Microchip Technology Products

OSC MEMS 100.000MHZ HCSLLVDS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Enable/Disable
• Output: HCSL, LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±100ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 60mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 14-VFQFN Exposed Pad
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

OSC MEMS 29.4912MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 29.4912MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC REG LINEAR 2.6V 100MA SC70-5

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.6V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.3V @ 100mA
• Current - Output: 100mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 150µA
• PSRR: 70dB ~ 65dB (1kHz ~ 10kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Under Voltage Lockout (UVLO)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 5-TSSOP, SC-70-5, SOT-353
• Supplier Device Package: SC-70-5

IC REG DL BUCK/LINEAR SYNC 10DFN

• Topology: Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
• Function: Any Function
• Number of Outputs: 2
• Frequency - Switching: 2MHz
• Voltage/Current - Output 1: 3V, 500mA
• Voltage/Current - Output 2: 2.7V, 300mA
• Voltage/Current - Output 3: -
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-DFN (3x3)

IC SUPERVISOR 3.15V LOW TO92

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Reset Timeout: 150 ms Minimum
• Voltage - Threshold: 3.075V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

IC DRIVER MOSFET 3A DUAL 8DIP

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 3A, 3A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 28ns, 32ns
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

IC FLASH 1MBIT 45NS 34WFBGA

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 20µs
• Access Time: 45ns
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 34-WFBGA
• Supplier Device Package: 34-WFBGA (6x4)

IC TXRX LIN W/VREG 8DFN

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 175mV
• Data Rate: -
• Voltage - Supply: 6 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN (4x4)

IC MCU 8BIT 2KB FLASH 20TSSOP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: USI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 2KB (1K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

IC MCU 8BIT 7KB OTP 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 15
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

IC MCU 8BIT 896B OTP 18DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• EEPROM Size: 128 x 8
• RAM Size: 96 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 18-DIP (0.300", 7.62mm)
• Supplier Device Package: 18-PDIP

IC MCU 8BIT 7KB FLASH 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 368 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

IC MCU 8BIT 14KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, IBT LIN/J2602
• Number of I/O: 12
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

IC MCU 8BIT 384B FLASH SOT23-6

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 3
• Program Memory Size: 384B (256 x 12)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: SOT-23-6
• Supplier Device Package: SOT-23-6

IC MCU 8BIT 32KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 64MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 35x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

FLASH, 256KB SRAM

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 300MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 114
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-TFBGA
• Supplier Device Package: 144-TFBGA (10x10)

COMPARATOR, DAC, 12-BIT ADCC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 17x12b, D/A 1x5b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

4K 512X8 SERIAL EE IND

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (512 x 8)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC MEMORY

• Memory Type: -
• Memory Format: -
• Technology: -
• Memory Size: -
• Memory Interface: -
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

IC MCU 16BIT 64KB FLASH 28UQFN

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
• Data Converters: A/D 10x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-UFQFN Exposed Pad
• Supplier Device Package: 28-UQFN (4x4)

IC CLOCK GENERATOR 20QFN

• Type: Clock Generator
• PLL: Yes
• Input: Clock
• Output: LVDS
• Number of Circuits: 2
• Ratio - Input:Output: 2:3
• Differential - Input:Output: No/Yes
• Frequency - Max: 460MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.25V ~ 3.6V
• Operating Temperature: -20°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (5x3.2)

RF MOSFET GAN 50V

• Transistor Type: GaN
• Frequency: 1.03GHz ~ 1.09GHz
• Gain: 18.5dB
• Voltage - Test: 50 V
• Current Rating: -
• Noise Figure: -
• Current - Test: 40 mA
• Power - Output: 35W
• Voltage - Rated: 150 V
• Package / Case: Module
• Supplier Device Package: -

IC MCU 32BIT 512KB FLASH 48VQFN

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
• Number of I/O: 37
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
• Data Converters: A/D 18x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-VQFN (6x6)

DIODE SCHOTTKY 100V 1A DO41

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 100 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 690 mV @ 1 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 100 µA @ 100 V
• Capacitance @ Vr, F: 70pF @ 5V, 1MHz
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO041, Axial
• Supplier Device Package: DO-41
• Operating Temperature - Junction: -65°C ~ 150°C

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 2.2 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1300 Ohms
• Current - Reverse Leakage @ Vr: 4 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

DIODE ZENER 3.3V 500MW DO35

• Voltage - Zener (Nom) (Vz): 3.3 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 28 Ohms
• Current - Reverse Leakage @ Vr: 5 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

POWER BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 10 A
• Voltage - Collector Emitter Breakdown (Max): 180 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: 87 W
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: TO-204AA, TO-3
• Supplier Device Package: TO-204AD (TO-3)

IC CLOCK GENERATOR 14QFN

• Type: Clock Generator
• PLL: Yes
• Input: -
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 3:2
• Differential - Input:Output: No/No
• Frequency - Max: 125MHz
• Divider/Multiplier: Yes/No
• Voltage - Supply: 2.25V ~ 3.6V, 1.65V ~ 3.6V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SMD, No Lead, Exposed Pad
• Supplier Device Package: 14-QFN (3.2x2.5)