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Microchip Technology |
OSC MEMS 120.000MHZ LVDS SMD
- Type: MEMS (Silicon)
- Frequency: 120MHz
- Function: Standby (Power Down)
- Output: LVDS
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±10ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 32mA
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 6-SMD, No Lead, Exposed Pad
- Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 6-SMD, No Lead, Exposed Pad |
Stock3,330 |
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Microchip Technology |
OSC MEMS 24.57600MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 24.576MHz
- Function: Enable/Disable
- Output: CMOS
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±25ppm
- Operating Temperature: -55°C ~ 125°C
- Current - Supply (Max): 35mA
- Ratings: AEC-Q100
- Mounting Type: Surface Mount
- Package / Case: 6-SMD, No Lead, Exposed Pad
- Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 6-SMD, No Lead, Exposed Pad |
Stock7,092 |
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Microchip Technology |
OSC MEMS 25.0000MHZ CMOS SMD
- Type: MEMS (Silicon)
- Frequency: 25MHz
- Function: Standby (Power Down)
- Output: CMOS
- Voltage - Supply: 2.25 V ~ 3.6 V
- Frequency Stability: ±50ppm
- Operating Temperature: -40°C ~ 85°C
- Current - Supply (Max): 35mA
- Ratings: -
- Mounting Type: Surface Mount
- Package / Case: 4-SMD, No Lead
- Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
- Height - Seated (Max): 0.035" (0.90mm)
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Package: 4-SMD, No Lead |
Stock16,968 |
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Microchip Technology |
IC EEPROM 16KBIT 20MHZ 8TSSOP
- Memory Type: Non-Volatile
- Memory Format: EEPROM
- Technology: EEPROM
- Memory Size: 16Kb (2K x 8)
- Memory Interface: SPI
- Clock Frequency: 20MHz
- Write Cycle Time - Word, Page: 5ms
- Access Time: -
- Voltage - Supply: 1.8 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 8-TSSOP
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Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock5,360 |
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Microchip Technology |
IC TRANSLATOR DUAL 3.3V 8-SOIC
- Translator Type: Mixed Signal
- Channel Type: Unidirectional
- Number of Circuits: 1
- Channels per Circuit: 2
- Voltage - VCCA: -
- Voltage - VCCB: -
- Input Signal: TTL
- Output Signal: PECL
- Output Type: Differential
- Data Rate: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Features: -
- Mounting Type: Surface Mount
- Package / Case: 8-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 8-SOIC
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Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,088 |
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Microchip Technology |
IC MCU 8BIT 768B OTP 18SOIC
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 4MHz
- Connectivity: -
- Peripherals: POR, WDT
- Number of I/O: 12
- Program Memory Size: 768B (512 x 12)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 25 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 6.25 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 18-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 18-SOIC
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Package: 18-SOIC (0.295", 7.50mm Width) |
Stock4,624 |
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Microchip Technology |
IC MCU 8BIT 32KB EPROM 40CDIP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 40MHz
- Connectivity: I2C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
- Number of I/O: 33
- Program Memory Size: 32KB (16K x 16)
- Program Memory Type: EPROM, UV
- EEPROM Size: -
- RAM Size: 1.5K x 8
- Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
- Data Converters: A/D 8x10b
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 40-CDIP (0.600", 15.24mm) Window
- Supplier Device Package: 40-CDIP
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Package: 40-CDIP (0.600", 15.24mm) Window |
Stock7,328 |
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Microchip Technology |
IC MCU 8BIT 3.5KB EPROM 18CERDIP
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: -
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Number of I/O: 13
- Program Memory Size: 3.5KB (2K x 14)
- Program Memory Type: EPROM, UV
- EEPROM Size: -
- RAM Size: 128 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 6 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: -
- Package / Case: 18-CDIP (0.300", 7.62mm) Window
- Supplier Device Package: 18-CDIP
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Package: 18-CDIP (0.300", 7.62mm) Window |
Stock5,008 |
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Microchip Technology |
IC MCU 8BIT 768B OTP 28SOIC
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 4MHz
- Connectivity: -
- Peripherals: POR, WDT
- Number of I/O: 20
- Program Memory Size: 768B (512 x 12)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 24 x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 6.25 V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock6,064 |
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Microchip Technology |
IC MCU 32BIT 32KB FLASH 28SDIP
- Core Processor: MIPS32? M4K?
- Core Size: 32-Bit
- Speed: 40MHz
- Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: 19
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 8K x 8
- Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
- Data Converters: A/D 9x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-DIP (0.300", 7.62mm)
- Supplier Device Package: 28-SPDIP
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Package: 28-DIP (0.300", 7.62mm) |
Stock3,024 |
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Microchip Technology |
IC MCU 8BIT 14KB FLASH 64QFN
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, LIN, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 54
- Program Memory Size: 14KB (8K x 14)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
- Data Converters: A/D 30x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-QFN (9x9)
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Package: 64-VFQFN Exposed Pad |
Stock6,288 |
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Microchip Technology |
IC MCU 16BIT 128KB FLASH 121BGA
- Core Processor: PIC
- Core Size: 16-Bit
- Speed: 32MHz
- Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
- Peripherals: Brown-out Detect/Reset, GFX, LVD, POR, PWM, WDT
- Number of I/O: 84
- Program Memory Size: 128KB (43K x 24)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
- Data Converters: A/D 24x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 121-TFBGA
- Supplier Device Package: 121-TFBGA (10x10)
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Package: 121-TFBGA |
Stock6,384 |
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Microchip Technology |
IC TOUCH SENSOR/LED DRVR 24QSOP
- Type: Buttons
- Proximity Detection: Yes
- Number of Inputs: 6
- LED Driver Channels: 6
- Interface: I2C, SMBus, SPI
- Resolution: -
- Voltage - Supply: 3 V ~ 3.6 V
- Current - Supply: 500µA
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 24-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 24-SSOP
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Package: 24-SSOP (0.209", 5.30mm Width) |
Stock2,718 |
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Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER
- Memory Type: Non-Volatile
- Memory Format: EEPROM
- Technology: EEPROM
- Memory Size: 4Kb (512 x 8, 256 x 16)
- Memory Interface: SPI
- Clock Frequency: 3MHz
- Write Cycle Time - Word, Page: 2ms
- Access Time: -
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Die
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Package: Die |
Stock5,632 |
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Microchip Technology |
IC DAC 10BIT V-OUT 16QFN
- Number of Bits: 10
- Number of D/A Converters: 1
- Settling Time: 16µs (Typ)
- Output Type: Voltage - Buffered
- Differential Output: Yes
- Data Interface: I²C
- Reference Type: External, Internal
- Voltage - Supply, Analog: 1.8V ~ 5.5V
- Voltage - Supply, Digital: 1.8V ~ 5.5V
- INL/DNL (LSB): ±0.25, ±0.25
- Architecture: Current Source
- Operating Temperature: -40°C ~ 125°C
- Package / Case: 16-VFQFN Exposed Pad
- Supplier Device Package: 16-QFN (3x3)
- Mounting Type: Surface Mount
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Package: 16-VFQFN Exposed Pad |
Stock22,464 |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 68 V
- Tolerance: ±2%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 155 Ohms
- Current - Reverse Leakage @ Vr: 50 nA @ 52 V
- Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: DO-204AH (DO-35)
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Package: - |
Request a Quote |
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Microchip Technology |
ZENER DIODE
- Voltage - Zener (Nom) (Vz): 39 V
- Tolerance: ±5%
- Power - Max: 10 W
- Impedance (Max) (Zzt): 4 Ohms
- Current - Reverse Leakage @ Vr: 10 µA @ 29.7 V
- Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Through Hole
- Package / Case: TO-204AD
- Supplier Device Package: TO-204AD (TO-3)
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Package: - |
Request a Quote |
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Microchip Technology |
STD RECTIFIER
- Diode Type: -
- Voltage - DC Reverse (Vr) (Max): -
- Current - Average Rectified (Io): -
- Voltage - Forward (Vf) (Max) @ If: -
- Speed: -
- Reverse Recovery Time (trr): -
- Current - Reverse Leakage @ Vr: -
- Capacitance @ Vr, F: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
- Operating Temperature - Junction: -
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Package: - |
Request a Quote |
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Microchip Technology |
PM-DIODE-SIC-SBD-SP6C
- Diode Type: Single Phase
- Technology: Silicon Carbide Schottky
- Voltage - Peak Reverse (Max): 1.2 kV
- Current - Average Rectified (Io): 100 A
- Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 100 A
- Current - Reverse Leakage @ Vr: 400 µA @ 1200 V
- Operating Temperature: -40°C ~ 175°C (TJ)
- Mounting Type: Chassis Mount
- Package / Case: Module
- Supplier Device Package: SP6
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Package: - |
Stock12 |
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Microchip Technology |
TRANS NPN 80V 10A TO59
- Transistor Type: NPN
- Current - Collector (Ic) (Max): 10 A
- Voltage - Collector Emitter Breakdown (Max): 80 V
- Vce Saturation (Max) @ Ib, Ic: 1.5V @ 500mA, 5A
- Current - Collector Cutoff (Max): 50µA
- DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 2.5A, 5V
- Power - Max: 2 W
- Frequency - Transition: -
- Operating Temperature: -65°C ~ 200°C (TJ)
- Mounting Type: Stud Mount
- Package / Case: TO-210AA, TO-59-4, Stud
- Supplier Device Package: TO-59
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Package: - |
Request a Quote |
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Microchip Technology |
8-PORT 100BASET-T1 INDUSTRIAL SW
- Protocol: Ethernet
- Function: Switch
- Interface: MII, RGMII, RMII, SGMII, SPI
- Standards: IEEE 802.3, 100 Base-T PHY
- Voltage - Supply: -
- Current - Supply: -
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 128-TQFP Exposed Pad
- Supplier Device Package: 128-TQFP (14x14)
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Package: - |
Stock138 |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 5.6 V
- Tolerance: -
- Power - Max: 500 mW
- Impedance (Max) (Zzt): -
- Current - Reverse Leakage @ Vr: -
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: DO-213AA
- Supplier Device Package: DO-213AA
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 120 V
- Tolerance: ±1%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 600 Ohms
- Current - Reverse Leakage @ Vr: 50 nA @ 91 V
- Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
- Operating Temperature: -65°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: SQ-MELF, B
- Supplier Device Package: B, SQ-MELF
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Package: - |
Request a Quote |
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Microchip Technology |
BRIDGES
- Diode Type: Single Phase
- Technology: Standard
- Voltage - Peak Reverse (Max): 110 V
- Current - Average Rectified (Io): 25 A
- Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 39 A
- Current - Reverse Leakage @ Vr: 2 µA @ 110 V
- Operating Temperature: -65°C ~ 150°C (TJ)
- Mounting Type: Chassis Mount
- Package / Case: Module
- Supplier Device Package: -
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 13 V
- Tolerance: ±10%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 90 Ohms
- Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C
- Mounting Type: Surface Mount
- Package / Case: DO-213AB, MELF
- Supplier Device Package: DO-213AB
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Package: - |
Request a Quote |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): 62 V
- Tolerance: ±5%
- Power - Max: 500 mW
- Impedance (Max) (Zzt): 185 Ohms
- Current - Reverse Leakage @ Vr: 500 nA @ 47 V
- Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
- Operating Temperature: -65°C ~ 175°C
- Mounting Type: Surface Mount
- Package / Case: DO-213AB, MELF
- Supplier Device Package: DO-213AB
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Package: - |
Request a Quote |
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Microchip Technology |
DIODE GEN PURP 75V 200MA DO35
- Diode Type: Standard
- Voltage - DC Reverse (Vr) (Max): 75 V
- Current - Average Rectified (Io): 200mA
- Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
- Speed: Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr): 20 ns
- Current - Reverse Leakage @ Vr: 500 nA @ 75 V
- Capacitance @ Vr, F: 4pF @ 0V, 1MHz
- Mounting Type: Through Hole
- Package / Case: DO-204AH, DO-35, Axial
- Supplier Device Package: DO-204AH (DO-35)
- Operating Temperature - Junction: -65°C ~ 175°C
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Package: - |
Stock1,830 |
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Microchip Technology |
VOLTAGE REGULATOR
- Voltage - Zener (Nom) (Vz): -
- Tolerance: -
- Power - Max: -
- Impedance (Max) (Zzt): -
- Current - Reverse Leakage @ Vr: -
- Voltage - Forward (Vf) (Max) @ If: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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