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Intel |
2397-PIN FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2500K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Stock3,088 |
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Intel |
IC SOC FPGA 588 I/O 1517FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 660K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock3,024 |
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Intel |
IC SOC FPGA 360 I/O 780FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 270K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock5,232 |
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Intel |
IC FPGA 145 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz
- Primary Attributes: FPGA - 85K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
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Package: 672-FBGA |
Stock6,688 |
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Intel |
IC FPGA 426 I/O 672BGA
- Number of LABs/CLBs: 1846
- Number of Logic Elements/Cells: 18460
- Total RAM Bits: 1669248
- Number of I/O: 426
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA
- Supplier Device Package: 672-BGA (35x35)
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Package: 672-BBGA |
Stock5,920 |
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Intel |
IC FPGA 976 I/O 1517HBGA
- Number of LABs/CLBs: 21248
- Number of Logic Elements/Cells: 531200
- Total RAM Bits: 28033024
- Number of I/O: 976
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (42.5x42.5)
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Package: 1517-BBGA, FCBGA |
Stock5,264 |
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Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 172600
- Number of Logic Elements/Cells: 457000
- Total RAM Bits: 46769152
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock3,760 |
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Intel |
IC FPGA 600 I/O 1760FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 61688832
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
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Package: 1760-BBGA, FCBGA |
Stock4,272 |
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Intel |
IC FPGA 840 I/O 1932FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 59939840
- Number of I/O: 840
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1932-BBGA, FCBGA
- Supplier Device Package: 1932-FBGA, FC (45x45)
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Package: 1932-BBGA, FCBGA |
Stock3,520 |
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Intel |
IC FPGA 564 I/O 1152FBGA
- Number of LABs/CLBs: 11648
- Number of Logic Elements/Cells: 291200
- Total RAM Bits: 17661952
- Number of I/O: 564
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,400 |
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Intel |
IC FPGA 744 I/O 1517FBGA
- Number of LABs/CLBs: 7030
- Number of Logic Elements/Cells: 175750
- Total RAM Bits: 13954048
- Number of I/O: 744
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: 1517-BBGA, FCBGA |
Stock2,128 |
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Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 65561600
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
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Package: 1517-BBGA, FCBGA |
Stock6,800 |
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Intel |
1152-PIN FBGA
- Number of LABs/CLBs: 119900
- Number of Logic Elements/Cells: 320000
- Total RAM Bits: 21040128
- Number of I/O: 384
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock5,344 |
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Intel |
IC FPGA 452 I/O 1152FBGA
- Number of LABs/CLBs: 4964
- Number of Logic Elements/Cells: 118143
- Total RAM Bits: 8315904
- Number of I/O: 452
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: 1152-BBGA, FCBGA |
Stock2,336 |
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Intel |
780-PIN FBGA
- Number of LABs/CLBs: 54770
- Number of Logic Elements/Cells: 150000
- Total RAM Bits: 10907648
- Number of I/O: 284
- Number of Gates: -
- Voltage - Supply: 0.9V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
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Package: 780-BBGA, FCBGA |
Stock2,608 |
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Intel |
256-PIN UBGA
- Number of LABs/CLBs: 963
- Number of Logic Elements/Cells: 15408
- Total RAM Bits: 516096
- Number of I/O: 162
- Number of Gates: -
- Voltage - Supply: 1.2V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LFBGA
- Supplier Device Package: 256-UBGA (14x14)
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Package: 256-LFBGA |
Stock6,464 |
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Intel |
IC CPLD 192MC 7.5NS 100TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 7.5ns
- Voltage Supply - Internal: 1.71 V ~ 1.89 V
- Number of Logic Elements/Blocks: 240
- Number of Macrocells: 192
- Number of Gates: -
- Number of I/O: 79
- Operating Temperature: -40°C ~ 125°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: 100-TQFP |
Stock8,916 |
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Intel |
IC CPLD 32MC 10NS 44PLCC
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 2
- Number of Macrocells: 32
- Number of Gates: 600
- Number of I/O: 36
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
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Package: 44-LCC (J-Lead) |
Stock7,812 |
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Intel |
IC FPGA 336 I/O 672FBGA
- Number of LABs/CLBs: 11460
- Number of Logic Elements/Cells: 242000
- Total RAM Bits: 15470592
- Number of I/O: 336
- Number of Gates: -
- Voltage - Supply: 1.12V ~ 1.18V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
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Package: 672-BBGA, FCBGA |
Stock3,616 |
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Intel |
IC FPGA AGILEX-F 1546FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 573K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA 432 I/O 1152FBGA
- Number of LABs/CLBs: 89000
- Number of Logic Elements/Cells: 236000
- Total RAM Bits: 13312000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-I 1805FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC FPGA AGILEX-F 3184FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3184-BFBGA Exposed Pad
- Supplier Device Package: 3184-BGA (56x45)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 688 I/O 1760FBGA
- Number of LABs/CLBs: 137500
- Number of Logic Elements/Cells: 1100000
- Total RAM Bits: -
- Number of I/O: 688
- Number of Gates: -
- Voltage - Supply: 0.77V ~ 0.97V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 654 I/O 1517HBGA
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: -
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: -
- Mounting Type: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Intel |
IC MPU 2 2.4GHZ 478FCPGA
- Core Processor: Intel® Pentium® III Xeon® Processor
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 2.4GHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: 74°C (TC)
- Security Features: -
- Package / Case: 478-BFCPGA
- Supplier Device Package: 478-FCPGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 600 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
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Package: - |
Request a Quote |
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Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 128300
- Number of Logic Elements/Cells: 340000
- Total RAM Bits: 19456000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
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Package: - |
Request a Quote |
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