|
|
Intel |
IC SOC FPGA 396 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock2,400 |
|
|
|
Intel |
IC SOC FPGA 288 I/O 780FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 220K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
|
Package: 780-BBGA, FCBGA |
Stock4,416 |
|
|
|
Intel |
IC FPGA 145 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 110K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
|
Package: 672-FBGA |
Stock6,036 |
|
|
|
Intel |
IC FPGA APEX 1020FBGA
- Number of LABs/CLBs: 7904
- Number of Logic Elements/Cells: 79040
- Total RAM Bits: 5658048
- Number of I/O: 782
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: -
- Package / Case: 1020-BBGA
- Supplier Device Package: 1020-FBGA (33x33)
|
Package: 1020-BBGA |
Stock2,432 |
|
|
|
Intel |
IC FPGA 184 I/O 240RQFP
- Number of LABs/CLBs: 126
- Number of Logic Elements/Cells: 1008
- Total RAM Bits: -
- Number of I/O: 184
- Number of Gates: 12000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 240-BFQFP Exposed Pad
- Supplier Device Package: 240-RQFP (32x32)
|
Package: 240-BFQFP Exposed Pad |
Stock7,664 |
|
|
|
Intel |
IC FPGA 220 I/O 356BGA
- Number of LABs/CLBs: 360
- Number of Logic Elements/Cells: 2880
- Total RAM Bits: 40960
- Number of I/O: 220
- Number of Gates: 199000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
|
Package: 356-LBGA |
Stock7,264 |
|
|
|
Intel |
IC FPGA 92 I/O 144TQFP
- Number of LABs/CLBs: 120
- Number of Logic Elements/Cells: 1200
- Total RAM Bits: 24576
- Number of I/O: 92
- Number of Gates: 113000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
|
Package: 144-LQFP |
Stock6,544 |
|
|
|
Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock7,056 |
|
|
|
Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock7,440 |
|
|
|
Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 53105664
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock3,760 |
|
|
|
Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 43983872
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock7,136 |
|
|
|
Intel |
IC FPGA 372 I/O 1780FBGA
- Number of LABs/CLBs: 7612
- Number of Logic Elements/Cells: 181165
- Total RAM Bits: 10177536
- Number of I/O: 372
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
|
Package: 780-BBGA, FCBGA |
Stock5,792 |
|
|
|
Intel |
IC FPGA 270 I/O 484FBGA
- Number of LABs/CLBs: 9360
- Number of Logic Elements/Cells: 149760
- Total RAM Bits: 6635520
- Number of I/O: 270
- Number of Gates: -
- Voltage - Supply: 1.16 V ~ 1.24 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BGA |
Stock5,904 |
|
|
|
Intel |
IC FPGA 292 I/O 484FBGA
- Number of LABs/CLBs: 4713
- Number of Logic Elements/Cells: 75408
- Total RAM Bits: 2810880
- Number of I/O: 292
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BGA |
Stock5,504 |
|
|
|
Intel |
IC FPGA 224 I/O 484FBGA
- Number of LABs/CLBs: 18480
- Number of Logic Elements/Cells: 49000
- Total RAM Bits: 3464192
- Number of I/O: 224
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BGA |
Stock5,760 |
|
|
|
Intel |
IC CPLD 128MC 15NS 160QFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 15.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 128
- Number of Gates: 2500
- Number of I/O: 100
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
|
Package: 160-BQFP |
Stock4,512 |
|
|
|
Intel |
IC CPLD 440MC 9NS 256FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 9.0ns
- Voltage Supply - Internal: 1.71 V ~ 1.89 V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 159
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FBGA (17x17)
|
Package: 256-LBGA |
Stock6,800 |
|
|
|
Intel |
IC FPGA 416 I/O 896FBGA
- Number of LABs/CLBs: 7362
- Number of Logic Elements/Cells: 156000
- Total RAM Bits: 11746304
- Number of I/O: 416
- Number of Gates: -
- Voltage - Supply: 1.12V ~ 1.18V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
|
Package: 896-BBGA, FCBGA |
Stock2,592 |
|
|
|
Intel |
IC FPGA 289 I/O 780HBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
SINGLE-CHIP 8 BIT MCU
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA STRATIX10GX 1152FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: 378000
- Total RAM Bits: 31457280
- Number of I/O: 374
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 704 I/O 2397BGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 3184BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC CPLD 1700MC 7NS 256FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7 ns
- Voltage Supply - Internal: 1.71V ~ 1.89V
- Number of Logic Elements/Blocks: 2210
- Number of Macrocells: 1700
- Number of Gates: -
- Number of I/O: 272
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 734 I/O 1517FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|