Page 128 - NXP Products - Embedded - Microcontrollers

SPC5777CAK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 516-BGA

Stock5,328
SPC5777CRK3MMO3
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 516-BGA

Stock4,736
SPC5777CSK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 416-BGA

Stock6,016
SPC5748GHK0AMMJ6
NXP

ULTRA RELIABLE MCU WITH VAST PER

Package: 256-LBGA

Stock7,136
SPC5675KFF0VMM2R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 257-LFBGA

Stock5,040
SPC5675KFAVMM2R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

Package: 257-LFBGA

Stock9,828
SPC5748GHK0AMKU6
NXP

ULTRA RELIABLE MCU WITH VAST PER

Package: 176-LQFP Exposed Pad

Stock7,584
SPC5777CLK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 416-BGA

Stock5,072
MAC7116VAG50
NXP

32-BIT MCU ARM7TDMI-S 32KB FLA

Package: 144-LQFP

Stock4,992
SPC5777CDK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 416-BGA

Stock6,432
SPC5777CSK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 416-BGA

Stock7,984
SPC5777CRK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 416-BGA

Stock3,888
SPC5777CAK3MME3
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 416-BGA

Stock6,224
SPC5748GTK0AMMJ6
NXP

TRIPLE CORE 6M FLASH 768K RAM

Package: 256-LBGA

Stock2,752
SPC5748GTK0AMKU6
NXP

TRIPLE CORE 6M FLASH

Package: 176-LQFP Exposed Pad

Stock6,080
SP5748GBK0AMMN6R
NXP

TRIPLE CORE 6M FLASH

Package: 324-LBGA

Stock2,912
SPC5777CLK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 516-BGA

Stock4,000
SPC5777CDK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 516-BGA

Stock7,536
SPC5777CCK3MMO3R
NXP

NXP 32-BIT MCU POWER ARCH CORES

Package: 516-BGA

Stock6,960
SP5748GHK0AMMJ6R
NXP

ULTRA RELIABLE MCU WITH VAST PER

Package: 256-LBGA

Stock6,336

Part Number	Manufacturer	Description	Package	Stock	Core Size	Speed	Connectivity	Peripherals	Number of I/O	Program Memory Size	Program Memory Type	EEPROM Size	RAM Size	Voltage - Supply (Vcc/Vdd)	Data Converters	Oscillator Type	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
SPC5777CAK3MMO3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock5,328	32-Bit Tri-Core	264MHz	EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CRK3MMO3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock4,736	32-Bit Tri-Core	264MHz	EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CSK3MME3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock6,016	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SPC5748GHK0AMMJ6	NXP	ULTRA RELIABLE MCU WITH VAST PER Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: 256-LBGA	Stock7,136	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	178	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	256-LBGA	256-MAPPBGA (17x17)
SPC5675KFF0VMM2R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	Package: 257-LFBGA	Stock5,040	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 22x12b	Internal	-40°C ~ 105°C (TA)	-	257-LFBGA	257-MAPBGA (14x14)
SPC5675KFAVMM2R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	Package: 257-LFBGA	Stock9,828	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	2MB (2M x 8)	FLASH	64K x 8	512K x 8	1.14 V ~ 5.5 V	A/D 22x12b	Internal	-40°C ~ 105°C (TA)	-	257-LFBGA	257-MAPBGA (14x14)
SPC5748GHK0AMKU6	NXP	ULTRA RELIABLE MCU WITH VAST PER Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock7,584	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	129	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	176-LQFP Exposed Pad	176-LQFP (24x24)
SPC5777CLK3MME3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock5,072	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
MAC7116VAG50	NXP	32-BIT MCU ARM7TDMI-S 32KB FLA Core Processor: ARM7® Core Size: 32-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR Number of I/O: 112 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 32K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	Package: 144-LQFP	Stock4,992	32-Bit	50MHz	CANbus, EBI/EMI, I²C, SCI, SPI	DMA, POR	112	1MB (1M x 8)	FLASH	32K x 8	48K x 8	2.35 V ~ 5.5 V	A/D 16x8/10b	Internal	-40°C ~ 105°C (TA)	-	144-LQFP	144-LQFP (20x20)
SPC5777CDK3MME3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock6,432	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SPC5777CSK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock7,984	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SPC5777CRK3MME3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock3,888	32-Bit Tri-Core	264MHz	EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SPC5777CAK3MME3	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock6,224	32-Bit Tri-Core	264MHz	EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SPC5748GTK0AMMJ6	NXP	TRIPLE CORE 6M FLASH 768K RAM Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: 256-LBGA	Stock2,752	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	178	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	256-LBGA	256-MAPPBGA (17x17)
SPC5748GTK0AMKU6	NXP	TRIPLE CORE 6M FLASH Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock6,080	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	129	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	176-LQFP Exposed Pad	176-LQFP (24x24)
SP5748GBK0AMMN6R	NXP	TRIPLE CORE 6M FLASH Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 246 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 324-LBGA Supplier Device Package: 324-MAPBGA (19x19)	Package: 324-LBGA	Stock2,912	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	246	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	324-LBGA	324-MAPBGA (19x19)
SPC5777CLK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock4,000	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CDK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock7,536	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CCK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock6,960	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SP5748GHK0AMMJ6R	NXP	ULTRA RELIABLE MCU WITH VAST PER Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: 256-LBGA	Stock6,336	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	178	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	256-LBGA	256-MAPPBGA (17x17)
SPC5645SF1CVU	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z4d Core Size: 32-Bit Speed: 125MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 177 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.064M x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 20x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	Package: 416-BBGA	Stock2,256	32-Bit	125MHz	CANbus, I²C, LINbus, SCI, SPI	DMA, POR, PWM, WDT	177	2MB (2M x 8)	FLASH	-	1.064M x 8	3 V ~ 5.5 V	A/D 20x10b	Internal	-40°C ~ 85°C (TA)	-	416-BBGA	416-PBGA (27x27)
SPC5674KAVMS2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	Package: 473-LFBGA	Stock4,992	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	1.5MB (1.5M x 8)	FLASH	64K x 8	384K x 8	1.14 V ~ 5.5 V	A/D 34x12b	Internal	-40°C ~ 105°C (TA)	-	473-LFBGA	473-MAPBGA (19x19)
SPC5777CK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock2,192	32-Bit Tri-Core	264MHz	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CAK3MMO3R	NXP	NXP 32-BIT MCU POWER ARCH CORES Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock3,552	32-Bit Tri-Core	264MHz	EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5646CCK0MLT1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 177 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-TQFP (28x28)	Package: 208-LQFP	Stock5,504	32-Bit Dual-Core	80MHz/120MHz	CANbus, Ethernet, I²C, LINbus, SCI, SPI	DMA, POR, PWM, WDT	177	3MB (3M x 8)	FLASH	64K x 8	256K x 8	3 V ~ 5.5 V	A/D 33x10b, 10x12b	Internal	-40°C ~ 125°C (TA)	-	208-LQFP	208-TQFP (28x28)
SPC5646CCF0MLT1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 177 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-TQFP (28x28)	Package: 208-LQFP	Stock3,520	32-Bit Dual-Core	80MHz/120MHz	CANbus, Ethernet, I²C, LINbus, SCI, SPI	DMA, POR, PWM, WDT	177	3MB (3M x 8)	FLASH	64K x 8	256K x 8	3 V ~ 5.5 V	A/D 33x10b, 10x12b	Internal	-40°C ~ 125°C (TA)	-	208-LQFP	208-TQFP (28x28)
SPC5674KAVMM2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	Package: 257-LFBGA	Stock5,664	32-Bit Dual-Core	180MHz	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI	DMA, POR, PWM, WDT	-	1.5MB (1.5M x 8)	FLASH	64K x 8	384K x 8	1.14 V ~ 5.5 V	A/D 22x12b	Internal	-40°C ~ 105°C (TA)	-	257-LFBGA	257-MAPBGA (14x14)
SPC5748GBK0AMMJ6	NXP	TRIPLE CORE 6M FLASH 768K RAM Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	Package: 256-LBGA	Stock4,416	32-Bit Tri-Core	80MHz/160MHz	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	DMA, LVD, POR, WDT	178	6MB (6M x 8)	FLASH	-	768K x 8	3 V ~ 5.5 V	A/D 80x10b, 64x12b	Internal	-40°C ~ 125°C (TA)	-	256-LBGA	256-MAPPBGA (17x17)