|
|
Intel |
IC SOC FPGA 696 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock4,688 |
|
|
|
Intel |
IC FPGA 145 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz
- Primary Attributes: FPGA - 110K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
|
Package: 672-FBGA |
Stock6,320 |
|
|
|
Intel |
IC FPGA APEX 1020FBGA
- Number of LABs/CLBs: 5712
- Number of Logic Elements/Cells: 57120
- Total RAM Bits: 5215104
- Number of I/O: 782
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: -
- Package / Case: 1020-BBGA
- Supplier Device Package: 1020-FBGA (33x33)
|
Package: 1020-BBGA |
Stock4,752 |
|
|
|
Intel |
IC FPGA 240 I/O 672FBGA
- Number of LABs/CLBs: 101620
- Number of Logic Elements/Cells: 270000
- Total RAM Bits: 17870848
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.98 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
|
Package: 672-BBGA, FCBGA |
Stock4,624 |
|
|
|
Intel |
IC FPGA 271 I/O 356BGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 8320
- Total RAM Bits: 106496
- Number of I/O: 271
- Number of Gates: 526000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
|
Package: 356-LBGA |
Stock7,008 |
|
|
|
Intel |
IC FPGA 822 I/O 1508FBGA
- Number of LABs/CLBs: 4125
- Number of Logic Elements/Cells: 41250
- Total RAM Bits: 3423744
- Number of I/O: 822
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1508-BBGA, FCBGA
- Supplier Device Package: 1508-FBGA (30x30)
|
Package: 1508-BBGA, FCBGA |
Stock6,960 |
|
|
|
Intel |
IC FPGA 586 I/O 780FBGA
- Number of LABs/CLBs: 1846
- Number of Logic Elements/Cells: 18460
- Total RAM Bits: 1669248
- Number of I/O: 586
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
|
Package: 780-BBGA, FCBGA |
Stock5,376 |
|
|
|
Intel |
IC FPGA 72 I/O 169FBGA
- Number of LABs/CLBs: 1840
- Number of Logic Elements/Cells: 29440
- Total RAM Bits: 1105920
- Number of I/O: 72
- Number of Gates: -
- Voltage - Supply: 1.16 V ~ 1.24 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 169-LBGA
- Supplier Device Package: 169-FBGA (14x14)
|
Package: 169-LBGA |
Stock5,680 |
|
|
|
Intel |
IC FPGA 600 I/O 1517FBGA
- Number of LABs/CLBs: 234750
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59938816
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock3,008 |
|
|
|
Intel |
IC FPGA 432 I/O 1517FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 61688832
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock5,376 |
|
|
|
Intel |
IC FPGA 488 I/O 780HBGA
- Number of LABs/CLBs: 14144
- Number of Logic Elements/Cells: 353600
- Total RAM Bits: 23105536
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
|
Package: 780-BBGA, FCBGA |
Stock3,264 |
|
|
|
Intel |
IC FPGA 744 I/O 1517FBGA
- Number of LABs/CLBs: 7030
- Number of Logic Elements/Cells: 175750
- Total RAM Bits: 13954048
- Number of I/O: 744
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock4,704 |
|
|
|
Intel |
IC FPGA 240 I/O 484UBGA
- Number of LABs/CLBs: 113560
- Number of Logic Elements/Cells: 301000
- Total RAM Bits: 14251008
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
|
Package: 484-FBGA |
Stock6,160 |
|
|
|
Intel |
IC FPGA 280 I/O 484FBGA
- Number of LABs/CLBs: 7155
- Number of Logic Elements/Cells: 114480
- Total RAM Bits: 3981312
- Number of I/O: 280
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BGA |
Stock2,336 |
|
|
|
Intel |
IC FPGA 230 I/O 484FBGA
- Number of LABs/CLBs: 1676
- Number of Logic Elements/Cells: 33520
- Total RAM Bits: 1348416
- Number of I/O: 230
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BBGA |
Stock2,688 |
|
|
|
Intel |
484-PIN UBGA
- Number of LABs/CLBs: 38000
- Number of Logic Elements/Cells: 104000
- Total RAM Bits: 8641536
- Number of I/O: 188
- Number of Gates: -
- Voltage - Supply: 0.9V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BFBGA, FCBGA
- Supplier Device Package: 484-UBGA (19x19)
|
Package: 484-BFBGA, FCBGA |
Stock6,192 |
|
|
|
Intel |
IC FPGA 195 I/O 324FBGA
- Number of LABs/CLBs: 2475
- Number of Logic Elements/Cells: 39600
- Total RAM Bits: 1161216
- Number of I/O: 195
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 324-BGA
- Supplier Device Package: 324-FBGA (19x19)
|
Package: 324-BGA |
Stock5,808 |
|
|
|
Intel |
IC CPLD 256MC 7.5NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 2.375 V ~ 2.625 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 256
- Number of Gates: 5000
- Number of I/O: 120
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
|
Package: 144-LQFP |
Stock5,600 |
|
|
|
Intel |
IC CPLD 64MC 15NS 68PLCC
- Programmable Type: EE PLD
- Delay Time tpd(1) Max: 15.0ns
- Voltage Supply - Internal: 4.5 V ~ 5.5 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 52
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 68-LCC (J-Lead)
- Supplier Device Package: 68-PLCC (24x24)
|
Package: 68-LCC (J-Lead) |
Stock5,664 |
|
|
|
Intel |
IC CPLD 64MC 3.5NS 44TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 3.5ns
- Voltage Supply - Internal: 2.375 V ~ 2.625 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 36
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-TQFP
- Supplier Device Package: 44-TQFP (10x10)
|
Package: 44-TQFP |
Stock2,096 |
|
|
|
Intel |
IC CPLD 64MC 7.5NS 44TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 4.5 V ~ 5.5 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 36
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-TQFP
- Supplier Device Package: 44-TQFP (10x10)
|
Package: 44-TQFP |
Stock27,720 |
|
|
|
Intel |
IC CPLD 256MC 5.5NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 5.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 256
- Number of Gates: 5000
- Number of I/O: 120
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
|
Package: 144-LQFP |
Stock6,768 |
|
|
|
Intel |
IC FPGA 544 I/O 1152FBGA
- Number of LABs/CLBs: 17110
- Number of Logic Elements/Cells: 362000
- Total RAM Bits: 19822592
- Number of I/O: 544
- Number of Gates: -
- Voltage - Supply: 1.07V ~ 1.13V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock6,944 |
|
|
|
Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 600 I/O 1517FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 764K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 764K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC MPU INTEL XEON 3.2GHZ 604PPGA
- Core Processor: Intel® Xeon® Processor
- Number of Cores/Bus Width: 1 Core, 64-Bit
- Speed: 3.2GHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.25V, 1.388V
- Operating Temperature: 72°C (TC)
- Security Features: -
- Package / Case: 604-PGA
- Supplier Device Package: 604-PPGA (42.5x42.5)
|
Package: - |
Request a Quote |
|