Microchip Technology Products

OSC MEMS 100.000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Standby (Power Down)
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC REG LIN 1.5V 150MA TSOT23-5

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): -
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 150µA
• PSRR: 85dB ~ 65dB (1kHz ~ 10kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5 Thin, TSOT-23-5
• Supplier Device Package: TSOT-23-5

IC REG CTRLR SEPIC 20QFN

• Output Type: Transistor Driver
• Function: Step-Up/Step-Down
• Output Configuration: Positive
• Topology: Sepic
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Frequency - Switching: -
• Duty Cycle (Max): -
• Synchronous Rectifier: No
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Enable, Frequency Control, Ramp
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

IC MOTOR CONTROLLER

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushless DC (BLDC)
• Function: Controller - Commutation, Direction Management
• Output Configuration: Pre-Driver - Half Bridge (3)
• Interface: PWM
• Technology: NMOS, PMOS
• Step Resolution: -
• Applications: General Purpose
• Current - Output: -
• Voltage - Supply: 6 V ~ 28 V
• Voltage - Load: -
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP Exposed Pad
• Supplier Device Package: 48-TQFP (7x7)

IC LED DRIVER CTRLR DIM 16SOIC

• Type: DC DC Controller
• Topology: SEPIC, Step-Down (Buck), Step-Up (Boost)
• Internal Switch(s): No
• Number of Outputs: 1
• Voltage - Supply (Min): 9V
• Voltage - Supply (Max): 250V
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: 100kHz, 350kHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SOIC

IC FLASH 2MBIT 33MHZ 40TSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 2Mb (256K x 8)
• Memory Interface: Parallel
• Clock Frequency: 33MHz
• Write Cycle Time - Word, Page: 50µs
• Access Time: -
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 85°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 40-TFSOP (0.724", 18.40mm Width)
• Supplier Device Package: 40-TSOP

IC EEPROM 4KBIT 400KHZ SOT23-5

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (256 x 8 x 2)
• Memory Interface: I2C
• Clock Frequency: 400kHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: 900ns
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: SOT-23-5

TXRX LIN SBC 5V 8TQFP

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: 175mV
• Data Rate: -
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

IC MCU 16BIT 32KB FLASH 28SOIC

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 16 MIPs
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 32KB (11K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

IC MCU 8BIT 1.5KB OTP 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 12
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 25 x 8
• Voltage - Supply (Vcc/Vdd): 3.25 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

IC MCU 16BIT 8KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 8KB (2.75K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

IC MCU 8BIT 896B OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 96 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

IC MCU 8BIT 3.5KB FLASH 8DFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 5
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN (3x3)

IC MCU 8BIT 3.5KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, LVD, POR, WDT
• Number of I/O: 11
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

IC CPLD 64MC 20NS 44TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: -
• Number of Macrocells: 64
• Number of Gates: -
• Number of I/O: 32
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

16 BIT DSC, 256KB FLASH, 24KB RA

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 100MHz
• Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
• Number of I/O: 53
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 20x12b, D/A 3x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

IC CESOP PROCESSOR 128CH 324BGA

• Function: Telecom Circuit
• Interface: TDM
• Number of Circuits: 1
• Voltage - Supply: 1.65V ~ 1.95V
• Current - Supply: 950mA
• Power (Watts): -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 324-BGA
• Supplier Device Package: 324-PBGA (23x23)

3.5KB FLASH 256 EEPROM 256B RAM

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 6
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
• Data Converters: A/D 5x10b; D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-UDFN Exposed Pad
• Supplier Device Package: 8-UDFN (3x3)

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 200 V
• Tolerance: -
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

POWER BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1 A
• Voltage - Collector Emitter Breakdown (Max): 60 V
• Vce Saturation (Max) @ Ib, Ic: 600mV @ 100mA, 1A
• Current - Collector Cutoff (Max): 1mA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 100mA, 1V
• Power - Max: 1 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-205AD, TO-39-3 Metal Can
• Supplier Device Package: TO-39 (TO-205AD)

JFET

• FET Type: -
• Voltage - Breakdown (V(BR)GSS): -
• Drain to Source Voltage (Vdss): -
• Current - Drain (Idss) @ Vds (Vgs=0): -
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Resistance - RDS(On): -
• Power - Max: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

JFET N-CH TO18

• FET Type: N-Channel
• Voltage - Breakdown (V(BR)GSS): -
• Drain to Source Voltage (Vdss): -
• Current - Drain (Idss) @ Vds (Vgs=0): -
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Resistance - RDS(On): -
• Power - Max: -
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: TO-206AA, TO-18-3 Metal Can
• Supplier Device Package: TO-18 (TO-206AA)

PCIE SWITCH GEN4 X100 PAX 1467BB

• Applications: PCIe Switch
• Interface: PCI
• Voltage - Supply: 0.82V, 1.8V
• Package / Case: 1467-BBGA
• Supplier Device Package: 1467-BBGA (40x40)
• Mounting Type: Surface Mount

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 6.2 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1200 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

POWER BJT

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

INIC 150MBPS MOST NETWORK

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 47 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 35.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: E-MELF

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 91 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 270 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 69 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, B
• Supplier Device Package: B, SQ-MELF