Microchip Technology Products

OSC MEMS 16.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 16MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC REG LIN POS ADJ 150MA SOT23-5

• Output Configuration: Positive
• Output Type: Adjustable
• Number of Regulators: 1
• Voltage - Input (Max): 24V
• Voltage - Output (Min/Fixed): 1.24V
• Voltage - Output (Max): 20V
• Voltage Dropout (Max): 0.5V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 35µA ~ 4mA
• PSRR: -
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

IC REG LINEAR 3.3V 500MA 4TDFN

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.5V @ 500mA
• Current - Output: 500mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 55µA
• PSRR: 80dB ~ 65dB (100Hz ~ 1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 4-UDFN Exposed Pad
• Supplier Device Package: 4-TDFN (1x1)

IC REG DL BCK/LINEAR SYNC 10MSOP

• Topology: Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
• Function: Any Function
• Number of Outputs: 2
• Frequency - Switching: 2MHz
• Voltage/Current - Output 1: Adj, 500mA
• Voltage/Current - Output 2: 3.3V, 300mA
• Voltage/Current - Output 3: -
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP

IC DISTRIBUTION SW 0.8A SOT23-5

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: P-Channel
• Interface: On/Off
• Voltage - Load: 2.5 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 800mA
• Rds On (Typ): 70 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Over Temperature
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

IC DISTRIBUTION SW 1.2A SOT23-6

• Switch Type: General Purpose
• Number of Outputs: 1
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: P-Channel
• Interface: On/Off
• Voltage - Load: 2.5 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 1.2A
• Rds On (Typ): 70 mOhm
• Input Type: Non-Inverting
• Features: Slew Rate Controlled
• Fault Protection: Current Limiting (Fixed), Over Temperature
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: SOT-23-6
• Supplier Device Package: SOT-23-6

IC LED DRVR LIN DIM 350MA 40TQFN

• Type: Linear
• Topology: -
• Internal Switch(s): No
• Number of Outputs: 8
• Voltage - Supply (Min): 10.8V
• Voltage - Supply (Max): 13.2V
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: 20MHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 40-WFQFN Exposed Pad
• Supplier Device Package: 40-TQFN (6x6)

IC CURRENT SENSE MON DUAL 10VDFN

• Function: Current Monitor
• Sensing Method: High-Side
• Accuracy: ±1%
• Voltage - Input: 0 V ~ 40 V
• Current - Output: -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-DFN (3x3)

IC OPAMP GP 24MHZ RRO 14SOIC

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 10 V/µs
• Gain Bandwidth Product: 24MHz
• -3db Bandwidth: -
• Current - Input Bias: 4pA
• Voltage - Input Offset: 1.8mV
• Current - Supply: 2.5mA
• Current - Output / Channel: 70mA
• Voltage - Supply, Single/Dual (±): 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

IC MCU 8BIT 768B OTP 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40kHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 20
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 24 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

IC MCU 16BIT 256KB FLASH 100TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 30K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (12x12)

IC MCU 32BIT 512KB FLASH 49WLCSP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I2C, SPI, UART/USART, USB
• Peripherals: DMA, I2S, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 176K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 49-UFBGA, WLCSP
• Supplier Device Package: 49-WLCSP (2.84x2.84)

IC MCU 8BIT 32KB FLASH 40DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 8K x 8
• RAM Size: 4.25K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

IC MCU 32BIT 16KB FLASH 28SOIC

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

IC MCU 8BIT 28KB FLASH 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

IC MCU 8BIT 7KB FLASH 20SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 12x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

IC MCU 32BIT 160KB ROM 324LFBGA

• Core Processor: ARM? Cortex?-A5
• Core Size: 32-Bit
• Speed: 536MHz
• Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
• Peripherals: DMA, LCD, POR, PWM, WDT
• Number of I/O: 160
• Program Memory Size: 160KB (160K x 8)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 324-LFBGA
• Supplier Device Package: 324-LFBGA (15x15)

IC MCU 8BIT 14KB FLASH 28UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x10b, D/A 3x5b, 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-UQFN Exposed Pad
• Supplier Device Package: 28-UQFN (6x6)

IC MCU 8BIT 2KB FLASH 20DIP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: USI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 2KB (1K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

IC ARM9 PHY 5MBPS 400BGA

• Applications: Networking and Communications
• Core Processor: ARM9?
• Program Memory Type: External Program Memory
• Controller Series: KSZ
• RAM Size: -
• Interface: EBI/EMI, Ethernet, I2C, I2S,PCI, SPI, UART/USART, USB
• Number of I/O: 20
• Voltage - Supply: 1.235 V ~ 1.365 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 400-BGA
• Supplier Device Package: 400-PBGA (24x24)

IC CLK BUFFER 2:8 160MHZ 28PLCC

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 2:8
• Differential - Input:Output: Yes/Yes
• Input: ECL
• Output: TTL
• Frequency - Max: 160MHz
• Voltage - Supply: ±4.2 V ~ 5.5 V, 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

IC CLK BUFFER 2:4 650MHZ 20TSSOP

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:4
• Differential - Input:Output: Yes/Yes
• Input: CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL
• Output: LVPECL
• Frequency - Max: 650MHz
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

IC RFID R/W 125KHZ DIE WAFFLE PK

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

IC CLK BUFFER 1:6 750MHZ 32QFN

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:6
• Differential - Input:Output: Yes/Yes
• Input: CML, HCSL, LVCMOS, LVDS, LVPECL
• Output: LVPECL
• Frequency - Max: 750MHz
• Voltage - Supply: 2.375V ~ 3.465V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 43 V
• Tolerance: ±2%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 40 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 34.4 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 2.4 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1400 Ohms
• Current - Reverse Leakage @ Vr: 1 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

TRANS PNP 80V 5A TO59/I

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 5 A
• Voltage - Collector Emitter Breakdown (Max): 80 V
• Vce Saturation (Max) @ Ib, Ic: 1.5V @ 500mA, 5A
• Current - Collector Cutoff (Max): 50µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 2.5A, 5V
• Power - Max: 2 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Chassis, Stud Mount
• Package / Case: TO-210AA, TO-59-4, Stud
• Supplier Device Package: TO-59/I

IC LIN SYSTEM BASIS CHIP 8VDFN

• Type: LIN System Basis Chip
• Applications: -
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-VDFN (3x3)