Page 2 - Samtec Inc. Products - Sockets for ICs, Transistors

ICF-628-T-O-TR
Samtec Inc.

SURFACE MOUNT DIP SOCKETS

Package: -

Stock7,524
APA-316-T-A1
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock7,542
PLCC-032-T-N-TR
Samtec Inc.

CONN SOCKET PLCC 32POS TIN

Package: -

Stock7,200
PLCC-032-TM-N-TR
Samtec Inc.

CONN SOCKET PLCC 32POS TIN

Package: -

Stock8,046
ICF-318-T-O
Samtec Inc.

SURFACE MOUNT DIP SOCKETS

Package: -

Stock6,606
ICO-308-LGT
Samtec Inc.

CONN IC DIP SOCKET 8POS GOLD

Package: -

Stock8,136
APA-320-T-J
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock4,608
PLCC-028-T-N-TR
Samtec Inc.

CONN SOCKET PLCC 28POS TIN

Package: -

Stock8,388
APA-308-T-P
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock3,042
APA-308-G-J
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock6,534
APA-308-T-B
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock2,754
ICO-314-CTT
Samtec Inc.

CONN IC DIP SOCKET 14POS TIN

Package: -

Stock2,952
APA-314-T-A
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock2,646
ICO-316-SST
Samtec Inc.

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock4,068
ICF-308-S-O-TR
Samtec Inc.

SURFACE MOUNT DIP SOCKETS

Package: -

Stock6,264
APA-314-T-A1
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock2,592
APA-318-T-J
Samtec Inc.

ADAPTOR PLUG

Package: -

Stock6,462
ICA-324-STT
Samtec Inc.

DIP SOCKETS

Package: -

Stock2,448
ICA-308-SST-H
Samtec Inc.

CONN IC DIP SOCKET 8POS GOLD

Package: -

Stock6,588
ICO-314-SST
Samtec Inc.

CONN IC DIP SOCKET 14POS GOLD

Package: -

Stock6,678

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
ICF-628-T-O-TR	Samtec Inc.	SURFACE MOUNT DIP SOCKETS Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,524	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-316-T-A1	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,542	-	-	-	-	-	-	-	-	-	-	-	-	-	-
PLCC-032-T-N-TR	Samtec Inc.	CONN SOCKET PLCC 32POS TIN Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,200	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	-	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
PLCC-032-TM-N-TR	Samtec Inc.	CONN SOCKET PLCC 32POS TIN Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,046	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	-	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
ICF-318-T-O	Samtec Inc.	SURFACE MOUNT DIP SOCKETS Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,606	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICO-308-LGT	Samtec Inc.	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,136	8 (2 x 4)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
APA-320-T-J	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock4,608	-	-	-	-	-	-	-	-	-	-	-	-	-	-
PLCC-028-T-N-TR	Samtec Inc.	CONN SOCKET PLCC 28POS TIN Type: PLCC Number of Positions or Pins (Grid): 28 (4 x 7) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,388	28 (4 x 7)	0.050" (1.27mm)	Tin	-	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C
APA-308-T-P	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock3,042	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-308-G-J	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,534	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-308-T-B	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,754	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICO-314-CTT	Samtec Inc.	CONN IC DIP SOCKET 14POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock2,952	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
APA-314-T-A	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,646	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICO-316-SST	Samtec Inc.	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,068	16 (2 x 8)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICF-308-S-O-TR	Samtec Inc.	SURFACE MOUNT DIP SOCKETS Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,264	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-314-T-A1	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,592	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-318-T-J	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,462	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICA-324-STT	Samtec Inc.	DIP SOCKETS Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock2,448	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICA-308-SST-H	Samtec Inc.	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock6,588	8 (2 x 4)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
ICO-314-SST	Samtec Inc.	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock6,678	14 (2 x 7)	0.100" (2.54mm)	Gold	10µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
ICO-316-M-TT	Samtec Inc.	CONN IC DIP SOCKET 16POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock8,964	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
APA-308-T-N	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock8,658	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-308-T-D	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock5,670	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-316-T-J	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,714	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICO-316-LTT	Samtec Inc.	CONN IC DIP SOCKET 16POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,022	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
ICO-314-M-TT	Samtec Inc.	CONN IC DIP SOCKET 14POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock7,452	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
ICO-308-SGT	Samtec Inc.	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polyester, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,258	8 (2 x 4)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 125°C
APA-308-T-M	Samtec Inc.	ADAPTOR PLUG Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,848	-	-	-	-	-	-	-	-	-	-	-	-	-	-