|
|
Intel |
IC SOC FPGA 396 I/O 1152FBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 570K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock2,208 |
|
|
|
Intel |
IC FPGA 188 I/O 672UBGA
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz
- Primary Attributes: FPGA - 40K Logic Elements
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-FBGA
- Supplier Device Package: 672-UBGA (23x23)
|
Package: 672-FBGA |
Stock4,368 |
|
|
|
Intel |
IC FPGA 384 I/O 1152FCBGA
- Number of LABs/CLBs: 101620
- Number of Logic Elements/Cells: 270000
- Total RAM Bits: 17870848
- Number of I/O: 384
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.98 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock3,280 |
|
|
|
Intel |
IC FPGA 246 I/O 356BGA
- Number of LABs/CLBs: 416
- Number of Logic Elements/Cells: 4160
- Total RAM Bits: 53248
- Number of I/O: 246
- Number of Gates: 263000
- Voltage - Supply: 1.71 V ~ 1.89 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 356-LBGA
- Supplier Device Package: 356-BGA (35x35)
|
Package: 356-LBGA |
Stock5,568 |
|
|
|
Intel |
IC FPGA 600 I/O 1760FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 61688832
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
|
Package: 1760-BBGA, FCBGA |
Stock6,496 |
|
|
|
Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 43983872
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.93 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: 1152-BBGA, FCBGA |
Stock5,568 |
|
|
|
Intel |
IC FPGA 696 I/O 1517HBGA
- Number of LABs/CLBs: 359200
- Number of Logic Elements/Cells: 952000
- Total RAM Bits: 65561600
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82 V ~ 0.88 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-HBGA (45x45)
|
Package: 1517-BBGA, FCBGA |
Stock7,504 |
|
|
|
Intel |
IC FPGA 455 I/O 672FBGA
- Number of LABs/CLBs: 2566
- Number of Logic Elements/Cells: 25660
- Total RAM Bits: 1944576
- Number of I/O: 455
- Number of Gates: -
- Voltage - Supply: 1.425 V ~ 1.575 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
|
Package: 672-BBGA, FCBGA |
Stock6,112 |
|
|
|
Intel |
IC FPGA 240 I/O 672FBGA
- Number of LABs/CLBs: 61510
- Number of Logic Elements/Cells: 160000
- Total RAM Bits: 10086400
- Number of I/O: 240
- Number of Gates: -
- Voltage - Supply: 0.87 V ~ 0.98 V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
|
Package: 672-BBGA, FCBGA |
Stock3,808 |
|
|
|
Intel |
IC FPGA 336 I/O 672FBGA
- Number of LABs/CLBs: 11460
- Number of Logic Elements/Cells: 242000
- Total RAM Bits: 15470592
- Number of I/O: 336
- Number of Gates: -
- Voltage - Supply: 1.07 V ~ 1.13 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
|
Package: 672-BBGA, FCBGA |
Stock6,736 |
|
|
|
Intel |
IC FPGA 79 I/O 144EQFP
- Number of LABs/CLBs: 1395
- Number of Logic Elements/Cells: 22320
- Total RAM Bits: 608256
- Number of I/O: 79
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP Exposed Pad
- Supplier Device Package: 144-EQFP (20x20)
|
Package: 144-LQFP Exposed Pad |
Stock2,688 |
|
|
|
Intel |
IC FPGA 92 I/O 164MBGA
- Number of LABs/CLBs: 963
- Number of Logic Elements/Cells: 15408
- Total RAM Bits: 516096
- Number of I/O: 92
- Number of Gates: -
- Voltage - Supply: 1.15 V ~ 1.25 V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 164-TFBGA
- Supplier Device Package: 164-MBGA (8x8)
|
Package: 164-TFBGA |
Stock3,584 |
|
|
|
Intel |
IC CPLD 64MC 10NS 44PLCC
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10.0ns
- Voltage Supply - Internal: 3 V ~ 3.6 V
- Number of Logic Elements/Blocks: 4
- Number of Macrocells: 64
- Number of Gates: 1250
- Number of I/O: 34
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC (16.59x16.59)
|
Package: 44-LCC (J-Lead) |
Stock5,200 |
|
|
|
Intel |
IC CPLD 192MC 4.7NS 100TQFP
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 4.7ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 240
- Number of Macrocells: 192
- Number of Gates: -
- Number of I/O: 80
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
|
Package: 100-TQFP |
Stock6,504 |
|
|
|
Intel |
IC FPGA 336 I/O 672FBGA
- Number of LABs/CLBs: 8962
- Number of Logic Elements/Cells: 190000
- Total RAM Bits: 13284352
- Number of I/O: 336
- Number of Gates: -
- Voltage - Supply: 1.07V ~ 1.13V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA (27x27)
|
Package: 672-BBGA, FCBGA |
Stock2,416 |
|
|
|
Intel |
MULTI PROTOCOL CONTROLLER, MOS
- Protocol: -
- Function: Controller
- Interface: Serial
- Standards: -
- Voltage - Supply: 4.5V ~ 5.5V
- Current - Supply: 200mA
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 44-LCC (J-Lead)
- Supplier Device Package: 44-PLCC
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FLASH 1MBIT PARALLEL 32PLCC
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Technology: FLASH
- Memory Size: 1Mbit
- Memory Interface: Parallel
- Clock Frequency: -
- Write Cycle Time - Word, Page: 120ns
- Access Time: 120 ns
- Voltage - Supply: 4.5V ~ 5.5V
- Operating Temperature: -55°C ~ 125°C (TC)
- Mounting Type: Surface Mount
- Package / Case: 32-LCC (J-Lead)
- Supplier Device Package: 32-PLCC
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 600 I/O 1517FBGA
- Number of LABs/CLBs: 158500
- Number of Logic Elements/Cells: 420000
- Total RAM Bits: 37888000
- Number of I/O: 600
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 3.54M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 3948-BFBGA Exposed Pad
- Supplier Device Package: 3948-BGA (56x56)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA STRATIX 10 2912FBGA
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 2800K Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 696 I/O 1517FBGA
- Number of LABs/CLBs: 234720
- Number of Logic Elements/Cells: 622000
- Total RAM Bits: 51200000
- Number of I/O: 696
- Number of Gates: -
- Voltage - Supply: 0.82V ~ 0.88V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.7M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2957-BFBGA Exposed Pad
- Supplier Device Package: 2957-BGA (56x45)
|
Package: - |
Request a Quote |
|
|
|
Intel |
CELERON PROCESSOR
- Core Processor: -
- Number of Cores/Bus Width: -
- Speed: -
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: -
- Operating Temperature: -
- Security Features: -
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 552 I/O 1152FBGA
- Number of LABs/CLBs: 185000
- Number of Logic Elements/Cells: 490000
- Total RAM Bits: 46080000
- Number of I/O: 552
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-I 1805BGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 1.9M Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1805-BBGA Exposed Pad
- Supplier Device Package: 1805-BGA (42.5x42.5)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA AGILEX-F 2581FBGA
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.4GHz
- Primary Attributes: FPGA - 2.3M Logic Elements
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: -
- Supplier Device Package: -
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC FPGA 432 I/O 1517FBGA
- Number of LABs/CLBs: 225400
- Number of Logic Elements/Cells: 597000
- Total RAM Bits: 53248000
- Number of I/O: 432
- Number of Gates: -
- Voltage - Supply: 0.87V ~ 0.93V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-FBGA (40x40)
- Supplier Device Package: 1517-FBGA (40x40)
|
Package: - |
Request a Quote |
|
|
|
Intel |
IC MPU I960 100MHZ 132QFP
- Core Processor: i960
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 100MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 100°C (TC)
- Security Features: -
- Package / Case: 132-QFP
- Supplier Device Package: 132-QFP
|
Package: - |
Request a Quote |
|