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NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock5,968 |
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32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock3,712 |
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32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock4,528 |
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32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU TRIPLE POWER ARC
- Core Processor: e200z4
- Core Size: 32-Bit Tri-Core
- Speed: 150MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
- Data Converters: A/D 12b SAR, 16b Sigma-Delta
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock6,480 |
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32-Bit Tri-Core | 150MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | - | 3MB (3M x 8) | FLASH | - | 192K x 8 | 3.5 V ~ 5.5 V | A/D 12b SAR, 16b Sigma-Delta | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
ARM 32-BIT MCU TRIPLE CORE 4MB
- Core Processor: ARM® Cortex®-A5, -M4, -M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP Exposed Pad
- Supplier Device Package: 208-LQFP (28x28)
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Package: 208-LQFP Exposed Pad |
Stock4,688 |
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32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 4MB (4M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP Exposed Pad | 208-LQFP (28x28) |
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NXP |
DUAL CORE 4M FLASH 512K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock7,200 |
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32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP |
DUAL CORE 4M FLASH 512
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock5,808 |
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32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP |
FREESCALE 32-BIT MCU TRIPLE POW
- Core Processor: e200z4
- Core Size: 32-Bit Tri-Core
- Speed: 150MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
- Data Converters: A/D 12b SAR, 16b Sigma-Delta
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock4,912 |
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32-Bit Tri-Core | 150MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | - | 4MB (4M x 8) | FLASH | - | 256K x 8 | 3.5 V ~ 5.5 V | A/D 12b SAR, 16b Sigma-Delta | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 151
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 324-BBGA
- Supplier Device Package: 324-TEPBGA (23x23)
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Package: 324-BBGA |
Stock5,920 |
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32-Bit | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 151 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14 V ~ 5.25 V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 160K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock4,688 |
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32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
DUAL CORE 3M FLASH 384K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
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Package: 256-LBGA |
Stock7,440 |
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32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
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NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock6,192 |
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32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock7,552 |
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32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU POWER ARCH 1.5M
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP |
Stock7,792 |
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32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
ARM 32-BIT MCU TRIPLE CORE 3MB
- Core Processor: ARM® Cortex®-A5, -M4, -M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 516-BGA
- Supplier Device Package: 516-MAPBGA (27x27)
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Package: 516-BGA |
Stock2,240 |
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32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 516-BGA | 516-MAPBGA (27x27) |
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NXP |
DUAL CORE 3M FLASH 512K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
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Package: 176-LQFP Exposed Pad |
Stock7,120 |
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32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP |
DUAL CORE 6M FLASH 768K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 6MB (6M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP Exposed Pad |
Stock6,768 |
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32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP |
DUAL CORE 4M FLASH 512
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP Exposed Pad |
Stock7,056 |
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32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP |
DUAL CORE 3M FLASH 384K RAM F
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP Exposed Pad |
Stock4,432 |
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32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU DUAL POWER ARCH
- Core Processor: e200z4d, e200z0h
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/120MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP |
Stock3,056 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
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NXP |
NXP 32-BIT MCU DUAL POWER ARCH
- Core Processor: e200z4d, e200z0h
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/120MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP |
Stock7,696 |
|
32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
|
|
NXP |
32 BIT DUAL CORE 3M FLASH 512
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
|
Package: 256-LBGA |
Stock3,632 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
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|
NXP |
ARM 32-BIT MCU TRIPLE CORE 4MB
- Core Processor: ARM® Cortex®-A5, -M4, -M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 516-BGA
- Supplier Device Package: 516-MAPBGA (27x27)
|
Package: 516-BGA |
Stock4,624 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 4MB (4M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 516-BGA | 516-MAPBGA (27x27) |
|
|
NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z4d
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 147
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 27x10b, 5x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP |
Stock3,664 |
|
32-Bit | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 147 | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 128K x 8 | 3 V ~ 5.5 V | A/D 27x10b, 5x12b | Internal | -40°C ~ 105°C (TA) | - | 176-LQFP | 176-LQFP (24x24) |
|
|
NXP |
SINGLE CORE, 3M FLASH
- Core Processor: e200z4
- Core Size: 32-Bit
- Speed: 160MHz
- Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
- Peripherals: DMA, I²S, POR, WDT
- Number of I/O: 129
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 384K x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP Exposed Pad |
Stock7,248 |
|
32-Bit | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 129 | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b, 16x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
|
|
NXP |
32 BITDUAL CORE3M FLASH384 RA
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 178
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 256-LBGA
- Supplier Device Package: 256-MAPPBGA (17x17)
|
Package: 256-LBGA |
Stock4,144 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 256-LBGA | 256-MAPPBGA (17x17) |
|
|
NXP |
32 BITDUAL CORE3M FLASH512K R
- Core Processor: e200z2, e200z4
- Core Size: 32-Bit Dual-Core
- Speed: 80MHz/160MHz
- Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals: DMA, LVD, POR, WDT
- Number of I/O: 129
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 80x10b, 64x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-LQFP (24x24)
|
Package: 176-LQFP Exposed Pad |
Stock2,304 |
|
32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP (24x24) |
|
|
NXP |
ARM 32-BIT MCU TRIPLE CORE 3MB
- Core Processor: ARM® Cortex®-A5, -M4, -M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 208-LQFP Exposed Pad
- Supplier Device Package: 208-LQFP (28x28)
|
Package: 208-LQFP Exposed Pad |
Stock4,992 |
|
32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | - | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15 V ~ 5.5 V | A/D 24x12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP Exposed Pad | 208-LQFP (28x28) |