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Microchip Technology |
OSC MEMS 66.000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 66MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±25ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 35mA
- Ratings: -
- Mounting Type: Surface Mount
- Package / Case: 6-SMD, No Lead
- Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 6-SMD, No Lead |
Stock5,976 |
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Microchip Technology |
OSC MEMS 125.000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 125MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 1.8 V ~ 3.3 V
- Frequency Stability: ±25ppm
- Operating Temperature: -20°C ~ 70°C
- Current - Supply (Max): 8.7mA
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead Exposed Pad
- Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead Exposed Pad |
Stock4,518 |
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Microchip Technology |
OSC MEMS 50.000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 50MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 1.8 V ~ 3.3 V
- Frequency Stability: ±25ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 7.2mA
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead
- Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead |
Stock5,634 |
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Microchip Technology |
IC VREF SHUNT 4.096V SOT23
- Reference Type: Shunt
- Output Type: Fixed
- Voltage - Output (Min/Fixed): 4.096V
- Voltage - Output (Max): -
- Current - Output: 15mA
- Tolerance: ±0.5%
- Temperature Coefficient: 100ppm/°C
- Noise - 0.1Hz to 10Hz: -
- Noise - 10Hz to 10kHz: 80µVrms
- Voltage - Input: -
- Current - Supply: -
- Current - Cathode: 73µA
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SOT-23-3
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock2,208 |
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Microchip Technology |
IC SW CURR LIMIT HI SIDE 14TSSOP
- Switch Type: USB Switch
- Number of Outputs: 1
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 2.7 V ~ 5.5 V
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 3A
- Rds On (Typ): 35 mOhm
- Input Type: Non-Inverting
- Features: Slew Rate Controlled, Status Flag
- Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 14-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 14-TSSOP
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Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock4,800 |
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Microchip Technology |
IC PCMCIA/CARDBUS CTRLR 16-TSSOP
- Switch Type: PCMCIA Switch
- Number of Outputs: 2
- Ratio - Input:Output: 3:2
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: Logic
- Voltage - Load: 3.3V, 5V, 12V
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 200mA
- Rds On (Typ): 70 mOhm
- Input Type: Non-Inverting
- Features: Status Flag
- Fault Protection: Current Limiting (Fixed), Over Temperature
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock2,528 |
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Microchip Technology |
IC MOTOR DRIVER PAR 16UQFN
- Motor Type - Stepper: -
- Motor Type - AC, DC: Brushless DC (BLDC)
- Function: Driver - Fully Integrated, Control and Power Stage
- Output Configuration: Half Bridge (3)
- Interface: PWM
- Technology: Power MOSFET
- Step Resolution: -
- Applications: General Purpose
- Current - Output: 1A
- Voltage - Supply: 2 V ~ 5.5 V
- Voltage - Load: 2 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 16-UQFN Exposed Pad
- Supplier Device Package: 16-UQFN (4x4)
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Package: 16-UQFN Exposed Pad |
Stock15,048 |
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Microchip Technology |
IC OPAMP GP 10KHZ RRO 14SOIC
- Amplifier Type: General Purpose
- Number of Circuits: 4
- Output Type: Rail-to-Rail
- Slew Rate: 0.004 V/µs
- Gain Bandwidth Product: 10kHz
- -3db Bandwidth: -
- Current - Input Bias: 1pA
- Voltage - Input Offset: 150µV
- Current - Supply: 900nA
- Current - Output / Channel: 23mA
- Voltage - Supply, Single/Dual (±): 1.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SOIC
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock109,236 |
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Microchip Technology |
IC PLD 8MC 10NS 20PLCC
- Programmable Type: EE PLD
- Number of Macrocells: 8
- Voltage - Input: 5V
- Speed: 10ns
- Mounting Type: Surface Mount
- Package / Case: 20-LCC (J-Lead)
- Supplier Device Package: 20-PLCC (9x9)
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Package: 20-LCC (J-Lead) |
Stock3,776 |
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Microchip Technology |
IC MCU 8BIT 32KB OTP 84PLCC
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 33MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 66
- Program Memory Size: 32KB (16K x 16)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 902 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Data Converters: A/D 16x10b
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 84-LCC (J-Lead)
- Supplier Device Package: 84-PLCC (29.31x29.31)
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Package: 84-LCC (J-Lead) |
Stock7,600 |
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Microchip Technology |
IC MCU 8BIT 8KB FLASH 20SSOP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 48MHz
- Connectivity: I2C, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 14
- Program Memory Size: 8KB (4K x 16)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
- Data Converters: A/D 11x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock21,492 |
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Microchip Technology |
IC MCU 8BIT 896B FLASH 8DFN
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: -
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 3
- Program Memory Size: 896B (512 x 14)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64 x 8
- Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
- Data Converters: A/D 3x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 8-VFDFN Exposed Pad
- Supplier Device Package: 8-DFN (2x3)
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Package: 8-VFDFN Exposed Pad |
Stock6,112 |
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Microchip Technology |
IC MCU 8BIT 7KB FLASH 28QFN
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 25
- Program Memory Size: 7KB (4K x 14)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 192 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
- Data Converters: A/D 11x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-VQFN Exposed Pad
- Supplier Device Package: 28-QFN (6x6)
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Package: 28-VQFN Exposed Pad |
Stock4,832 |
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Microchip Technology |
IC MCU 32BIT 128KB FLASH 121BGA
- Core Processor: MIPS32? M4K?
- Core Size: 32-Bit
- Speed: 80MHz
- Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
- Data Converters: A/D 16x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 121-TFBGA
- Supplier Device Package: 121-TFBGA (10x10)
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Package: 121-TFBGA |
Stock6,912 |
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Microchip Technology |
IC MCU 8BIT 32KB FLASH 64TQFP
- Core Processor: AVR
- Core Size: 8-Bit
- Speed: 16MHz
- Connectivity: SPI, UART/USART, USI
- Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 32KB (16K x 16)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 2K x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-TQFP
- Supplier Device Package: 64-TQFP (14x14)
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Package: 64-TQFP |
Stock4,336 |
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Microchip Technology |
IC MCU 8BIT 1.75KB FLASH 18DIP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 4MHz
- Connectivity: -
- Peripherals: POR, WDT
- Number of I/O: 13
- Program Memory Size: 1.75KB (1K x 14)
- Program Memory Type: FLASH
- EEPROM Size: 64 x 8
- RAM Size: 68 x 8
- Voltage - Supply (Vcc/Vdd): 2 V ~ 6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 18-DIP (0.300", 7.62mm)
- Supplier Device Package: 18-PDIP
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Package: 18-DIP (0.300", 7.62mm) |
Stock12,828 |
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Microchip Technology |
IC MCU 8BIT 7KB FLASH 28UQFN
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 32MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 25
- Program Memory Size: 7KB (4K x 14)
- Program Memory Type: FLASH
- EEPROM Size: 128 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 17x10b, D/A 3x5b, 3x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 28-UQFN Exposed Pad
- Supplier Device Package: 28-UQFN (6x6)
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Package: 28-UQFN Exposed Pad |
Stock9,792 |
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Microchip Technology |
IC ADC 18BIT 2CH 3.75SPS 8DFN
- Number of Bits: 18
- Sampling Rate (Per Second): 3.75
- Number of Inputs: 2
- Input Type: Differential
- Data Interface: I2C
- Configuration: MUX-PGA-ADC
- Ratio - S/H:ADC: -
- Number of A/D Converters: 1
- Architecture: Sigma-Delta
- Reference Type: Internal
- Voltage - Supply, Analog: 2.7 V ~ 5.5 V
- Voltage - Supply, Digital: 2.7 V ~ 5.5 V
- Features: PGA
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-VFDFN Exposed Pad
- Supplier Device Package: 8-DFN (2x3)
- Mounting Type: -
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Package: 8-VFDFN Exposed Pad |
Stock6,816 |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 3 V
- Tolerance: ±2%
- Power - Max: -
- Impedance (Max) (Zzt): 29 Ohms
- Current - Reverse Leakage @ Vr: 30 µA @ 1 V
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: DO-204AH (DO-35)
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 6.2 V
- Tolerance: ±6%
- Power - Max: -
- Impedance (Max) (Zzt): -
- Current - Reverse Leakage @ Vr: 3 µA @ 4 V
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C
- Mounting Type: Surface Mount
- Package / Case: DO-213AA (Glass)
- Supplier Device Package: DO-213AA
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Package: - |
Request a Quote |
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Microchip Technology |
DIODE ZENER 3.6V 500MW DO35
- Voltage - Zener (Nom) (Vz): 3.6 V
- Tolerance: ±5%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 25 Ohms
- Current - Reverse Leakage @ Vr: 3 µA @ 1 V
- Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: DO-204AH (DO-35)
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Package: - |
Request a Quote |
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Microchip Technology |
IC MCU 16BIT 256KB FLASH 80TQFP
- Core Processor: PIC
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
- Peripherals: DMA, LCD, PWM, WDT
- Number of I/O: -
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
- Data Converters: A/D 24x10/12b; D/A 1x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 80-TQFP
- Supplier Device Package: 80-TQFP (12x12)
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Package: - |
Request a Quote |
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Microchip Technology |
DIODE ZENER TEMP COMPENSATED
- Voltage - Zener (Nom) (Vz): 12.8 V
- Tolerance: ±5%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 50 Ohms
- Current - Reverse Leakage @ Vr: 15 µA @ 8 V
- Voltage - Forward (Vf) (Max) @ If: -
- Operating Temperature: -65°C ~ 100°C
- Mounting Type: Surface Mount
- Package / Case: DO-213AA
- Supplier Device Package: DO-213AA
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 25 V
- Tolerance: ±1%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 150 Ohms
- Current - Reverse Leakage @ Vr: 10 nA @ 19 V
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C
- Mounting Type: Surface Mount
- Package / Case: DO-213AA
- Supplier Device Package: DO-213AA
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Package: - |
Request a Quote |
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Microchip Technology |
POWER BJT
- Transistor Type: PNP
- Current - Collector (Ic) (Max): 20 A
- Voltage - Collector Emitter Breakdown (Max): 100 V
- Vce Saturation (Max) @ Ib, Ic: -
- Current - Collector Cutoff (Max): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: -
- Power - Max: 87.5 W
- Frequency - Transition: -
- Operating Temperature: -
- Mounting Type: Stud Mount
- Package / Case: TO-211MA, TO-210AC, TO-61-4, Stud
- Supplier Device Package: TO-61
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Package: - |
Request a Quote |
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Microchip Technology |
PNP POWER TRANSISTOR SILICON AMP
- Transistor Type: -
- Current - Collector (Ic) (Max): -
- Voltage - Collector Emitter Breakdown (Max): -
- Vce Saturation (Max) @ Ib, Ic: -
- Current - Collector Cutoff (Max): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: -
- Power - Max: -
- Frequency - Transition: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Microchip Technology |
GAAS TVAR NON HERMETIC EPSM SMT
- Capacitance @ Vr, F: 0.5pF @ 4V, 1MHz
- Capacitance Ratio: 3.4
- Capacitance Ratio Condition: C0/C30
- Voltage - Peak Reverse (Max): 30 V
- Diode Type: Single
- Q @ Vr, F: 7000 @ 4V, 50MHz
- Operating Temperature: -55°C ~ 175°C
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Chip
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Package: - |
Request a Quote |
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Microchip Technology |
POWER BJT
- Transistor Type: -
- Current - Collector (Ic) (Max): -
- Voltage - Collector Emitter Breakdown (Max): -
- Vce Saturation (Max) @ Ib, Ic: -
- Current - Collector Cutoff (Max): -
- DC Current Gain (hFE) (Min) @ Ic, Vce: -
- Power - Max: -
- Frequency - Transition: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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