MB
- Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Connectivity: GPIO, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART
- Speed: 192MHz
- Primary Attributes: -
- Operating Temperature: -20°C ~ 60°C
- Package / Case: 146-WFBGA
- Supplier Device Package: 146-BGA (5x5)
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Package: - |
Stock30,000 |
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ARM® Cortex®-M4F | 2MB | 1.375MB | AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | GPIO, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART | 192MHz | - | -20°C ~ 60°C | 146-WFBGA | 146-BGA (5x5) |
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AMD |
IC VERSAL AI-CORE FPGA 2197BGA
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.4GHz
- Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
- Operating Temperature: 0°C ~ 110°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
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Package: - |
Request a Quote |
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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ AI Core FPGA, 1M Logic Cells | 0°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) |
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Microchip Technology |
IC SOC RISC-V 536BGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128KB
- RAM Size: 2.2MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 254K Logic Modules
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 536-LFBGA
- Supplier Device Package: 536-BGA (16x16)
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Package: - |
Request a Quote |
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RISC-V | 128KB | 2.2MB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) |
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Intel |
IC FPGA AGILEX-F 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.9M Logic Elements | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) |
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Texas Instruments |
LOW POWER SOC W/ FULL-FEATURED P
- Architecture: DSP, MPU
- Core Processor: ARM® Cortex®-M4, C66x
- Flash Size: -
- RAM Size: 512kB
- Peripherals: DMA, PWM, WDT
- Connectivity: CANbus, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
- Speed: 212.8MHz, 500MHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 367-BFBGA, FCBGA
- Supplier Device Package: 367-FCBGA (15x15)
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Package: - |
Request a Quote |
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ARM® Cortex®-M4, C66x | - | 512kB | DMA, PWM, WDT | CANbus, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB | 212.8MHz, 500MHz | - | -40°C ~ 125°C (TJ) | 367-BFBGA, FCBGA | 367-FCBGA (15x15) |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Microchip Technology |
IC SOC RISC-V 484FCBGA
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128KB
- RAM Size: 230.4KB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 23K Logic Modules
- Operating Temperature: 0°C ~ 100°C
- Package / Case: 484-BFBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
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Package: - |
Stock27 |
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RISC-V | 128KB | 230.4KB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 23K Logic Modules | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.4M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 1.4M Logic Elements | -40°C ~ 100°C (TJ) | - | - |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) |