Page 94 - Embedded - System On Chip (SoC) | Integrated Circuits (ICs)

A2F060M3E-1FG256
Microsemi Corporation

IC FPGA 60K GATES 128KB 256FBGA

Package: 256-LBGA

Stock3,296
A2F500M3G-FGG256
Microsemi Corporation

IC FPGA 512K FLASH 256FBGA

Package: 256-LBGA

Stock3,024
10AS066K2F35E2LG
Altera

IC SOC FPGA 396 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock2,080
10AS066K4F35I3LG
Altera

IC SOC FPGA 396 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock2,848
XCZU15EG-1FFVB1156I
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Package: 1156-BBGA, FCBGA

Stock2,496
XCZU3CG-L1SBVA484I
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Package: 484-BBGA, FCBGA

Stock4,576
M2S025TS-VFG256I
Microsemi Corporation

IC FPGA SOC 25K LUTS

Package: 256-LBGA

Stock4,896
M2S010-VF256
Microsemi Corporation

IC FPGA SOC 10K LUTS

Package: 256-VFBGA

Stock4,784
M2S005S-VFG256
Microsemi Corporation

IC FPGA SOC 5K LUTS

Package: 256-LBGA

Stock6,688
10AS066K2F40E1SG
Intel

IC SOC FPGA 696 I/O 1517FBGA

Package: 1517-BBGA, FCBGA

Stock4,256
BCM3384DUIFSBG
Broadcom Limited

CABLE MODEM

Package: -

Stock4,352
1SX250LH2F55E1VG
Intel

2912-PIN FBGA

Package: -

Stock3,248
10AS032E2F27E2SG
Intel

672-PIN FBGA

Package: -

Stock3,648
10AS032E4F29I3SG
Intel

780-PIN FBGA

Package: -

Stock3,712
5CSXFC5C6U23I7N
Intel

IC FPGA 145 I/O 672UBGA

Package: 672-FBGA

Stock4,912
AMA3B2KK-KBR
Ambiq Micro, Inc.

MCU 96MHZ M4F 2MB FLSH 108BGA

Package: -

Stock22,164
XCVM1802-2HSIVSVA2197
AMD

IC VERSALPRIME ACAP FPGA 2197BGA

Package: -

Request a Quote
MPFS160T-1FCVG784E
Microchip Technology

IC SOC RISC-V 784FCBGA

Package: -

Stock3
AGIB041R31B1E1VB
Intel

IC

Package: -

Request a Quote
AGIC035R39A1E1VB
Intel

IC FPGA AGILEX-I 3948FBGA

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
A2F060M3E-1FG256	Microsemi Corporation	IC FPGA 60K GATES 128KB 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	Package: 256-LBGA	Stock3,296	ARM? Cortex?-M3	128KB	16KB	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FPBGA (17x17)
A2F500M3G-FGG256	Microsemi Corporation	IC FPGA 512K FLASH 256FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	Package: 256-LBGA	Stock3,024	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	256-LBGA	256-FBGA (17x17)
10AS066K2F35E2LG	Altera	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,080	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
10AS066K4F35I3LG	Altera	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock2,848	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
XCZU15EG-1FFVB1156I	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: 1156-BBGA, FCBGA	Stock2,496	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 747K+ Logic Cells	-40°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
XCZU3CG-L1SBVA484I	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	Package: 484-BBGA, FCBGA	Stock4,576	Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.3GHz	Zynq?UltraScale+? FPGA, 154K+ Logic Cells	-40°C ~ 100°C (TJ)	484-BBGA, FCBGA	484-FCBGA (19x19)
M2S025TS-VFG256I	Microsemi Corporation	IC FPGA SOC 25K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	Package: 256-LBGA	Stock4,896	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	256-LBGA	256-FPBGA (17x17)
M2S010-VF256	Microsemi Corporation	IC FPGA SOC 10K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-VFBGA Supplier Device Package: 256-BGA (17x17)	Package: 256-VFBGA	Stock4,784	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	0°C ~ 85°C (TJ)	256-VFBGA	256-BGA (17x17)
M2S005S-VFG256	Microsemi Corporation	IC FPGA SOC 5K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17)	Package: 256-LBGA	Stock6,688	ARM? Cortex?-M3	128KB	64KB	DDR	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	0°C ~ 85°C (TJ)	256-LBGA	256-FPBGA (17x17)
10AS066K2F40E1SG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock4,256	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
BCM3384DUIFSBG	Broadcom Limited	CABLE MODEM Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,352	-	-	-	-	-	-	-	-	-	-
1SX250LH2F55E1VG	Intel	2912-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock3,248	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2500K Logic Elements	0°C ~ 100°C (TJ)	-	-
10AS032E2F27E2SG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock3,648	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	0°C ~ 100°C (TJ)	-	-
10AS032E4F29I3SG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock3,712	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	-40°C ~ 100°C (TJ)	-	-
5CSXFC5C6U23I7N	Intel	IC FPGA 145 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	Package: 672-FBGA	Stock4,912	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 85K Logic Elements	-40°C ~ 100°C (TJ)	672-FBGA	672-UBGA (23x23)
AMA3B2KK-KBR	Ambiq Micro, Inc.	MCU 96MHZ M4F 2MB FLSH 108BGA Architecture: MCU Core Processor: ARM® Cortex®-M4F Flash Size: 2MB RAM Size: 768KB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: GPIO, I2C, SPI, UART/USART, USB OTG Speed: 96MHz Primary Attributes: - Operating Temperature: -40°C ~ 85°C Package / Case: 108-BGA Supplier Device Package: 108-BGA (5.3x4.3)	Package: -	Stock22,164	ARM® Cortex®-M4F	2MB	768KB	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT	GPIO, I2C, SPI, UART/USART, USB OTG	96MHz	-	-40°C ~ 85°C	108-BGA	108-BGA (5.3x4.3)
XCVM1802-2HSIVSVA2197	AMD	IC VERSALPRIME ACAP FPGA 2197BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz, 1.65GHz Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2197-BFBGA, FCBGA Supplier Device Package: 2197-FCBGA (45x45)	Package: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz, 1.65GHz	Versal™ Prime FPGA, 1.9M Logic Cells	-40°C ~ 100°C (TJ)	2197-BFBGA, FCBGA	2197-FCBGA (45x45)
MPFS160T-1FCVG784E	Microchip Technology	IC SOC RISC-V 784FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 1.4125MB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 161K Logic Modules Operating Temperature: 0°C ~ 100°C Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: -	Stock3	RISC-V	128kB	1.4125MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 161K Logic Modules	0°C ~ 100°C	784-BFBGA, FCBGA	784-FCBGA (23x23)
AGIB041R31B1E1VB	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	0°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
AGIC035R39A1E1VB	Intel	IC FPGA AGILEX-I 3948FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 3.54M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 3.54M Logic Elements	0°C ~ 100°C (TJ)	3948-BFBGA Exposed Pad	3948-BGA (56x56)
TCI6630K2LCMSA2	Texas Instruments	PROTOTYPE Architecture: DSP, MPU Core Processor: Dual ARM® Cortex®-A15 MPCore™ with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe, POR, WDT Connectivity: Ethernet, I2C, PCIe, SPI, UART/USART, USB Speed: 1.2GHz Primary Attributes: - Operating Temperature: -40°C ~ 100°C Package / Case: 900-BFBGA, FCBGA Supplier Device Package: 900-FCBGA (25x25)	Package: -	Request a Quote	Dual ARM® Cortex®-A15 MPCore™ with CoreSight™	-	-	DDR, DMA, PCIe, POR, WDT	Ethernet, I2C, PCIe, SPI, UART/USART, USB	1.2GHz	-	-40°C ~ 100°C	900-BFBGA, FCBGA	900-FCBGA (25x25)
XCZU65DR-L2FSVE1156I	AMD	IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: - Connectivity: - Speed: 533MHz, 1.333GHz Primary Attributes: Zynq® UltraScale+™ RFSoC Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	-	-	533MHz, 1.333GHz	Zynq® UltraScale+™ RFSoC	-40°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
AGFA019R24C3E4X	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.9M Logic Elements	0°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)
MPFS250TS-1FCVG784I	Microchip Technology	IC SOC RISC-V 784FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 2.2MB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 254K Logic Modules Operating Temperature: -40°C ~ 100°C Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	Package: -	Stock6	RISC-V	128kB	2.2MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 254K Logic Modules	-40°C ~ 100°C	784-BFBGA, FCBGA	784-FCBGA (23x23)
AGFD023R24C2I3E	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.3M Logic Elements	-40°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)
1SX280HH3F55I3VG	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	-40°C ~ 100°C (TJ)	2912-BBGA, FCBGA	2912-FBGA, FC (55x55)
XCZU47DR-2FSVE1156E	AMD	IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.333GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	Package: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.333GHz	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	0°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
XCVM1802-2MSIVSVA2197	AMD	IC VERSAL AICORE FPGA 2197BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.4GHz Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2197-BFBGA, FCBGA Supplier Device Package: 2197-FCBGA (45x45)	Package: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 1.9M Logic Cells	-40°C ~ 100°C (TJ)	2197-BFBGA, FCBGA	2197-FCBGA (45x45)