Microchip Technology Products

OSC MEMS 24.576MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24.576MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

OSC MEMS 12.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 12MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

IC REG LINEAR 1.85V/2.6V 10MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.85V, 2.6V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
• Current - Output: 150mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 80µA
• PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
• Control Features: Enable, Power On Reset
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad, 10-MLF?
• Supplier Device Package: 10-MLF? (3x3)

IC REG LINEAR 3.3V 500MA 3DDPAK

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 6V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.35V @ 500mA
• Current - Output: 500mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 220µA
• PSRR: 60dB (100Hz)
• Control Features: -
• Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-263-4, D2Pak (3 Leads + Tab), TO-263AA
• Supplier Device Package: 3-DDPAK

IC REG CTRLR BUCK 10MSOP

• Output Type: Transistor Driver
• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 28 V
• Frequency - Switching: 600kHz
• Duty Cycle (Max): 82%
• Synchronous Rectifier: Yes
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Enable, Power Good
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
• Supplier Device Package: 10-MSOP-EP

IC ENERGY POLYPH METER 48-TQFP

• Input Impedance: 50 kOhm, 80 kOhm, 120 kOhm
• Measurement Error: 0.5%
• Voltage - I/O High: 2.8V, 3.6V
• Voltage - I/O Low: 0.4V, 0.8V
• Current - Supply: 25mA
• Voltage - Supply: 2.8 V ~ 3.6 V
• Meter Type: 3 Phase
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

IC EEPROM 4KBIT 2MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 4Kb (512 x 8)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

IC EEPROM 512KBIT 20MHZ 8DFN

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 512Kb (64K x 8)
• Memory Interface: SPI
• Clock Frequency: 20MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN-S (6x5)

IC AMP POST 5V/3.3V 10-MSOP

• Type: Limiting Postamplifier
• Applications: Optical Networks
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP

IC MCU 8BIT 32KB FLASH 44QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-VQFN Exposed Pad
• Supplier Device Package: 44-QFN (8x8)

IC MCU 8BIT 1.5KB OTP 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 12
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 25 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

IC MCU 8BIT 14KB FLASH 40DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIP

IC MCU 8BIT 16KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

IC TOUCH CTLR PROJECTED 28UQFN

• Touchscreen: 2 Wire Capacitive
• Resolution (Bits): -
• Interface: I2C
• Voltage Reference: -
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Supply: 1.17mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-UFQFN Exposed Pad
• Supplier Device Package: 28-QFN (4x4)

IC ADC 10BIT 2.7V 4CH SPI 14SOIC

• Number of Bits: 10
• Sampling Rate (Per Second): 200k
• Number of Inputs: 2, 4
• Input Type: Pseudo-Differential, Single Ended
• Data Interface: SPI
• Configuration: MUX-S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: SAR
• Reference Type: External
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC
• Mounting Type: -

RF TXRX MODULE 802.15.4 U.FL ANT

• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: -
• Frequency: 2.4GHz
• Data Rate: 250kbps
• Power - Output: 19dBm
• Sensitivity: -104dBm
• Serial Interfaces: SPI
• Antenna Type: Not Included, U.FL
• Memory Size: -
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Receiving: 32mA
• Current - Transmitting: 140mA
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 12-SMD Module

IC CLK BUFFER 1:4 750MHZ 16QFN

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:4
• Differential - Input:Output: Yes/Yes
• Input: CML, HCSL, LVCMOS, LVDS, LVPECL
• Output: LVPECL
• Frequency - Max: 750MHz
• Voltage - Supply: 2.375V ~ 3.465V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

IC MCU 32BIT 2MB FLASH 169LFBGA

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit Single-Core
• Speed: 200MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8 + 32MB DDR2 SDRAM
• Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
• Data Converters: A/D 45x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-LFBGA (11x11)

DIODE GEN PURP 200V 12A TO254

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 200 V
• Current - Average Rectified (Io): 12A
• Voltage - Forward (Vf) (Max) @ If: 1.05 V @ 12 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 200 V
• Capacitance @ Vr, F: 300pF @ 5V, 1MHz
• Mounting Type: Through Hole
• Package / Case: TO-254-3, TO-254AA
• Supplier Device Package: TO-254
• Operating Temperature - Junction: -

RECTIFIER

• Voltage - Zener (Nom) (Vz): 5.6 V
• Tolerance: ±5%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 1 Ohms
• Current - Reverse Leakage @ Vr: 5 mA @ 4.28 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: D-5B

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 100 V
• Tolerance: ±2%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 350 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 76 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -55°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO041, Axial
• Supplier Device Package: DO-41

DIODE ZENER 8.7V DO-213AB

• Voltage - Zener (Nom) (Vz): 8.7 V
• Tolerance: ±5%
• Power - Max: -
• Impedance (Max) (Zzt): 8 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 6.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF
• Supplier Device Package: DO-213AB

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 16 V
• Tolerance: ±1%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 12.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A

IC SOC RISC-V 536LFBGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128kB
• RAM Size: 2.2MB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 254K Logic Modules
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 536-LFBGA, CSPBGA
• Supplier Device Package: 536-LFBGA

IC MCU 16BIT 128KB FLASH 28UQFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 28-UQFN Exposed Pad
• Supplier Device Package: 28-UQFN (6x6)

IC MCU 8BIT 56KB FLASH 64VFQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 56KB (32K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 45x12b; D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

IC SOC RISC-V 784BGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128kB
• RAM Size: 857.6kB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 93K Logic Modules
• Operating Temperature: 0°C ~ 100°C
• Package / Case: 784-BGA
• Supplier Device Package: 784-BGA

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 43 V
• Tolerance: ±2%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 40 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 34.4 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Supplier Device Package: DO-41