|
|
TE Connectivity AMP Connectors |
CONN TRANSIST
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock4,842 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 8POS GOLD
- Type: Transistor, TO-5
- Number of Positions or Pins (Grid): 8 (Round)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polytetrafluoroethylene (PTFE)
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock3,636 |
|
8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
TE Connectivity AMP Connectors |
CONN TRANSIST
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock5,400 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN TRANSIST
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock8,730 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 22POS GOLD
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock4,248 |
|
22 (2 x 11) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock6,948 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Polyester | -55°C ~ 125°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock3,436 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
SOCKET ASSY
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock3,024 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 36POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 36 (2 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock5,112 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
TE Connectivity AMP Connectors |
SOCKET ASSY
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock7,362 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
SOCKET ASSY LGA1155, GF
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock7,578 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: -
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock8,874 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | - | Copper Alloy | - | -55°C ~ 125°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 42POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock5,148 |
|
42 (2 x 21) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS GOLD
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock5,148 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock2,448 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN SOCKET PQFP 100POS TIN-LEAD
- Type: QFP
- Number of Positions or Pins (Grid): 100 (4 x 25)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock6,336 |
|
100 (4 x 25) | 0.050" (1.27mm) | Tin-Lead | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS TINLEAD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: -
- Contact Material - Post: Copper Alloy
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock7,776 |
|
28 (2 x 14) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN SOCKET PGA ZIF 370POS GOLD
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 370 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30µin (0.76µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30µin (0.76µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock2,412 |
|
370 (19 x 19) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Copper Alloy | Liquid Crystal Polymer (LCP) | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock5,382 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS TINLEAD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock5,886 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Beryllium Copper | Polyester | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
- Type: Transistor, TO-5
- Number of Positions or Pins (Grid): 3 (Round)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock7,974 |
|
3 (Round) | - | Gold | - | - | - | - | Solder | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN TRANSIST
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock3,852 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock8,712 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: Polyester
- Operating Temperature: -55°C ~ 105°C
|
Package: - |
Stock8,172 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 25µin (0.63µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 25µin (0.63µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock4,230 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
TE Connectivity AMP Connectors |
CONN SOCKET PQFP 100POS TIN-LEAD
- Type: QFP
- Number of Positions or Pins (Grid): 100 (4 x 25)
- Pitch - Mating: 0.025" (0.64mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 200µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.025" (0.64mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -
|
Package: - |
Stock2,088 |
|
100 (4 x 25) | 0.025" (0.64mm) | Tin-Lead | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025" (0.64mm) | Tin-Lead | 200µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
TE Connectivity AMP Connectors |
OPEN FRAME DIP SOCKETS 40 WA
- Type: -
- Number of Positions or Pins (Grid): -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: -
- Mounting Type: -
- Features: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
|
Package: - |
Stock8,784 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS TIN
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 196.8µin (5.00µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 196.8µin (5.00µm)
- Contact Material - Post: Brass
- Housing Material: Thermoplastic, Polyester
- Operating Temperature: -55°C ~ 125°C
|
Package: - |
Stock7,704 |
|
32 (2 x 16) | 0.100" (2.54mm) | Tin | 196.8µin (5.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 196.8µin (5.00µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |