Microchip Technology Products

OSC MEMS 40.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 40MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -55°C ~ 125°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC REG LINEAR 2.5V 3A 16MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.5V or Tracking
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.5V @ 3A
• Current - Output: 3A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 130mA
• PSRR: -
• Control Features: Enable, Power On Reset, Power Sequencing
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-VQFN Exposed Pad, 16-MLF?
• Supplier Device Package: 16-MLF? (4x4)

IC REG CTRLR BUCK 12MLF

• Output Type: Transistor Driver
• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 32 V
• Frequency - Switching: 300kHz
• Duty Cycle (Max): 85%
• Synchronous Rectifier: Yes
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Enable
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 12-VFDFN Exposed Pad, 12-MLF?
• Supplier Device Package: 12-MLF? (4x4)

IC DRVR LATCH 8BIT PAR IN 20PLCC

• Switch Type: Latched Driver
• Number of Outputs: 8
• Ratio - Input:Output: 1:8
• Output Configuration: Low Side
• Output Type: Bipolar
• Interface: Strobe, Serial
• Voltage - Load: 15V (Max)
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): 500mA
• Rds On (Typ): -
• Input Type: -
• Features: Status Flag
• Fault Protection: Over Temperature, UVLO
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

IC EEPROM 4KBIT 2MHZ SOT23-6

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (512 x 8)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SOT-23-6
• Supplier Device Package: SOT-23-6

IC USB PROTECTION 16QFN

• Protocol: USB
• Function: Controller
• Interface: I2C
• Standards: USB 2.0
• Voltage - Supply: 2 V ~ 9 V
• Current - Supply: 185µA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

IC USB PWR CTRLR DUAL 8-SOIC

• Protocol: USB
• Function: Controller
• Interface: -
• Standards: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Supply: 16µA
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC MCU 8BIT 28KB FLASH 40DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 28KB (16K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 28x10b, D/A 4x5b, 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

IC MCU 8BIT 8KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

PCI EXPRESS SWITCH GEN3 80 LANES

• Applications: Fanout PCIe Switch
• Interface: PCI Express
• Voltage - Supply: -
• Package / Case: BGA - Module
• Supplier Device Package: -
• Mounting Type: Surface Mount

IC CESOP PROCESSOR 32CH 324BGA

• Function: Telecom Circuit
• Interface: TDM
• Number of Circuits: 1
• Voltage - Supply: 1.65V ~ 1.95V
• Current - Supply: 950mA
• Power (Watts): -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 324-BGA
• Supplier Device Package: 324-PBGA (23x23)

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 47 V
• Tolerance: ±1%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 50 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 37.6 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO041, Axial
• Supplier Device Package: DO-41

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 18 V
• Tolerance: ±1%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 11 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 14.4 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO041, Axial
• Supplier Device Package: DO-41

DIODE GEN PURP 225V 400MA DO35

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 225 V
• Current - Average Rectified (Io): 400mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 400 mA
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 50 nA @ 225 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35
• Operating Temperature - Junction: -65°C ~ 175°C

JFET N-CH UB

• FET Type: N-Channel
• Voltage - Breakdown (V(BR)GSS): -
• Drain to Source Voltage (Vdss): -
• Current - Drain (Idss) @ Vds (Vgs=0): -
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Resistance - RDS(On): -
• Power - Max: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: UB

IC MCU 8BIT 16KB FLASH 14SOIC

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 10
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 7x12b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

IC CLOCK GENERATOR 6VFLGA

• Type: Clock Generator
• PLL: Yes
• Input: -
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 0:2
• Differential - Input:Output: No/No
• Frequency - Max: 100MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 1.71V ~ 3.63V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 6-VFLGA
• Supplier Device Package: 6-VFLGA (2.5x2)

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 2.7 V
• Tolerance: -
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

INIC 150MBPS MOST NETWORK

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

DIODE ZENER 82V DO-213AA

• Voltage - Zener (Nom) (Vz): 82 V
• Tolerance: ±1%
• Power - Max: -
• Impedance (Max) (Zzt): 330 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 62 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

MOSFET N-CH 600V 36A D3PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 600 V
• Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 5V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
• Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
• Vgs (Max): ±30V
• FET Feature: -
• Power Dissipation (Max): 624W (Tc)
• Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D3PAK
• Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA

DIODE ZENER 3.6V 500MW MELF

• Voltage - Zener (Nom) (Vz): 3.6 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 91 V
• Tolerance: ±2%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 69.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: E, Axial
• Supplier Device Package: E, Axial

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 150 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1500 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 108 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

DIODE SCHOTTKY 40V 3A B SQ-MELF

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 40 V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 500 mV @ 3 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 100 µA @ 40 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF
• Operating Temperature - Junction: -65°C ~ 125°C

IC MCU 8BIT 7KB FLASH 20VQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 12/2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-VQFN (3x3)

PNP TRANSISTOR

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

DIODE GEN PURP 600V 3A B AXIAL

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 600 V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 400 ns
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: B, Axial
• Supplier Device Package: B, Axial
• Operating Temperature - Junction: -65°C ~ 175°C