Page 350 - Intel Products | Heisener Electronics

10AS048K3F35I2LG
Intel

1152-PIN FBGA

Package: -

Stock5,760
EPXA4F672C1GZ
Intel

IC EXCALIBUR ARM 672FBGA

Package: 672-BBGA, FCBGA

Stock3,008
EPXA10F1020C2
Intel

IC EXCALIBUR ARM 1020FBGA

Package: 1020-BBGA

Stock5,984
HC1S30F780AB
Intel

IC FPGA APEX 780FBGA

Package: 780-BBGA, FCBGA

Stock2,352
EP1S25F1020C5N
Intel

IC FPGA 706 I/O 1020FBGA

Package: 1020-BBGA

Stock4,992
5CEFA4F23I7N
Intel

IC FPGA 224 I/O 484FBGA

Package: 484-BGA

Stock6,720
10AX115R1F40E1SG
Intel

IC FPGA 342 I/O 1517FCBGA

Package: 1517-BBGA, FCBGA

Stock3,184
5SGXEA7H2F35C3N
Intel

IC FPGA 552 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock7,728
5SGXMA4K3F35I3LN
Intel

IC FPGA 432 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock7,008
5SGXMA5H3F35C4N
Intel

IC FPGA 552 I/O 1152FBGA

Package: 1152-BBGA, FCBGA

Stock6,512
5AGXFA7H4F35C5G
Intel

1152-PIN FBGA

Package: 1152-BBGA, FCBGA Exposed Pad

Stock2,224
EPM7128SQC100-7N
Intel

IC CPLD 128MC 7.5NS 100QFP

Package: 100-BQFP

Stock5,424
EPM7256AEQC208-10N
Intel

IC CPLD 256MC 10NS 208QFP

Package: 208-BFQFP

Stock7,328
AGFB008R24D2E2V
Intel

IC FPGA AGILEX-F 2340FBGA

Package: -

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5SGXMA3H2F35I2LG
Intel

IC FPGA 600 I/O 1152FBGA

Package: -

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PCLXT16727JA
Intel

LXT16727 MUX

Package: -

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AGFB006R24C2E1V
Intel

IC FPGA AGILEX-F 2340FBGA

Package: -

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RH80530WZ006256
Intel

TUALITAN PENTIUM PROCESSOR

Package: -

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1SX085HN2F43I2LG
Intel

IC FPGA STRATIX 10 1760FBGA

Package: -

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AGFB006R16A2I1V
Intel

IC FPGA AGILEX-F 1546FBGA

Package: -

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Part Number	Manufacturer	Description	Package	Stock
10AS048K3F35I2LG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Stock5,760
EPXA4F672C1GZ	Intel	IC EXCALIBUR ARM 672FBGA Core Type: 32-Bit ARM9 Speed: 266MHz Interface: EBI/EMI, UART/USART Program SRAM Bytes: 128K FPGA SRAM: - EEPROM Size: - Data SRAM Bytes: 64K FPGA Core Cells: 16640 FPGA Gates: 400K FPGA Registers: - Voltage - Supply: 1.8V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	Package: 672-BBGA, FCBGA	Stock3,008
EPXA10F1020C2	Intel	IC EXCALIBUR ARM 1020FBGA Core Type: 32-Bit ARM9 Speed: 200MHz Interface: EBI/EMI, UART/USART Program SRAM Bytes: 256K FPGA SRAM: - EEPROM Size: - Data SRAM Bytes: 128K FPGA Core Cells: 38400 FPGA Gates: 1M FPGA Registers: - Voltage - Supply: 1.8V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	Package: 1020-BBGA	Stock5,984
HC1S30F780AB	Intel	IC FPGA APEX 780FBGA Number of LABs/CLBs: 3247 Number of Logic Elements/Cells: 32470 Total RAM Bits: 2137536 Number of I/O: 597 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	Package: 780-BBGA, FCBGA	Stock2,352
EP1S25F1020C5N	Intel	IC FPGA 706 I/O 1020FBGA Number of LABs/CLBs: 2566 Number of Logic Elements/Cells: 25660 Total RAM Bits: 1944576 Number of I/O: 706 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	Package: 1020-BBGA	Stock4,992
5CEFA4F23I7N	Intel	IC FPGA 224 I/O 484FBGA Number of LABs/CLBs: 18480 Number of Logic Elements/Cells: 49000 Total RAM Bits: 3464192 Number of I/O: 224 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	Package: 484-BGA	Stock6,720
10AX115R1F40E1SG	Intel	IC FPGA 342 I/O 1517FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 342 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	Package: 1517-BBGA, FCBGA	Stock3,184
5SGXEA7H2F35C3N	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock7,728
5SGXMA4K3F35I3LN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock7,008
5SGXMA5H3F35C4N	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA	Stock6,512
5AGXFA7H4F35C5G	Intel	1152-PIN FBGA Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Total RAM Bits: 15470592 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	Package: 1152-BBGA, FCBGA Exposed Pad	Stock2,224
EPM7128SQC100-7N	Intel	IC CPLD 128MC 7.5NS 100QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	Package: 100-BQFP	Stock5,424
EPM7256AEQC208-10N	Intel	IC CPLD 256MC 10NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	Package: 208-BFQFP	Stock7,328
AGFB008R24D2E2V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	Package: -	Request a Quote
5SGXMA3H2F35I2LG	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	Package: -	Request a Quote
PCLXT16727JA	Intel	LXT16727 MUX Type: - Circuit: - Independent Circuits: - Current - Output High, Low: - Voltage Supply Source: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
AGFB006R24C2E1V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 573K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
RH80530WZ006256	Intel	TUALITAN PENTIUM PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
1SX085HN2F43I2LG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 850K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	Package: -	Request a Quote
AGFB006R16A2I1V	Intel	IC FPGA AGILEX-F 1546FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 573K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
EPM1270GF256C5RR	Intel	IC CPLD 980MC 6.2NS 256FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.2 ns Voltage Supply - Internal: 1.71V ~ 1.89V Number of Logic Elements/Blocks: 1270 Number of Macrocells: 980 Number of Gates: - Number of I/O: 212 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	Package: -	Request a Quote
1SX280HH3F55E1VGS3	Intel	IC FPGA STRATIX 10 2912FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA, FC (55x55)	Package: -	Request a Quote
5SGXEA7N2F45C3G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
SCD240210QCM	Intel	COMMUNICATION CONTROLLER 100PIN Protocol: - Function: - Interface: - Standards: - Voltage - Supply: 4.75V ~ 5.25V Current - Supply: 50mA Operating Temperature: 0°C ~ 70°C Package / Case: 160-QFP Supplier Device Package: -	Package: -	Request a Quote
5SGXEA5N2F45C2LG	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	Package: -	Request a Quote
5SGSMD3E3H29C3G	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	Package: -	Request a Quote
AGIB019R18A1I2V	Intel	IC FPGA AGILEX-I 1805FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1805-BBGA Exposed Pad Supplier Device Package: 1805-BGA (42.5x42.5)	Package: -	Request a Quote
N82077SL5	Intel	FLOPPY DISK DRIVE Protocol: - Function: Controller Interface: - Standards: - Voltage - Supply: 4.5V ~ 5.5V Current - Supply: 50mA Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC	Package: -	Request a Quote