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Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
- Type: MEMS (Silicon)
- Frequency - Output 1: -
- Frequency - Output 2: -
- Function: Enable/Disable
- Output: CMOS
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±25ppm
- Operating Temperature: -20°C ~ 70°C
- Current - Supply (Max): -
- Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
- Height: 0.035" (0.90mm)
- Package / Case: 6-SMD, No Lead
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Package: 6-SMD, No Lead |
Stock6,714 |
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Microchip Technology |
OSC MEMS 111.0000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 111MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 1.8 V ~ 3.3 V
- Frequency Stability: ±50ppm
- Operating Temperature: -40°C ~ 105°C
- Current - Supply (Max): 8.7mA
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead
- Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead |
Stock3,474 |
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Microchip Technology |
OSC MEMS 120.0000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 120MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 1.8 V ~ 3.3 V
- Frequency Stability: ±25ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 8.7mA
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead Exposed Pad
- Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead Exposed Pad |
Stock7,740 |
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Microchip Technology |
OSC MEMS 25.000MHZ LVPECL SMD
- Type: MEMS (Silicon)
- Frequency: 25MHz
- Function: Standby (Power Down)
- Output: LVPECL
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±25ppm
- Operating Temperature: -20°C ~ 70°C
- Current - Supply (Max): 58mA
- Ratings: -
- Mounting Type: Surface Mount
- Package / Case: 6-SMD, No Lead
- Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 6-SMD, No Lead |
Stock5,724 |
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Microchip Technology |
OSC MEMS 156.25MHZ LVPECL SMD
- Type: MEMS (Silicon)
- Frequency: 156.25MHz
- Function: Enable/Disable
- Output: LVPECL
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±25ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 58mA
- Ratings: -
- Mounting Type: Surface Mount
- Package / Case: 6-SMD, No Lead, Exposed Pad
- Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 6-SMD, No Lead, Exposed Pad |
Stock8,046 |
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Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 25MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±25ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 35mA
- Ratings: -
- Mounting Type: Surface Mount
- Package / Case: 6-SMD, No Lead
- Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 6-SMD, No Lead |
Stock2,340 |
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Microchip Technology |
IC REG LINEAR 1.8V 3A 8SOIC
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 6V
- Voltage - Output (Min/Fixed): 1.8V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.55V @ 3A
- Current - Output: 3A
- Current - Quiescent (Iq): -
- Current - Supply (Max): 50mA
- PSRR: -
- Control Features: Enable
- Protection Features: Over Current, Over Temperature, Reverse Polarity
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
- Supplier Device Package: 8-SOIC-EP
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Package: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
Stock5,328 |
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Microchip Technology |
IC VOLT DET 4.63V LOW SC70-3
- Type: Simple Reset/Power-On Reset
- Number of Voltages Monitored: 1
- Output: Push-Pull, Totem Pole
- Reset: Active Low
- Reset Timeout: -
- Voltage - Threshold: 4.63V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: SC-70, SOT-323
- Supplier Device Package: SC-70-3
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Package: SC-70, SOT-323 |
Stock4,320 |
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Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8SOIC
- Memory Type: Non-Volatile
- Memory Format: EEPROM
- Technology: EEPROM
- Memory Size: 128Kb (16K x 8)
- Memory Interface: SPI
- Clock Frequency: 10MHz
- Write Cycle Time - Word, Page: 5ms
- Access Time: -
- Voltage - Supply: 2.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock49,620 |
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Microchip Technology |
IC D-TYPE POS/NEG 8SOIC
- Function: Reset
- Type: D-Type
- Output Type: Differential
- Number of Elements: 1
- Number of Bits per Element: 1
- Clock Frequency: 3GHz
- Max Propagation Delay @ V, Max CL: -
- Trigger Type: Positive, Negative
- Current - Output High, Low: -
- Voltage - Supply: -3 V ~ -5.5 V
- Current - Quiescent (Iq): 40mA
- Input Capacitance: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,440 |
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Microchip Technology |
IC MCU 8BIT 4KB OTP 44TQFP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 33MHz
- Connectivity: UART/USART
- Peripherals: POR, PWM, WDT
- Number of I/O: 33
- Program Memory Size: 4KB (2K x 16)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 232 x 8
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 44-TQFP
- Supplier Device Package: 44-TQFP (10x10)
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Package: 44-TQFP |
Stock5,936 |
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Microchip Technology |
IC MCU 8BIT 64KB FLASH 44QFN
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 25MHz
- Connectivity: CAN, I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
- Number of I/O: 36
- Program Memory Size: 64KB (32K x 16)
- Program Memory Type: FLASH
- EEPROM Size: 1K x 8
- RAM Size: 3.25K x 8
- Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
- Data Converters: A/D 11x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: -
- Package / Case: 44-VQFN Exposed Pad
- Supplier Device Package: 44-QFN (8x8)
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Package: 44-VQFN Exposed Pad |
Stock6,464 |
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Microchip Technology |
IC MCU 16BIT 64KB FLASH 64QFN
- Core Processor: dsPIC
- Core Size: 16-Bit
- Speed: 40 MIPs
- Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
- Number of I/O: 58
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 9K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 16x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-QFN (9x9)
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Package: 64-VFQFN Exposed Pad |
Stock7,168 |
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Microchip Technology |
IC MCU 16BIT 128KB FLASH 44TQFP
- Core Processor: dsPIC
- Core Size: 16-Bit
- Speed: 60 MIPs
- Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O: 35
- Program Memory Size: 128KB (43K x 24)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 16
- Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
- Data Converters: A/D 9x10b/12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 44-TQFP
- Supplier Device Package: 44-TQFP (10x10)
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Package: 44-TQFP |
Stock2,416 |
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Microchip Technology |
IC MCU 8BIT 7KB FLASH 14SOIC
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 32MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 12
- Program Memory Size: 7KB (4K x 14)
- Program Memory Type: FLASH
- EEPROM Size: 256 x 8
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
- Data Converters: A/D 11x10b, D/A 1x5b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 14-SOIC
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Package: 14-SOIC (0.154", 3.90mm Width) |
Stock5,808 |
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Microchip Technology |
IC MCU 32BIT 1MB FLASH 100TQFP
- Core Processor: MIPS32? microAptiv?
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, IrDA, LIN, PMP, QEI, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
- Number of I/O: 78
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 42x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (12x12)
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Package: 100-TQFP |
Stock10,104 |
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Microchip Technology |
IC DAC 12BIT
- Number of Bits: 12
- Number of D/A Converters: 2
- Settling Time: 6µs (Typ)
- Output Type: Voltage - Buffered
- Differential Output: No
- Data Interface: I2C
- Reference Type: External, Internal, Supply
- Voltage - Supply, Analog: 2.7 V ~ 5.5 V
- Voltage - Supply, Digital: 2.7 V ~ 5.5 V
- INL/DNL (LSB): ±1.5, ±0.2
- Architecture: R-2R
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 8-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 8-TSSOP
- Mounting Type: -
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Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock5,280 |
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Microchip Technology |
SI PPIN HERMETIC MELF
- Diode Type: PIN - Single
- Voltage - Peak Reverse (Max): 1400V
- Current - Max: -
- Capacitance @ Vr, F: 1pF @ 100V, 1MHz
- Resistance @ If, F: 1Ohm @ 50mA, 100MHz
- Power Dissipation (Max): 10 W
- Operating Temperature: -65°C ~ 175°C
- Package / Case: SQ-MELF
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Microchip Technology |
ZENER DIODE
- Voltage - Zener (Nom) (Vz): 100 V
- Tolerance: ±5%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 1500 Ohms
- Current - Reverse Leakage @ Vr: 10 nA @ 76 V
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: DO-204AH (DO-35)
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Package: - |
Request a Quote |
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Microchip Technology |
DIODE ZENER TEMP COMPENSATED
- Voltage - Zener (Nom) (Vz): 6.2 V
- Tolerance: ±5%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 15 Ohms
- Current - Reverse Leakage @ Vr: 2 µA @ 3 V
- Voltage - Forward (Vf) (Max) @ If: -
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: DO-204AH (DO-35)
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Package: - |
Request a Quote |
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Microchip Technology |
IC MCU 32BIT 1MB FLASH 100TQFP
- Core Processor: ARM® Cortex®-M4F
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O: 52
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
- Data Converters: A/D 6x10b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TQFP
- Supplier Device Package: 100-TQFP (14x14)
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Package: - |
Request a Quote |
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Microchip Technology |
3-CHANNEL, 10-OUTPUT LINE CARD
- PLL: Yes
- Main Purpose: Ethernet, SONET/SDH, Wireless Base Stations
- Input: CMOS
- Output: CMOS, LVDS, LVPECL
- Number of Circuits: 3
- Ratio - Input:Output: 5:10
- Differential - Input:Output: Yes/Yes
- Frequency - Max: 750MHz
- Voltage - Supply: 1.8V, 3.3V
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-VQFN (9x9)
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Package: - |
Request a Quote |
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Microchip Technology |
ZENER DIODE
- Voltage - Zener (Nom) (Vz): 27 V
- Tolerance: ±2%
- Power - Max: 1.25 W
- Impedance (Max) (Zzt): 23 Ohms
- Current - Reverse Leakage @ Vr: 1 µA @ 20.6 V
- Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: DO-204AL, DO-41, Axial
- Supplier Device Package: DO-41
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 51 V
- Tolerance: ±1%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 85 Ohms
- Current - Reverse Leakage @ Vr: 50 nA @ 39 V
- Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: DO-204AH (DO-35)
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Package: - |
Request a Quote |
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Microchip Technology |
SI SCHOTTKY NON HERMETIC BEAM LE
- Diode Type: Schottky - Single
- Voltage - Peak Reverse (Max): 2V
- Current - Max: -
- Capacitance @ Vr, F: 0.1pF @ 0V, 1MHz
- Resistance @ If, F: 20Ohm @ 5mA, 1MHz
- Power Dissipation (Max): -
- Operating Temperature: -55°C ~ 150°C
- Package / Case: 2-SMD, Flat Lead
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 75 V
- Tolerance: ±5%
- Power - Max: 1.5 W
- Impedance (Max) (Zzt): 130 Ohms
- Current - Reverse Leakage @ Vr: 250 nA @ 60.4 V
- Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C
- Mounting Type: Surface Mount
- Package / Case: DO-213AB, MELF
- Supplier Device Package: DO-213AB
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Package: - |
Request a Quote |
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Microchip Technology |
RT4G150L-LGG1657PROTO
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: 151824
- Total RAM Bits: 5325
- Number of I/O: -
- Number of Gates: -
- Voltage - Supply: 1.14V ~ 1.26V
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C (TJ)
- Package / Case: 1657-BCLGA
- Supplier Device Package: 1657-CLGA (42.5x42.5)
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Package: - |
Request a Quote |
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Microchip Technology |
ZENER DIODE
- Voltage - Zener (Nom) (Vz): 13 V
- Tolerance: ±2%
- Power - Max: 5 W
- Impedance (Max) (Zzt): 3 Ohms
- Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
- Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: E, Axial
- Supplier Device Package: E, Axial
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Package: - |
Request a Quote |
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