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Intel |
IC SOC FPGA 360 I/O 780FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 270K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock5,168 |
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Intel |
IC CONFIG DEVICE 440KBIT 32TQFP
- Programmable Type: OTP
- Memory Size: 440kb
- Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 32-TQFP
- Supplier Device Package: 32-TQFP (7x7)
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Package: 32-TQFP |
Stock4,832 |
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Intel |
IC FPGA
- Number of LABs/CLBs: 360
- Number of Logic Elements/Cells: 2880
- Total RAM Bits: 20480
- Number of I/O: 246
- Number of Gates: 116000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
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Package: 356-LBGA |
Stock5,808 |
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Intel |
IC FPGA 768 I/O 1932FCBGA
- Number of LABs/CLBs: 427200
- Number of Logic Elements/Cells: 1150000
- Total RAM Bits: 68857856
- Number of I/O: 768
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock4,560 |
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Intel |
IC FPGA 189 I/O 240QFP
- Number of LABs/CLBs: 360
- Number of Logic Elements/Cells: 2880
- Total RAM Bits: 40960
- Number of I/O: 189
- Number of Gates: 199000
- Voltage - Supply: 2.375 V ~ 2.625 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-PQFP (32x32)
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Package: 240-BFQFP |
Stock4,576 |
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Intel |
IC FPGA 199 I/O 240QFP
- Number of LABs/CLBs: 132
- Number of Logic Elements/Cells: 1320
- Total RAM Bits: -
- Number of I/O: 199
- Number of Gates: 16000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 240-BQFP
- Supplier Device Package: 240-PQFP (32x32)
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Package: 240-BQFP |
Stock4,528 |
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Intel |
IC FPGA 480 I/O 896FBGA
- Number of LABs/CLBs: 113560
- Number of Logic Elements/Cells: 301000
- Total RAM Bits: 14251008
- Number of I/O: 480
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 896-BGA
- Supplier Device Package: 896-FBGA (31x31)
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Package: 896-BGA |
Stock6,216 |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,904 |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 220000
- Number of Logic Elements/Cells: 583000
- Total RAM Bits: 54553600
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock2,608 |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 43983872
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,800 |
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Intel |
IC FPGA 704 I/O 1517FBGA
- Number of LABs/CLBs: 17110
- Number of Logic Elements/Cells: 362000
- Total RAM Bits: 19822592
- Number of I/O: 704
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA |
Stock2,544 |
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Intel |
IC FPGA 240 I/O 484UBGA
- Number of LABs/CLBs: 56480
- Number of Logic Elements/Cells: 149500
- Total RAM Bits: 7880704
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock16,104 |
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Intel |
IC FPGA 224 I/O 484UBGA
- Number of LABs/CLBs: 18868
- Number of Logic Elements/Cells: 50000
- Total RAM Bits: 2862080
- Number of I/O: 224
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-FBGA
- Supplier Device Package: 484-UBGA (19x19)
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Package: 484-FBGA |
Stock7,856 |
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Intel |
IC FPGA 72 I/O 169FBGA
- Number of LABs/CLBs: 900
- Number of Logic Elements/Cells: 14400
- Total RAM Bits: 552960
- Number of I/O: 72
- Number of Gates: -
- Voltage - Supply: 1.16 V ~ 1.24 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 169-LBGA
- Supplier Device Package: 169-FBGA (14x14)
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Package: 169-LBGA |
Stock8,736 |
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Intel |
IC CPLD 980MC 6.2NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 6.2ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 1270
- Number of Macrocells: 980
- Number of Gates: -
- Number of I/O: 116
- Operating Temperature: -40°C ~ 100°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock10,368 |
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Intel |
16-BIT, UVPROM, 20MHZ
- Core Processor: MCS 96
- Core Size: 16-Bit
- Speed: 20MHz
- Connectivity: Serial Port
- Peripherals: PWM, WDT
- Number of I/O: 40
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: EPROM
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
- Data Converters: A/D 8x8/10b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 105°C (TC)
- Mounting Type: Through Hole
- Package / Case: 68-BPGA
- Supplier Device Package: 68-PGA (29.46x29.46)
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Package: - |
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Intel |
IC FPGA AGILEX-I 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 2957BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2957-BFBGA Exposed Pad
- Supplier Device Package: 2957-BGA (56x45)
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Package: - |
Request a Quote |
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Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 4M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 152 I/O 256FBGA
- Number of LABs/CLBs: 903
- Number of Logic Elements/Cells: 14448
- Total RAM Bits: 239616
- Number of I/O: 152
- Number of Gates: -
- Voltage - Supply: 1.15V ~ 1.25V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FBGA (17x17)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 1805BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1805-BBGA Exposed Pad
- Supplier Device Package: 1805-BGA (42.5x42.5)
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Package: - |
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Intel |
IC FPGA 488 I/O 780FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC MPU 1 733MHZ 479FCBGA
- Core Processor: Mobile Intel® Celeron® Processor
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 733MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.15V
- Operating Temperature: 100°C (TC)
- Security Features: -
- Package / Case: 479-BBGA, FCBGA
- Supplier Device Package: 479-FCBGA (35x35)
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Package: - |
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Intel |
IC FPGA 440 I/O 1760FBGA
- Number of LABs/CLBs: 106250
- Number of Logic Elements/Cells: 850000
- Total RAM Bits: -
- Number of I/O: 440
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
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Intel |
IC FPGA STRATIX 10 2397FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 1650K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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