Intel Products

1760-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

IC FPGA 178 I/O 256FBGA

• Number of LABs/CLBs: 1000
• Number of Logic Elements/Cells: 16000
• Total RAM Bits: 562176
• Number of I/O: 178
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

IC FPGA

• Number of LABs/CLBs: 1664
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 212992
• Number of I/O: 488
• Number of Gates: 1052000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: -
• Supplier Device Package: -

IC FPGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 136
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

IC FPGA 624 I/O 1932FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 624
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

IC FPGA 768 I/O 1932FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

IC FPGA 564 I/O 1152FBGA

• Number of LABs/CLBs: 7030
• Number of Logic Elements/Cells: 175750
• Total RAM Bits: 13954048
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

IC FPGA 744 I/O 1152FBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

IC FPGA 624 I/O 1020FBGA

• Number of LABs/CLBs: 4125
• Number of Logic Elements/Cells: 41250
• Total RAM Bits: 3423744
• Number of I/O: 624
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 4300
• Number of Logic Elements/Cells: 107500
• Total RAM Bits: 8936448
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

IC FPGA 744 I/O 1152FBGA

• Number of LABs/CLBs: 5700
• Number of Logic Elements/Cells: 142500
• Total RAM Bits: 6543360
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

IC FPGA 210 I/O 484FBGA

• Number of LABs/CLBs: 9428
• Number of Logic Elements/Cells: 150848
• Total RAM Bits: 6137856
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

IC FPGA 240 I/O 484MBGA

• Number of LABs/CLBs: 56480
• Number of Logic Elements/Cells: 149500
• Total RAM Bits: 7880704
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-LFBGA
• Supplier Device Package: 484-MBGA (15x15)

IC FPGA 175 I/O 383MBGA

• Number of LABs/CLBs: 18868
• Number of Logic Elements/Cells: 50000
• Total RAM Bits: 2862080
• Number of I/O: 175
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 383-TFBGA
• Supplier Device Package: 383-MBGA (13x13)

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 11460
• Number of Logic Elements/Cells: 242000
• Total RAM Bits: 15470592
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

IC FPGA 600 I/O 780HBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

IC FPGA 440 I/O 1760FBGA

• Number of LABs/CLBs: 137500
• Number of Logic Elements/Cells: 1100000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 106250
• Number of Logic Elements/Cells: 850000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

IC FPGA 744 I/O 1152HBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

IC FPGA 23780 I/O 1152FBGA

• Number of LABs/CLBs: 504000
• Number of Logic Elements/Cells: -
• Total RAM Bits: 27695104
• Number of I/O: 23780
• Number of Gates: 544
• Voltage - Supply: 1.12V ~ 1.18V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA, FC (35x35)

IC FPGA 1160 I/O 2912BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 1160
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA, FC (55x55)

IC FPGA 414 I/O 1152FBGA

• Number of LABs/CLBs: 10377
• Number of Logic Elements/Cells: 220000
• Total RAM Bits: 15282176
• Number of I/O: 414
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)