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Intel |
IC SOC FPGA 588 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 570K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock7,968 |
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Intel |
IC FPGA 350 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 925MHz
- Primary Attributes: FPGA - 462K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,592 |
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Intel |
672-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 220K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock6,656 |
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Intel |
IC FPGA 152 I/O 208RQFP
- Number of LABs/CLBs: 84
- Number of Logic Elements/Cells: 672
- Total RAM Bits: -
- Number of I/O: 152
- Number of Gates: 8000
- Voltage - Supply: 4.75 V ~ 5.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 208-BFQFP Exposed Pad
- Supplier Device Package: 208-RQFP (28x28)
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Package: 208-BFQFP Exposed Pad |
Stock6,752 |
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Intel |
IC FPGA 303 I/O 484FBGA
- Number of LABs/CLBs: 480
- Number of Logic Elements/Cells: 4800
- Total RAM Bits: 49152
- Number of I/O: 303
- Number of Gates: 120000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA, FCBGA |
Stock5,024 |
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Intel |
IC FPGA 104 I/O 144TQFP
- Number of LABs/CLBs: 291
- Number of Logic Elements/Cells: 2910
- Total RAM Bits: 59904
- Number of I/O: 104
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock32,892 |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 317000
- Number of Logic Elements/Cells: 840000
- Total RAM Bits: 64210944
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock3,552 |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock3,504 |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 43983872
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,984 |
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Intel |
IC FPGA 488 I/O 1152FBGA
- Number of LABs/CLBs: 4224
- Number of Logic Elements/Cells: 105600
- Total RAM Bits: 9793536
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock6,752 |
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Intel |
IC FPGA 240 I/O 484FBGA
- Number of LABs/CLBs: 56480
- Number of Logic Elements/Cells: 149500
- Total RAM Bits: 7880704
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BGA |
Stock4,608 |
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Intel |
IC FPGA 72 I/O 169FBGA
- Number of LABs/CLBs: 1330
- Number of Logic Elements/Cells: 21280
- Total RAM Bits: 774144
- Number of I/O: 72
- Number of Gates: -
- Voltage - Supply: 1.16 V ~ 1.24 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 169-LBGA
- Supplier Device Package: 169-FBGA (14x14)
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Package: 169-LBGA |
Stock3,280 |
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Intel |
IC CPLD 512MC 10NS 144TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 2.375 V ~ 2.625 V
- Number of Logic Elements/Blocks: 32
- Number of Macrocells: 512
- Number of Gates: 10000
- Number of I/O: 120
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
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Package: 144-LQFP |
Stock5,248 |
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Intel |
IC FPGA 488 I/O 780FBGA
- Number of LABs/CLBs: 2700
- Number of Logic Elements/Cells: 67500
- Total RAM Bits: 2699264
- Number of I/O: 488
- Number of Gates: -
- Voltage - Supply: 0.86V ~ 1.15V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock4,416 |
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Intel |
IC FPGA 296 I/O 484FBGA
- Number of LABs/CLBs: 2700
- Number of Logic Elements/Cells: 67500
- Total RAM Bits: 2699264
- Number of I/O: 296
- Number of Gates: -
- Voltage - Supply: 0.86V ~ 1.15V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BBGA, FCBGA
- Supplier Device Package: 484-FBGA (23x23)
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Package: 484-BBGA, FCBGA |
Stock3,536 |
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Intel |
IC FPGA 544 I/O 1152FBGA
- Number of LABs/CLBs: 8962
- Number of Logic Elements/Cells: 190000
- Total RAM Bits: 13284352
- Number of I/O: 544
- Number of Gates: -
- Voltage - Supply: 1.07V ~ 1.13V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock4,032 |
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Intel |
IC FPGA 528 I/O 1760FBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: 1325000
- Total RAM Bits: 112197632
- Number of I/O: 528
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 440 I/O 2397BGA
- Number of LABs/CLBs: 206250
- Number of Logic Elements/Cells: 1650000
- Total RAM Bits: -
- Number of I/O: 440
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 2340FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.2M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA STRATIX 10 1760FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 850K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 440 I/O 2397BGA
- Number of LABs/CLBs: 350000
- Number of Logic Elements/Cells: 2800000
- Total RAM Bits: -
- Number of I/O: 440
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1517FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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Intel |
IC MPU INTEL XEON 2.4GHZ 603PPGA
- Core Processor: Intel® Xeon® Processor
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 2.4GHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.475V
- Operating Temperature: 74°C (TC)
- Security Features: -
- Package / Case: 603-PGA
- Supplier Device Package: 603-PPGA
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 19456000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
16-BIT, OTPROM, 8096 CPU, 8MHZ
- Core Processor: 87C196JQ
- Core Size: 16-Bit
- Speed: 16MHz
- Connectivity: SSIO, UART/USART
- Peripherals: -
- Number of I/O: 41
- Program Memory Size: 12KB (12K x 8)
- Program Memory Type: EPROM
- EEPROM Size: -
- RAM Size: 488 x 8
- Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
- Data Converters: A/D 6x10b
- Oscillator Type: External, Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 52-LCC (J-Lead)
- Supplier Device Package: 52-PLCC
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1760HBGA
- Number of LABs/CLBs: 317000
- Number of Logic Elements/Cells: 840000
- Total RAM Bits: 53248000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-HBGA (45x45)
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Package: - |
Request a Quote |
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