Page 338 - NXP Products - Embedded - Microcontrollers

S912ZVML12F2WKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock6,288
S912ZVML12F2WKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock7,040
S912ZVML12F2MKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock3,520
S912ZVML12F2MKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock5,328
S912ZVML12F1WKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock7,584
S912ZVML12F1VKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock5,728
S912ZVML12F1VKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock2,432
S912ZVML12F1MKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock6,416
S912ZVMC64F1WKH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock3,328
S912ZVMC64F1VKH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock4,896
S912ZVMC64F1MKHR
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock4,432
S912ZVMC64F1MKH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock7,728
S912ZVMC12F2WKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock2,208
S912ZVMC12F2WKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock3,728
S912ZVMC12F1MKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Package: 64-LQFP Exposed Pad

Stock6,176
SPC5777CK2MMO3R
NXP

IC MCU 32BIT 8MB FLASH 516BGA

Package: 516-BGA

Stock5,008
SPC5777CK2MME3R
NXP

IC MCU 32BIT 8MB FLASH 416BGA

Package: 416-BGA

Stock3,536
SC8568EVTANGG
NXP

IC MCU

Package: -

Stock6,496
SC8568ECVTATGG
NXP

IC MCU

Package: -

Stock7,136
SC34671AEPR2
NXP

IC MCU

Package: -

Stock540,000

Part Number	Manufacturer	Description	Package	Stock	Core Size	Speed	Connectivity	Peripherals	Number of I/O	Program Memory Size	Program Memory Type	EEPROM Size	RAM Size	Voltage - Supply (Vcc/Vdd)	Data Converters	Oscillator Type	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
S912ZVML12F2WKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock6,288	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F2WKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock7,040	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F2MKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock3,520	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F2MKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock5,328	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1WKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock7,584	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1VKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock5,728	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 105°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1VKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock2,432	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 105°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVML12F1MKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock6,416	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1WKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock3,328	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1VKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock4,896	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 105°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1MKHR	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock4,432	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC64F1MKH	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock7,728	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	64KB (64K x 8)	FLASH	512 x 8	4K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC12F2WKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock2,208	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC12F2WKH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock3,728	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 150°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
S912ZVMC12F1MKHR	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	Package: 64-LQFP Exposed Pad	Stock6,176	16-Bit	50MHz	CAN, LIN, SCI, SPI	DMA, POR, PWM, WDT	42	128KB (128K x 8)	FLASH	512 x 8	8K x 8	4.5 V ~ 5.5 V	A/D 9x12b	Internal	-40°C ~ 125°C (TA)	-	64-LQFP Exposed Pad	64-LQFP EP (10x10)
SPC5777CK2MMO3R	NXP	IC MCU 32BIT 8MB FLASH 516BGA Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	Package: 516-BGA	Stock5,008	32-Bit Tri-Core	264MHz	CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	516-BGA	516-MAPBGA (27x27)
SPC5777CK2MME3R	NXP	IC MCU 32BIT 8MB FLASH 416BGA Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock3,536	32-Bit Tri-Core	264MHz	CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)
SC8568EVTANGG	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock6,496	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SC8568ECVTATGG	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,136	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SC34671AEPR2	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock540,000	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SC34671AEP	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock3,920	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SVF532R2K1CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	Package: 364-LFBGA	Stock3,376	32-Bit Dual-Core	400MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	136	-	ROMless	-	1MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	364-LFBGA	364-MAPBGA (17x17)
SVF531R3K1CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	Package: 364-LFBGA	Stock5,648	32-Bit Dual-Core	400MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	136	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	364-LFBGA	364-MAPBGA (17x17)
SVF332R3K1CKU2	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 266MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 115 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock4,640	32-Bit Dual-Core	266MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	115	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	176-LQFP Exposed Pad	176-LQFP (24x24)
SVF331R3K1CKU2	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 266MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 115 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock3,904	32-Bit Dual-Core	266MHz	CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG	LCD, SAI	115	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D 10x12b	Internal	-40°C ~ 85°C (TA)	-	176-LQFP Exposed Pad	176-LQFP (24x24)
MVF62NN151CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	Package: 364-LFBGA	Stock2,160	32-Bit Dual-Core	400MHz	CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG	DMA, LVD, WDT	-	-	ROMless	-	1.5MB	3 V ~ 3.6 V	A/D Dual x 12b, D/A Dual x 12b	Internal	-40°C ~ 85°C (TA)	-	364-LFBGA	364-MAPBGA (17x17)
P89LPC925FDHY	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 4x8b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	Package: 20-TSSOP (0.173", 4.40mm Width)	Stock6,720	8-Bit	18MHz	I2C, UART/USART	Brown-out Detect/Reset, LED, POR, PWM, WDT	18	8KB (8K x 8)	FLASH	-	256 x 8	2.4 V ~ 3.6 V	A/D 4x8b; D/A 1x8b	Internal	-40°C ~ 85°C (TA)	-	20-TSSOP (0.173", 4.40mm Width)	20-TSSOP
SPC5777CK2MME3	NXP	IC MCU 32BIT 8MB FLASH 416BGA Core Processor: e200z7 Core Size: 32-Bit Tri-Core Speed: 264MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16b Sigma-Delta, eQADC Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BGA Supplier Device Package: 416-MAPBGA (27x27)	Package: 416-BGA	Stock5,696	32-Bit Tri-Core	264MHz	CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI	DMA, LVD, POR, Zipwire	-	8MB (8M x 8)	FLASH	-	512K x 8	3 V ~ 5.5 V	A/D 16b Sigma-Delta, eQADC	Internal	-40°C ~ 125°C (TA)	-	416-BGA	416-MAPBGA (27x27)