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Intel |
IC SOC FPGA 492 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 570K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,184 |
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Intel |
IC FPGA 528 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 350K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock7,984 |
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Intel |
672-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock7,296 |
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Intel |
IC FPGA 288 I/O 896FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 85K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 896-BGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BGA |
Stock6,384 |
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Intel |
IC FPGA 188 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: FPGA - 25K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
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Package: 672-FBGA |
Stock6,480 |
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Intel |
IC FPGA FBGA
- Number of LABs/CLBs: 598
- Number of Logic Elements/Cells: 5980
- Total RAM Bits: 92160
- Number of I/O: 185
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: 256-BGA |
Stock2,192 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 3840
- Number of Logic Elements/Cells: 38400
- Total RAM Bits: 327680
- Number of I/O: -
- Number of Gates: 1772000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock2,304 |
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Intel |
IC FPGA APEX 20KC 1020-FBGA
- Number of LABs/CLBs: 3840
- Number of Logic Elements/Cells: 38400
- Total RAM Bits: 327680
- Number of I/O: 708
- Number of Gates: 1772000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1020-BBGA
- Supplier Device Package: 1020-FBGA (33x33)
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Package: 1020-BBGA |
Stock3,600 |
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Intel |
IC FPGA 147 I/O 208QFP
- Number of LABs/CLBs: 360
- Number of Logic Elements/Cells: 2880
- Total RAM Bits: 40960
- Number of I/O: 147
- Number of Gates: 199000
- Voltage - Supply: 2.3 V ~ 2.7 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
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Package: 208-BFQFP |
Stock5,136 |
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Intel |
IC FPGA 612 I/O 1152FBGA
- Number of LABs/CLBs: 7612
- Number of Logic Elements/Cells: 181165
- Total RAM Bits: 10177536
- Number of I/O: 612
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,328 |
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Intel |
IC FPGA 345 I/O 672FBGA
- Number of LABs/CLBs: 1057
- Number of Logic Elements/Cells: 10570
- Total RAM Bits: 920448
- Number of I/O: 345
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-BBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA |
Stock4,752 |
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Intel |
IC FPGA 1120 I/O 1760FBGA
- Number of LABs/CLBs: 21248
- Number of Logic Elements/Cells: 531200
- Total RAM Bits: 28033024
- Number of I/O: 1120
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock4,192 |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 53105664
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock3,424 |
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Intel |
IC FPGA 360 I/O 780HBGA
- Number of LABs/CLBs: 89000
- Number of Logic Elements/Cells: 236000
- Total RAM Bits: 16937984
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-HBGA (33x33)
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Package: 780-BBGA, FCBGA |
Stock4,800 |
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Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 65561600
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
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Package: 1517-BBGA, FCBGA |
Stock2,752 |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 43983872
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock3,088 |
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Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 65561600
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
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Package: 1517-BBGA, FCBGA |
Stock6,768 |
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Intel |
IC FPGA 544 I/O 1152FBGA
- Number of LABs/CLBs: 8962
- Number of Logic Elements/Cells: 190000
- Total RAM Bits: 13284352
- Number of I/O: 544
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA Exposed Pad
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA Exposed Pad |
Stock6,576 |
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Intel |
IC FPGA 240 I/O 484UBGA
- Number of LABs/CLBs: 113560
- Number of Logic Elements/Cells: 301000
- Total RAM Bits: 14251008
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock7,952 |
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Intel |
IC CPLD 64MC 7.5NS 44PLCC
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 36
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock7,552 |
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Intel |
IC MPU INTEL PENT 1GHZ 370PPGA
- Core Processor: Intel® Pentium® III Processor
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1GHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.75V
- Operating Temperature: 75°C (TC)
- Security Features: -
- Package / Case: 370-PGA
- Supplier Device Package: 370-PPGA (49x49)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1760HBGA
- Number of LABs/CLBs: 317000
- Number of Logic Elements/Cells: 840000
- Total RAM Bits: 53248000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-HBGA (45x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 1160 I/O 2912BGA
- Number of LABs/CLBs: 312500
- Number of Logic Elements/Cells: 2500000
- Total RAM Bits: -
- Number of I/O: 1160
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 1120 I/O 1760FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 744 I/O 1152FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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