|
|
Intel |
IC MPU XSCALE 400MHZ 492BGA
- Core Processor: Xscale
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100 Mbps (2)
- SATA: -
- USB: USB 1.1 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: Cryptography
- Package / Case: 492-BBGA
- Supplier Device Package: 492-BGA (35x35)
|
Package: 492-BBGA |
Stock6,352 |
|
|
|
Intel |
780-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock6,832 |
|
|
|
Intel |
780-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 320K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock6,448 |
|
|
|
Intel |
IC CONFIG DEVICE 100QFP
- Programmable Type: In System Programmable
- Memory Size: 8MB
- Voltage - Supply: 3 V ~ 3.6 V
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 100-BQFP
- Supplier Device Package: 100-PQFP (20x14)
|
Package: 100-BQFP |
Stock6,464 |
|
|
|
Intel |
IC FPGA 320 I/O 484FBGA
- Number of LABs/CLBs: 1000
- Number of Logic Elements/Cells: 16000
- Total RAM Bits: 562176
- Number of I/O: 320
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BGA |
Stock6,304 |
|
|
|
Intel |
IC FPGA
- Number of LABs/CLBs: 1664
- Number of Logic Elements/Cells: 16640
- Total RAM Bits: 425984
- Number of I/O: -
- Number of Gates: 1900000
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Stock4,656 |
|
|
|
Intel |
IC FPGA
- Number of LABs/CLBs: 416
- Number of Logic Elements/Cells: 4160
- Total RAM Bits: 53248
- Number of I/O: -
- Number of Gates: 263000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 196-BGA
- Supplier Device Package: 196-BGA
|
Package: 196-BGA |
Stock5,344 |
|
|
|
Intel |
IC FPGA 600 I/O 1517FCBGA
- Number of LABs/CLBs: 427200
- Number of Logic Elements/Cells: 1150000
- Total RAM Bits: 68857856
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock2,100 |
|
|
|
Intel |
IC FPGA 382 I/O 484FBGA
- Number of LABs/CLBs: 832
- Number of Logic Elements/Cells: 8320
- Total RAM Bits: 106496
- Number of I/O: 382
- Number of Gates: 526000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BBGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BBGA |
Stock3,504 |
|
|
|
Intel |
IC FPGA 600 I/O 1517FCBGA
- Number of LABs/CLBs: 339620
- Number of Logic Elements/Cells: 900000
- Total RAM Bits: 59234304
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.98 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
|
Package: 1517-BBGA, FCBGA |
Stock2,832 |
|
|
|
Intel |
IC FPGA 534 I/O 1152FBGA
- Number of LABs/CLBs: 3022
- Number of Logic Elements/Cells: 60440
- Total RAM Bits: 2544192
- Number of I/O: 534
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock3,488 |
|
|
|
Intel |
IC FPGA 384 I/O 896FBGA
- Number of LABs/CLBs: 14151
- Number of Logic Elements/Cells: 300000
- Total RAM Bits: 17358848
- Number of I/O: 384
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BBGA, FCBGA
- Supplier Device Package: 896-FBGA (31x31)
|
Package: 896-BBGA, FCBGA |
Stock4,064 |
|
|
|
Intel |
IC FPGA 331 I/O 484FBGA
- Number of LABs/CLBs: 2475
- Number of Logic Elements/Cells: 39600
- Total RAM Bits: 1161216
- Number of I/O: 331
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
|
Package: 484-BGA |
Stock6,224 |
|
|
|
Intel |
IC FPGA 178 I/O 256FBGA
- Number of LABs/CLBs: 1000
- Number of Logic Elements/Cells: 16000
- Total RAM Bits: 562176
- Number of I/O: 178
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FBGA (17x17)
|
Package: 256-LBGA |
Stock3,376 |
|
|
|
Intel |
IC CPLD 128MC 10NS 100TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 4.75 V ~ 5.25 V
- Number of Logic Elements/Blocks: 8
- Number of Macrocells: 128
- Number of Gates: 2500
- Number of I/O: 84
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
|
Package: 100-TQFP |
Stock6,060 |
|
|
|
Intel |
IC CPLD 440MC 5.4NS 100TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 5.4ns
- Voltage Supply - Internal: 1.71 V ~ 1.89 V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 76
- Operating Temperature: -40°C ~ 100°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
|
Package: 100-TQFP |
Stock6,864 |
|
|
|
Intel |
IC CPLD 192MC 4.7NS 100FBGA
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 4.7ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 240
- Number of Macrocells: 192
- Number of Gates: -
- Number of I/O: 80
- Operating Temperature: -40°C ~ 100°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 100-LBGA
- Supplier Device Package: 100-FBGA (11x11)
|
Package: 100-LBGA |
Stock12,456 |
|
|
|
Intel |
IC FPGA STRATIX10GX 1152FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: 612000
- Total RAM Bits: 51380224
- Number of I/O: 392
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC SOC CORTEX-A9 925MHZ 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 925MHz
- Primary Attributes: FPGA - 350K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA, FC (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 688 I/O 1760FBGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 688
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-I 1805FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 600 I/O 1517FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 688 I/O 1760FBGA
- Number of LABs/CLBs: 312500
- Number of Logic Elements/Cells: 2500000
- Total RAM Bits: -
- Number of I/O: 688
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 704 I/O 2397BGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2340BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2340-BFBGA Exposed Pad
- Supplier Device Package: 2340-BGA (45x42)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2486FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|