Microchip Technology Products

OSC MEMS 25.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 ~ 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 6mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

OSC MEMS 66.6666MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 66.6666MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

OSC MEMS 25.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 25MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC CRYPTO 4.5KB SWI

• Type: Authentication Chip
• Applications: Networking and Communications
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

IC SUPERVISOR DUAL LV SOT23-5

• Type: Multi-Voltage Supervisor
• Number of Voltages Monitored: 2
• Output: Complementary
• Reset: Active High
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 2.53V, Adj
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

IC LED DRIVER LIN DIM 1A 48QFN

• Type: Linear
• Topology: -
• Internal Switch(s): No
• Number of Outputs: 8
• Voltage - Supply (Min): 10.8V
• Voltage - Supply (Max): 13.2V
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (6x6)

IC MOSFET DVR 1.5A DUAL HS 8SOIC

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 1.5A, 1.5A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 30ns, 30ns
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC EEPROM 1KBIT 400KHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC EEPROM 512KBIT 20MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 512Kb (64K x 8)
• Memory Interface: SPI
• Clock Frequency: 20MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC DSC 16BIT 128KB FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

IC MCU 16BIT 32KB FLASH 20SOIC

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 32KB (11K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

IC MCU 8BIT 4KB FLASH 14SOIC

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: USI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 4KB (2K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

IC MCU 8BIT 3KB OTP 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 20
• Program Memory Size: 3KB (2K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 72 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

IC MCU 16BIT 64KB FLASH 28SSOP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 70 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

RF TXRX MODULE

• RF Family/Standard: -
• Protocol: -
• Modulation: -
• Frequency: -
• Data Rate: -
• Power - Output: -
• Sensitivity: -
• Serial Interfaces: -
• Antenna Type: -
• Memory Size: -
• Voltage - Supply: -
• Current - Receiving: -
• Current - Transmitting: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: Module

TRANSCEIVER

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

10PRT UNMAN L2 SW W/8 INT CU PHY

• Function: Ethernet Switch
• Interface: Serial
• Number of Circuits: 1
• Voltage - Supply: 1V
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 672-BGA
• Supplier Device Package: 672-HSBGA (27x27)

IC DAC 8BIT 10MSOP

• Number of Bits: 8
• Number of D/A Converters: 1
• Settling Time: 16µs
• Output Type: -
• Differential Output: No
• Data Interface: I²C
• Reference Type: External, Internal
• Voltage - Supply, Analog: -
• Voltage - Supply, Digital: -
• INL/DNL (LSB): ±0.1, ±0.1
• Architecture: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP
• Mounting Type: Surface Mount

IC ADC 16BIT SAR 10TDFN

• Number of Bits: 16
• Sampling Rate (Per Second): 1M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: SPI
• Configuration: ADC
• Ratio - S/H:ADC: 0:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 1.7V ~ 1.9V
• Voltage - Supply, Digital: 1.7V ~ 5.5V
• Features: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 10-WFDFN Exposed Pad
• Supplier Device Package: 10-TDFN (3x3)
• Mounting Type: Surface Mount

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -55°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 33 V
• Tolerance: ±2%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 45 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 25.1 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF (Glass)
• Supplier Device Package: DO-213AB (MELF, LL41)

NPN TRANSISTOR

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 24 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 33 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 18 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 4.3 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 22 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

CLIENT OF THE MXT5822TD-ABR CHIP

• Touchscreen: 2 Wire Capacitive
• Resolution (Bits): 12 b
• Interface: I2C, SPI
• Voltage Reference: -
• Voltage - Supply: 3.3V
• Current - Supply: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

IC MCU 16BIT 512KB FLASH 48TQFP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 100MIPs
• Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
• Number of I/O: 39
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 19x12b SAR; D/A 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 16 V
• Tolerance: ±5%
• Power - Max: 10 W
• Impedance (Max) (Zzt): 4 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Stud Mount
• Package / Case: DO-203AA, DO-4, Stud
• Supplier Device Package: DO-213AA (DO-4)

IC MCU 16BIT 1MB FLASH 64VFQFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 100MIPs
• Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
• Number of I/O: 89
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 6x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)