|
|
Intel |
IC SOC FPGA 588 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock6,000 |
|
|
|
Intel |
IC SOC FPGA 492 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 480K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock5,824 |
|
|
|
Intel |
IC FPGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 8320
- Total RAM Bits: 106496
- Number of I/O: 277
- Number of Gates: 526000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
|
Package: 356-LBGA |
Stock5,568 |
|
|
|
Intel |
IC FPGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 8320
- Total RAM Bits: 106496
- Number of I/O: 382
- Number of Gates: 526000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BBGA |
Stock4,176 |
|
|
|
Intel |
IC FPGA 191 I/O 256FBGA
- Number of LABs/CLBs: 216
- Number of Logic Elements/Cells: 1728
- Total RAM Bits: 12288
- Number of I/O: 191
- Number of Gates: 69000
- Voltage - Supply: 3 V ~ 3.6 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
|
Package: 256-BGA |
Stock6,992 |
|
|
|
Intel |
IC FPGA 473 I/O 672FBGA
- Number of LABs/CLBs: 2566
- Number of Logic Elements/Cells: 25660
- Total RAM Bits: 1944576
- Number of I/O: 473
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-BBGA
- Supplier Device Package: 672-FBGA (27x27)
|
Package: 672-BBGA |
Stock5,760 |
|
|
|
Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock4,672 |
|
|
|
Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 317000
- Number of Logic Elements/Cells: 840000
- Total RAM Bits: 64210944
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
|
Package: 1517-BBGA, FCBGA |
Stock3,232 |
|
|
|
Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 23704576
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock6,784 |
|
|
|
Intel |
IC FPGA 528 I/O 780FBGA
- Number of LABs/CLBs: 7155
- Number of Logic Elements/Cells: 114480
- Total RAM Bits: 3981312
- Number of I/O: 528
- Number of Gates: -
- Voltage - Supply: 0.97 V ~ 1.03 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BGA
- Supplier Device Package: 780-FBGA (29x29)
|
Package: 780-BGA |
Stock7,856 |
|
|
|
Intel |
IC FPGA 240 I/O 484MBGA
- Number of LABs/CLBs: 56480
- Number of Logic Elements/Cells: 149500
- Total RAM Bits: 7880704
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-LFBGA
- Supplier Device Package: 484-MBGA (15x15)
|
Package: 484-LFBGA |
Stock6,048 |
|
|
|
Intel |
IC FPGA 301 I/O 400FBGA
- Number of LABs/CLBs: 2006
- Number of Logic Elements/Cells: 20060
- Total RAM Bits: 294912
- Number of I/O: 301
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-BGA
- Supplier Device Package: 400-FBGA (21x21)
|
Package: 400-BGA |
Stock6,192 |
|
|
|
Intel |
IC FPGA 233 I/O 324FBGA
- Number of LABs/CLBs: 2006
- Number of Logic Elements/Cells: 20060
- Total RAM Bits: 294912
- Number of I/O: 233
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 324-BGA
- Supplier Device Package: 324-FBGA (19x19)
|
Package: 324-BGA |
Stock15,228 |
|
|
|
Intel |
IC FPGA 360 I/O 484FBGA
- Number of LABs/CLBs: 2500
- Number of Logic Elements/Cells: 40000
- Total RAM Bits: 1290240
- Number of I/O: 360
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BGA |
Stock3,472 |
|
|
|
Intel |
IC FPGA 101 I/O 144EQFP
- Number of LABs/CLBs: 1563
- Number of Logic Elements/Cells: 25000
- Total RAM Bits: 691200
- Number of I/O: 101
- Number of Gates: -
- Voltage - Supply: 2.85 V ~ 3.465 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-EQFP (20x20)
|
Package: 144-LQFP Exposed Pad |
Stock16,104 |
|
|
|
Intel |
IC CPLD 64MC 5NS 49FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 5.0ns
- Voltage Supply - Internal: 2.375 V ~ 2.625 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 41
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock2,752 |
|
|
|
Intel |
IC CPLD 256MC 10NS 208QFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 256
- Number of Gates: 5000
- Number of I/O: 158
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 208-BFQFP
- Supplier Device Package: 208-PQFP (28x28)
|
Package: 208-BFQFP |
Stock3,872 |
|
|
|
Intel |
IC FPGA AGILEX-I 3948FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4.047M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 3948-BFBGA Exposed Pad
- Supplier Device Package: 3948-BGA (56x56)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 220000
- Number of Logic Elements/Cells: 583000
- Total RAM Bits: 46080000
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 1160 I/O 2912BGA
- Number of LABs/CLBs: 312500
- Number of Logic Elements/Cells: 2500000
- Total RAM Bits: -
- Number of I/O: 1160
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-I 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 53248000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-I 3184BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 600 I/O 1517FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: - |
Request a Quote |
|