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Intel |
1152-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock5,184 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 42
- Number of Logic Elements/Cells: 336
- Total RAM Bits: -
- Number of I/O: 78
- Number of Gates: 4000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: 100-TQFP |
Stock2,336 |
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Intel |
IC FPGA 184 I/O 240QFP
- Number of LABs/CLBs: 126
- Number of Logic Elements/Cells: 1008
- Total RAM Bits: -
- Number of I/O: 184
- Number of Gates: 12000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-PQFP (32x32)
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Package: 240-BFQFP |
Stock6,432 |
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Intel |
IC FPGA 369 I/O 484FBGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 6656
- Total RAM Bits: 65536
- Number of I/O: 369
- Number of Gates: 342000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA |
Stock46,080 |
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Intel |
IC FPGA 508 I/O 672FBGA
- Number of LABs/CLBs: 3840
- Number of Logic Elements/Cells: 38400
- Total RAM Bits: 327680
- Number of I/O: 508
- Number of Gates: 1772000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock3,216 |
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Intel |
IC FPGA 136 I/O 256FBGA
- Number of LABs/CLBs: 72
- Number of Logic Elements/Cells: 576
- Total RAM Bits: 12288
- Number of I/O: 136
- Number of Gates: 56000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 256-BBGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-BBGA |
Stock5,872 |
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Intel |
IC FPGA 345 I/O 672FBGA
- Number of LABs/CLBs: 1057
- Number of Logic Elements/Cells: 10570
- Total RAM Bits: 920448
- Number of I/O: 345
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA |
Stock6,096 |
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Intel |
IC FPGA 1120 I/O 1760FBGA
- Number of LABs/CLBs: 13500
- Number of Logic Elements/Cells: 337500
- Total RAM Bits: 18822144
- Number of I/O: 1120
- Number of Gates: -
- Voltage - Supply: 0.86 V ~ 1.15 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock7,488 |
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Intel |
IC FPGA 654 I/O 1517FBGA
- Number of LABs/CLBs: 9120
- Number of Logic Elements/Cells: 228000
- Total RAM Bits: 17544192
- Number of I/O: 654
- Number of Gates: -
- Voltage - Supply: 0.92 V ~ 0.98 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock2,288 |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 262400
- Number of Logic Elements/Cells: 695000
- Total RAM Bits: 60968960
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock5,568 |
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Intel |
IC FPGA 624 I/O 1932FCBGA
- Number of LABs/CLBs: 339620
- Number of Logic Elements/Cells: 900000
- Total RAM Bits: 59234304
- Number of I/O: 624
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock6,496 |
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Intel |
IC FPGA 360 I/O 780HBGA
- Number of LABs/CLBs: 135840
- Number of Logic Elements/Cells: 360000
- Total RAM Bits: 23946240
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
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Package: 780-BBGA, FCBGA |
Stock4,896 |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 23704576
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,176 |
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Intel |
IC CPLD 560MC 10NS 356BGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 35
- Number of Macrocells: 560
- Number of Gates: 12000
- Number of I/O: 216
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
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Package: 356-LBGA |
Stock4,256 |
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Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 53248000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 262400
- Number of Logic Elements/Cells: 695000
- Total RAM Bits: 51200000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 744 I/O 1517FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 780HBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 19456000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 359250
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 53248000
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 172600
- Number of Logic Elements/Cells: 457000
- Total RAM Bits: 39936000
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC CPLD 1700MC 9.1NS 324FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 9.1 ns
- Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
- Number of Logic Elements/Blocks: 2210
- Number of Macrocells: 1700
- Number of Gates: -
- Number of I/O: 272
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 324-BGA
- Supplier Device Package: 324-FBGA (19x19)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 544 I/O 1152FBGA
- Number of LABs/CLBs: 158491
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 23625728
- Number of I/O: 544
- Number of Gates: -
- Voltage - Supply: 1.07V ~ 1.13V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA, FC (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 152 I/O 256FBGA
- Number of LABs/CLBs: 903
- Number of Logic Elements/Cells: 14448
- Total RAM Bits: 239616
- Number of I/O: 152
- Number of Gates: -
- Voltage - Supply: 1.15V ~ 1.25V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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