Page 96 - Preci-Dip Products - Sockets for ICs, Transistors

514-83-356M26-001148
Preci-Dip

CONN SOCKET BGA 356POS GOLD

Package: -

Stock2,088
558-10-272M20-001104
Preci-Dip

BGA SURFACE MOUNT 1.27MM

Package: -

Stock5,436
514-83-352M26-001148
Preci-Dip

CONN SOCKET BGA 352POS GOLD

Package: -

Stock8,586
514-87-432M31-001148
Preci-Dip

CONN SOCKET BGA 432POS GOLD

Package: -

Stock4,752
550-10-432M31-001166
Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

Package: -

Stock5,256
518-77-256M20-001106
Preci-Dip

CONN SOCKET PGA 256POS GOLD

Package: -

Stock8,352
518-77-256M16-000106
Preci-Dip

CONN SOCKET PGA 256POS GOLD

Package: -

Stock8,406
514-87-420M26-001148
Preci-Dip

CONN SOCKET BGA 420POS GOLD

Package: -

Stock7,326
518-77-255M16-001106
Preci-Dip

CONN SOCKET PGA 255POS GOLD

Package: -

Stock2,214
550-10-420M26-001166
Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

Package: -

Stock3,544
550-10-292M20-001152
Preci-Dip

BGA SOLDER TAIL

Package: -

Stock2,880
518-77-256M20-001105
Preci-Dip

CONN SOCKET PGA 256POS GOLD

Package: -

Stock3,544
518-77-256M16-000105
Preci-Dip

CONN SOCKET PGA 256POS GOLD

Package: -

Stock8,874
558-10-272M20-001101
Preci-Dip

PGA SOLDER TAIL 1.27MM

Package: -

Stock3,024
518-77-255M16-001105
Preci-Dip

CONN SOCKET PGA 255POS GOLD

Package: -

Stock6,912
558-10-256M16-000104
Preci-Dip

BGA SURFACE MOUNT 1.27MM

Package: -

Stock2,610
558-10-256M20-001104
Preci-Dip

BGA SURFACE MOUNT 1.27MM

Package: -

Stock6,714
558-10-255M16-001104
Preci-Dip

BGA SURFACE MOUNT 1.27MM

Package: -

Stock6,804
546-83-559-22-131147
Preci-Dip

CONN SOCKET PGA 559POS GOLD

Package: -

Stock6,012
514-87-400M20-000148
Preci-Dip

CONN SOCKET BGA 400POS GOLD

Package: -

Stock4,986

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
514-83-356M26-001148	Preci-Dip	CONN SOCKET BGA 356POS GOLD Type: BGA Number of Positions or Pins (Grid): 356 (26 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,088	356 (26 x 26)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
558-10-272M20-001104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 272 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,436	272 (20 x 20)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
514-83-352M26-001148	Preci-Dip	CONN SOCKET BGA 352POS GOLD Type: BGA Number of Positions or Pins (Grid): 352 (26 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,586	352 (26 x 26)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
514-87-432M31-001148	Preci-Dip	CONN SOCKET BGA 432POS GOLD Type: BGA Number of Positions or Pins (Grid): 432 (31 x 31) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,752	432 (31 x 31)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
550-10-432M31-001166	Preci-Dip	BGA PIN ADAPTER 1.27MM SMD Type: BGA Number of Positions or Pins (Grid): 432 (31 x 31) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,256	432 (31 x 31)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-256M20-001106	Preci-Dip	CONN SOCKET PGA 256POS GOLD Type: PGA Number of Positions or Pins (Grid): 256 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,352	256 (20 x 20)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-256M16-000106	Preci-Dip	CONN SOCKET PGA 256POS GOLD Type: PGA Number of Positions or Pins (Grid): 256 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,406	256 (16 x 16)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
514-87-420M26-001148	Preci-Dip	CONN SOCKET BGA 420POS GOLD Type: BGA Number of Positions or Pins (Grid): 420 (26 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,326	420 (26 x 26)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
518-77-255M16-001106	Preci-Dip	CONN SOCKET PGA 255POS GOLD Type: PGA Number of Positions or Pins (Grid): 255 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,214	255 (16 x 16)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-420M26-001166	Preci-Dip	BGA PIN ADAPTER 1.27MM SMD Type: BGA Number of Positions or Pins (Grid): 420 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,544	420 (26 x 26)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-292M20-001152	Preci-Dip	BGA SOLDER TAIL Type: BGA Number of Positions or Pins (Grid): 292 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,880	292 (20 x 20)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-256M20-001105	Preci-Dip	CONN SOCKET PGA 256POS GOLD Type: PGA Number of Positions or Pins (Grid): 256 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,544	256 (20 x 20)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-256M16-000105	Preci-Dip	CONN SOCKET PGA 256POS GOLD Type: PGA Number of Positions or Pins (Grid): 256 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,874	256 (16 x 16)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-272M20-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 272 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,024	272 (20 x 20)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-255M16-001105	Preci-Dip	CONN SOCKET PGA 255POS GOLD Type: PGA Number of Positions or Pins (Grid): 255 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,912	255 (16 x 16)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-256M16-000104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 256 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,610	256 (16 x 16)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-256M20-001104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 256 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,714	256 (20 x 20)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-255M16-001104	Preci-Dip	BGA SURFACE MOUNT 1.27MM Type: BGA Number of Positions or Pins (Grid): 255 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,804	255 (16 x 16)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
546-83-559-22-131147	Preci-Dip	CONN SOCKET PGA 559POS GOLD Type: PGA Number of Positions or Pins (Grid): 559 (22 x 22) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Bronze Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,012	559 (22 x 22)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
514-87-400M20-000148	Preci-Dip	CONN SOCKET BGA 400POS GOLD Type: BGA Number of Positions or Pins (Grid): 400 (20 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,986	400 (20 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
550-10-400M20-000166	Preci-Dip	BGA PIN ADAPTER 1.27MM SMD Type: BGA Number of Positions or Pins (Grid): 400 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,356	400 (20 x 20)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-272M20-001152	Preci-Dip	BGA SOLDER TAIL Type: BGA Number of Positions or Pins (Grid): 272 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Brass Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,564	272 (20 x 20)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
514-87-388M26-001148	Preci-Dip	CONN SOCKET BGA 388POS GOLD Type: BGA Number of Positions or Pins (Grid): 388 (26 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,070	388 (26 x 26)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
558-10-256M16-000101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 256 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,384	256 (16 x 16)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-256M20-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 256 (20 x 20) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,892	256 (20 x 20)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-388M26-001166	Preci-Dip	BGA PIN ADAPTER 1.27MM SMD Type: BGA Number of Positions or Pins (Grid): 388 (26 x 26) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,690	388 (26 x 26)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
558-10-255M16-001101	Preci-Dip	PGA SOLDER TAIL 1.27MM Type: PGA Number of Positions or Pins (Grid): 255 (16 x 16) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: FR4 Epoxy Glass Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,930	255 (16 x 16)	0.050" (1.27mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
546-83-529-21-121147	Preci-Dip	CONN SOCKET PGA 529POS GOLD Type: PGA Number of Positions or Pins (Grid): 529 (21 x 21) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Bronze Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,928	529 (21 x 21)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C