Page 7 - TE Connectivity AMP Connectors Products - Sockets for ICs, Transistors

516-AG10D-ESL
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Package: -

Stock7,632
2-640379-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock5,328
7-1437539-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS TIN

Package: -

Stock2,664
2-1571551-6
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Package: -

Stock5,940
1825575-2
TE Connectivity AMP Connectors

SOCKET ASSY

Package: -

Stock8,874
528-AG11D-ES
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock4,050
643653-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 21POS TIN

Package: -

Stock6,138
3-822516-6
TE Connectivity AMP Connectors

CONN SOCKET PLCC 84POS TIN

Package: -

Stock4,446
840-AG11D-ES
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock7,938
7-1437535-2
TE Connectivity AMP Connectors

510AG91D16ESL=SOCKET ASSY.

Package: -

Stock6,534
1-1825376-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock5,148
1-1825109-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Package: -

Stock3,436
382444-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 6POS TIN-LEAD

Package: -

Stock5,166
4-1571552-8
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Package: -

Stock4,770
5-1571551-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Package: -

Stock2,916
2-1571550-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 6POS GOLD

Package: -

Stock5,778
1814640-8
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS TIN

Package: -

Stock5,382
518-AG11D-ES
TE Connectivity AMP Connectors

SOCKET ASSY

Package: -

Stock6,246
516-AG11D-ESL
TE Connectivity AMP Connectors

SOCKET ASSY

Package: -

Stock4,896
345725-5
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 22POS TINLEAD

Package: -

Stock4,716

Part Number	Manufacturer	Description	Package	Stock	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
516-AG10D-ESL	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock7,632	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Copper Alloy	-	-55°C ~ 125°C
2-640379-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,328	40 (2 x 20)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
7-1437539-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock2,664	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
2-1571551-6	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,940	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Copper Alloy	Polyester	-55°C ~ 125°C
1825575-2	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock8,874	-	-	-	-	-	-	-	-	-	-	-	-	-	-
528-AG11D-ES	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock4,050	28 (2 x 14)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
643653-3	TE Connectivity AMP Connectors	CONN SOCKET SIP 21POS TIN Type: SIP Number of Positions or Pins (Grid): 21 (1 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock6,138	21 (1 x 21)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
3-822516-6	TE Connectivity AMP Connectors	CONN SOCKET PLCC 84POS TIN Type: PLCC Number of Positions or Pins (Grid): 84 (4 x 21) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic Operating Temperature: -	Package: -	Stock4,446	84 (4 x 21)	0.050" (1.27mm)	Tin	100µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100µin (2.54µm)	Phosphor Bronze	Thermoplastic	-
840-AG11D-ES	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 5µin (0.127µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock7,938	40 (2 x 20)	0.100" (2.54mm)	Gold	5µin (0.127µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
7-1437535-2	TE Connectivity AMP Connectors	510AG91D16ESL=SOCKET ASSY. Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,534	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-1825376-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,148	28 (2 x 14)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
1-1825109-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,436	28 (2 x 14)	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
382444-1	TE Connectivity AMP Connectors	CONN SOCKET SIP 6POS TIN-LEAD Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 150µin (3.81µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Press-Fit Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 150µin (3.81µm) Contact Material - Post: Phosphor Bronze Housing Material: Liquid Crystal Polymer (LCP) Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,166	6 (1 x 6)	0.100" (2.54mm)	Tin-Lead	150µin (3.81µm)	Phosphor Bronze	Through Hole	Closed Frame	Press-Fit	0.100" (2.54mm)	Tin-Lead	150µin (3.81µm)	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-55°C ~ 105°C
4-1571552-8	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20µin (0.51µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20µin (0.51µm) Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock4,770	24 (2 x 12)	0.100" (2.54mm)	Gold	20µin (0.51µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20µin (0.51µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
5-1571551-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Nickel Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock2,916	40 (2 x 20)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
2-1571550-1	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 6POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25µin (0.63µm) Contact Material - Post: Beryllium Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,778	6 (2 x 3)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25µin (0.63µm)	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
1814640-8	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 8POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Thermoplastic, Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock5,382	8 (2 x 4)	0.100" (2.54mm)	Tin	200µin (5.08µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200µin (5.08µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
518-AG11D-ES	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock6,246	-	-	-	-	-	-	-	-	-	-	-	-	-	-
516-AG11D-ESL	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock4,896	-	-	-	-	-	-	-	-	-	-	-	-	-	-
345725-5	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 22POS TINLEAD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock4,716	22 (2 x 11)	0.100" (2.54mm)	Tin-Lead	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	-	-	-
808-AG11D	TE Connectivity AMP Connectors	808-AG11D=SOCKET ASSEMBLY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	Package: -	Stock7,830	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2-1571551-4	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Nickel Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 125°C	Package: -	Stock3,546	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	Flash	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
1-1571552-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock3,078	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
643647-6	TE Connectivity AMP Connectors	CONN SOCKET SIP 15POS TIN Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 105°C	Package: -	Stock3,258	15 (1 x 15)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 105°C
1825375-3	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Phosphor Bronze Housing Material: Thermoplastic, Glass Filled Operating Temperature: -55°C ~ 125°C	Package: -	Stock4,356	40 (2 x 20)	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	15µin (0.38µm)	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 125°C
6-1437536-4	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: - Operating Temperature: -55°C ~ 125°C	Package: -	Stock8,946	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
3-1571552-4	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Copper Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,202	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
6-1437539-2	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 22POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 22 (2 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25µin (0.63µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	Package: -	Stock5,922	22 (2 x 11)	0.100" (2.54mm)	Gold	25µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C