Page 10 - Intel Products | Heisener Electronics

10AS048H2F34I2SG
Intel

1152-PIN FBGA

Package: -

Stock4,656
EPF8452AQC160-3AC
Intel

IC FPGA

Package: 160-BQFP

Stock7,008
EP20K200QC208-3
Intel

IC FPGA

Package: 208-BFQFP

Stock5,424
EP20K200EBC356-1
Intel

IC FPGA 271 I/O 356BGA

Package: 356-LBGA

Stock6,208
5SEEBH40I2L
Intel

IC FPGA 696 I/O 1517HBGA

Package: 1517-BBGA, FCBGA

Stock2,208
5SGXEB9R3H43C2LN
Intel

IC FPGA 600 I/O 1760HBGA

Package: 1760-BBGA, FCBGA

Stock4,752
5SGXMA9N3F45C3N
Intel

IC FPGA 840 I/O 1932FBGA

Package: 1932-BBGA, FCBGA

Stock2,128
5SGXEA4H1F35C1N
Intel

IC FPGA 552 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock3,520
EP2S130F1020C4
Intel

IC FPGA 742 I/O 1020FBGA

Package: 1020-BBGA

Stock5,696
5SGXEA5H2F35I3N
Intel

IC FPGA 552 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock4,464
5SGXEA7H3F35C3
Intel

IC FPGA 552 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock4,112
5AGXMA5D4F27C4G
Intel

IC FPGA 336 I/O 672FBGA

Package: 672-BBGA, FCBGA

Stock6,144
EPM7256BTC100-10N
Intel

IC CPLD 256MC 10NS 100TQFP

Package: 100-TQFP

Stock4,016
EPM7064BTC44-7
Intel

IC CPLD 64MC 7.5NS 44TQFP

Package: 44-TQFP

Stock4,048
EPM3064ALC44-10
Intel

IC CPLD 64MC 10NS 44PLCC

Package: 44-LCC (J-Lead)

Stock4,528
EP4SGX110DF29C4G
Intel

IC FPGA 372 I/O 780FBGA

Package: 780-BBGA, FCBGA

Stock4,240
NE80546KG0962MM
Intel

LOW VOLTAGE INTEL XEON PROCESSOR

Package: -

Request a Quote
5SGSMD3E2H29C2LG
Intel

IC FPGA 360 I/O 780HBGA

Package: -

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1SX280HU3F50I1VG
Intel

IC FPGA STRATIX 10 2397FBGA

Package: -

Request a Quote
5SGXEA7N2F45C3WN
Intel

IC FPGA 840 I/O 1932FBGA

Package: -

Request a Quote

Part Number	Manufacturer	Description	Package	Stock
10AS048H2F34I2SG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock4,656
EPF8452AQC160-3AC	Intel	IC FPGA Number of LABs/CLBs: 42 Number of Logic Elements/Cells: 336 Total RAM Bits: - Number of I/O: 120 Number of Gates: 4000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	Package: 160-BQFP	Stock7,008
EP20K200QC208-3	Intel	IC FPGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 144 Number of Gates: 526000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock5,424
EP20K200EBC356-1	Intel	IC FPGA 271 I/O 356BGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 271 Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	Package: 356-LBGA	Stock6,208
5SEEBH40I2L	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 359250 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	Package: 1517-BBGA, FCBGA	Stock2,208
5SGXEB9R3H43C2LN	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 64210944 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	Package: 1760-BBGA, FCBGA	Stock4,752
5SGXMA9N3F45C3N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 64210944 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: 1932-BBGA, FCBGA	Stock2,128
5SGXEA4H1F35C1N	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock3,520
EP2S130F1020C4	Intel	IC FPGA 742 I/O 1020FBGA Number of LABs/CLBs: 6627 Number of Logic Elements/Cells: 132540 Total RAM Bits: 6747840 Number of I/O: 742 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	Package: 1020-BBGA	Stock5,696
5SGXEA5H2F35I3N	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock4,464
5SGXEA7H3F35C3	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock4,112
5AGXMA5D4F27C4G	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 8962 Number of Logic Elements/Cells: 190000 Total RAM Bits: 13284352 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA, FC (27x27)	Package: 672-BBGA, FCBGA	Stock6,144
EPM7256BTC100-10N	Intel	IC CPLD 256MC 10NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	Package: 100-TQFP	Stock4,016
EPM7064BTC44-7	Intel	IC CPLD 64MC 7.5NS 44TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 36 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	Package: 44-TQFP	Stock4,048
EPM3064ALC44-10	Intel	IC CPLD 64MC 10NS 44PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	Package: 44-LCC (J-Lead)	Stock4,528
EP4SGX110DF29C4G	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 4224 Number of Logic Elements/Cells: 105600 Total RAM Bits: 9793536 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock4,240
NE80546KG0962MM	Intel	LOW VOLTAGE INTEL XEON PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
5SGSMD3E2H29C2LG	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	Package: -	Request a Quote
1SX280HU3F50I1VG	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote
5SGXEA7N2F45C3WN	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
MD82C288-6	Intel	BUS CONTROLLER, CMOS, CDIP20 Protocol: - Function: Controller Interface: Bus Standards: - Voltage - Supply: 4.75V ~ 5.25V Current - Supply: 75mA Operating Temperature: 0°C ~ 85°C (TC) Package / Case: 20-CDIP Supplier Device Package: 20-CERDIP	Package: -	Request a Quote
NG80960JA25	Intel	RISC MPU, 32-BIT, 25MHZ PQFP132 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
5SGXEA7N1F40I2G	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	Package: -	Request a Quote
5SGSED8N1F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
AGFB014R24D2I3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
AGFD023R31C2I3V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	Package: -	Request a Quote
AGFB014R24B1E1V	Intel	IC FPGA AGILEX-F 2486FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
1ST250EU3F50E3VG	Intel	IC FPGA 440 I/O 2397BGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	Package: -	Request a Quote