Microchip Technology Products

OSC MEMS 33.3333MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 33.3333MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC REG LIN POS ADJ 150MA 8MSOP

• Output Configuration: Positive
• Output Type: Adjustable (Fixed)
• Number of Regulators: 1
• Voltage - Input (Max): 30V
• Voltage - Output (Min/Fixed): 1.24V (3.3V)
• Voltage - Output (Max): 29V
• Voltage Dropout (Max): 0.6V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 300µA ~ 10mA
• PSRR: -
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-MSOP

IC RESET CIRCUIT 4.62V SOT23-3

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: -
• Reset: Active Low
• Reset Timeout: 100 ms Minimum
• Voltage - Threshold: 4.62V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23-3

IC LI-ION CTRLR 8.2/8.4V 16SOIC

• Battery Chemistry: Lithium-Ion/Polymer
• Number of Cells: 2
• Current - Charging: Constant - Programmable
• Programmable Features: Timer
• Fault Protection: -
• Charge Current - Max: 1.38A
• Battery Pack Voltage: 8.4V
• Voltage - Supply (Max): 12V
• Interface: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

IC FLASH 4MBIT 90NS 32VSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 4Mb (512K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 50µs
• Access Time: 90ns
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-TFSOP (0.488", 12.40mm Width)
• Supplier Device Package: 32-VSOP

IC EEPROM 16KBIT 400KHZ 8TSSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 16Kb (2K x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 4.5µs
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

IC TXRX PHY 10/100 TX/FX 48TQFP

• Type: Transceiver
• Protocol: MII, RMII
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

IC MCU 8BIT 8KB OTP 44QFP

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 30/20MHz
• Connectivity: UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: -

IC MCU 8BIT 16KB FLASH 24SO

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 20
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

IC MCU 8BIT 896B OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 80 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

IC MCU 8BIT 2KB FLASH 8SOIC

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SPI
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 5
• Program Memory Size: 2KB (1K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

IC MCU 16BIT 32KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 70 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 32KB (10.7K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN-S (6x6)

IC MCU 8BIT 3.5KB FLASH 8DFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 6
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN-EP (3x3)

IC FPGA 3.3V 576 CELL 100-TQFP

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 576
• Total RAM Bits: 4608
• Number of I/O: 78
• Number of Gates: 20000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

IC OSC SINGLE TIMER 5MHZ

• Type: 555 Type, Timer/Oscillator (Single)
• Count: -
• Frequency: 5MHz
• Voltage - Supply: 2.7 V ~ 18 V
• Current - Supply: 350µA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: SOT-23-5 Thin, TSOT-23-5
• Supplier Device Package: TSOT-23-5
• Mounting Type: Surface Mount

IC DELAY LINE 255TAP PROG 28PLCC

• Number of Taps/Steps: 255
• Function: Programmable
• Delay to 1st Tap: 4ns
• Tap Increment: 15.7ps
• Available Total Delays: 4ns ~ 40ns
• Number of Independent Delays: 1
• Voltage - Supply: 4.2 V ~ 5.7 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.5x11.5)

BOARD EVAL RN171

• Type: Transceiver; 802.11 b/g (Wi-Fi, WiFi, WLAN)
• Frequency: 2.4GHz
• For Use With/Related Products: RN-171
• Supplied Contents: Board

IC RF PWR AMP 802.11B/G/N 8XSON

• Frequency: 2.4GHz ~ 2.5GHz
• P1dB: -
• Gain: 20.5dB
• Noise Figure: -
• RF Type: 802.11b/g/n
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 200mA
• Test Frequency: -
• Package / Case: 8-XFDFN Exposed Pad
• Supplier Device Package: 8-XSON (2x2)

10 PORT CE SWITCH W/8 GIGE CU PH

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

32-BIT CACHE-BASED MCU GRAPHICS

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 640K x 8
• Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
• Data Converters: A/D 45x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-LFBGA (11x11)

GAAS GUNN EPI DOWN HERMETIC STUD

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 10V
• Current - Max: 1.2 A
• Capacitance @ Vr, F: -
• Resistance @ If, F: -
• Power Dissipation (Max): 250 mW
• Operating Temperature: -
• Package / Case: Stud
• Supplier Device Package: -

DIODE GEN PURP 400V 70A DO5

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 70A
• Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 25 µA @ 400 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5 (DO-203AB)
• Operating Temperature - Junction: -65°C ~ 200°C

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 180 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 2200 Ohms
• Current - Reverse Leakage @ Vr: 500 nA @ 137 V
• Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 7.5 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 6 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

IC MCU 8BIT 64KB FLASH 20DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 17x12b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

MOSFET N-CH 600V 39A ISOTOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 600 V
• Current - Continuous Drain (Id) @ 25°C: 39A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: 5V @ 2.5mA
• Gate Charge (Qg) (Max) @ Vgs: 130 nC @ 10 V
• Input Capacitance (Ciss) (Max) @ Vds: 5630 pF @ 25 V
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: 130mOhm @ 19.5A, 10V
• Operating Temperature: -
• Mounting Type: Chassis Mount
• Supplier Device Package: ISOTOP®
• Package / Case: SOT-227-4, miniBLOC

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 24 V
• Tolerance: ±5%
• Power - Max: 50 W
• Impedance (Max) (Zzt): 2.6 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5

IC MCU 8BIT 128KB FLASH 28SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 24x12b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP